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	<title>IEEE CPMT Finland Chapter</title>
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		<title>EPTC 2012</title>
		<link>http://ewh.ieee.org/r8/finland/cpmt/?p=551</link>
		<comments>http://ewh.ieee.org/r8/finland/cpmt/?p=551#comments</comments>
		<pubDate>Fri, 27 Apr 2012 09:24:51 +0000</pubDate>
		<dc:creator>admin</dc:creator>
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		<description><![CDATA[[ December 5, 2012 to December 7, 2012. December 5, 2012 to December 7, 2012. ] The 14th Electronics Packaging Technology Conference (EPTC 2012) is an International event organized by the IEEE Reliability/CPMT/ED Singapore Chapter and sponsored by IEEE CPMT Society.

EPTC 2012 will feature technical sessions, short courses/forums, an exhibition, social and networking activities. It aims to provide a good coverage of technological developments in all areas of electronic packaging from [...]]]></description>
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		<title>ESTC 2012</title>
		<link>http://ewh.ieee.org/r8/finland/cpmt/?p=529</link>
		<comments>http://ewh.ieee.org/r8/finland/cpmt/?p=529#comments</comments>
		<pubDate>Fri, 27 Apr 2012 09:16:16 +0000</pubDate>
		<dc:creator>admin</dc:creator>
				<category><![CDATA[Events]]></category>
		<category><![CDATA[News]]></category>

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		<description><![CDATA[[ September 17, 2012 to September 20, 2012. ] Organized by IEEE-CPMT since 2006, in association with  IMAPS-Europe, the Electronics System Integration Technology Conferences  (ESTC) conference series is the premier global European event that  brings together key researchers, innovators, decision-makers,  technologists, businesses, and professional associations working in  interconnect and packaging technologies for electronic system  integration in order to [...]]]></description>
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		<title>Lecture by John Lau on May 2nd 2011</title>
		<link>http://ewh.ieee.org/r8/finland/cpmt/?p=524</link>
		<comments>http://ewh.ieee.org/r8/finland/cpmt/?p=524#comments</comments>
		<pubDate>Mon, 18 Apr 2011 05:50:04 +0000</pubDate>
		<dc:creator>admin</dc:creator>
				<category><![CDATA[Events]]></category>

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		<description><![CDATA[[ May 2, 2011; 15:00 to 16:30. ] Dear friends,

John Lau, IEEE Fellow, ITRI, Taiwan, is on the way to visit Chalmers and give a lecture entitled: "Evolution, Challenge, and Outlook of Si/IC Integrations" on May 2, 15-16.30, Venue: Fasrummet, MC2, Chalmers. You are all very welcome.]]></description>
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		<title>ECTC 2011</title>
		<link>http://ewh.ieee.org/r8/finland/cpmt/?p=513</link>
		<comments>http://ewh.ieee.org/r8/finland/cpmt/?p=513#comments</comments>
		<pubDate>Thu, 03 Mar 2011 07:29:28 +0000</pubDate>
		<dc:creator>admin</dc:creator>
				<category><![CDATA[Events]]></category>

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		<description><![CDATA[[ May 31, 2011 to June 3, 2011. ] The premier international packaging, components, and microelectronics systems technology conference, the Electronic Components and Technology Conference (ECTC) strives to offer its attendees an outstanding array of packaging technology information. This year’s conference will have 39 technical sessions, 16 professional development courses, a panel discussion, a plenary session, a CPMT Seminar, and a technology corner for [...]]]></description>
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		<title>2011 Workshop on Accelerated Stress Testing &amp; Reliability</title>
		<link>http://ewh.ieee.org/r8/finland/cpmt/?p=501</link>
		<comments>http://ewh.ieee.org/r8/finland/cpmt/?p=501#comments</comments>
		<pubDate>Wed, 12 Jan 2011 06:57:12 +0000</pubDate>
		<dc:creator>admin</dc:creator>
				<category><![CDATA[Events]]></category>

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		<description><![CDATA[[ September 28, 2011 to September 30, 2011. ] ASTR 2011 will provide a forum for ASTR knowledge and share ideas that  address intra and inter industry endeavors to limit and eliminate field  failures of products. The focus will be on rapidly finding design  weaknesses, developing robust systems, and improving strategies to cost  effectively screen defects and weaknesses in electronic [...]]]></description>
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		<title>IEEE CPMT 2010 Autumn Seminar on</title>
		<link>http://ewh.ieee.org/r8/finland/cpmt/?p=462</link>
		<comments>http://ewh.ieee.org/r8/finland/cpmt/?p=462#comments</comments>
		<pubDate>Fri, 19 Nov 2010 14:56:05 +0000</pubDate>
		<dc:creator>admin</dc:creator>
				<category><![CDATA[Events]]></category>
		<category><![CDATA[News]]></category>

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		<description><![CDATA[[ December 8, 2010; 14:00 to 17:15. ] Current Topics on Board Level Reliability of Electronics
Date: December the 8th, 2010
Time: 14:00 - 17:40
Place: Aalto University School of Science and Technology, Otakaari 7A,  Seminar room 432

1400 Opening of the seminar

1401 "The Right Solder Paste for your Process"
Emmanuelle Guene - Inventec Performance Chemicals 

1425 "Solder Paste Residue Corrosivity Assessments"
Emmanuelle Guene - Inventec Performance Chemicals

1450 [...]]]></description>
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		<item>
		<title>IEEE CPMT 2010 Spring Seminar on</title>
		<link>http://ewh.ieee.org/r8/finland/cpmt/?p=421</link>
		<comments>http://ewh.ieee.org/r8/finland/cpmt/?p=421#comments</comments>
		<pubDate>Mon, 24 May 2010 10:17:13 +0000</pubDate>
		<dc:creator>admin</dc:creator>
				<category><![CDATA[Events]]></category>
		<category><![CDATA[News]]></category>

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		<description><![CDATA[[ June 17, 2010; 13:00 to 17:00. ] PRINTABLE ELECTRONICS
– State of the art and commercialization
Date: June the 17th, 2010
Time: 13:00 - 17:00
Place: Aalto University School of Science and Technology, Otakaari 7A, Seminar room 432

Preliminary  Program:

1300 Tilaisuuden avaus

1301 ”Printed intelligence research at VTT”
Arto Maaninen (VTT)

1330 "Inkjet in electronics manufacturing – direct chip attachment"
Matti Mäntysalo (TUT)

1400 ”Printed organic devices and nanoimprint lithography”
Tapio Mäkelä [...]]]></description>
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		<title>Chapter Board Meeting 7.4.2010</title>
		<link>http://ewh.ieee.org/r8/finland/cpmt/?p=407</link>
		<comments>http://ewh.ieee.org/r8/finland/cpmt/?p=407#comments</comments>
		<pubDate>Wed, 24 Mar 2010 09:50:05 +0000</pubDate>
		<dc:creator>admin</dc:creator>
				<category><![CDATA[Events]]></category>
		<category><![CDATA[News]]></category>

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		<description><![CDATA[[ April 7, 2010; 14:00 to 16:00. ] Date: April the 7th, 2010
Time: 14:00 - 16:00
Place: Aalto University School of Science and Technology, Otakaari 7, meeting room  Maxwell]]></description>
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		<slash:comments>0</slash:comments>
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		<item>
		<title>ESTC 2010</title>
		<link>http://ewh.ieee.org/r8/finland/cpmt/?p=401</link>
		<comments>http://ewh.ieee.org/r8/finland/cpmt/?p=401#comments</comments>
		<pubDate>Thu, 28 Jan 2010 10:27:34 +0000</pubDate>
		<dc:creator>admin</dc:creator>
				<category><![CDATA[Events]]></category>

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		<description><![CDATA[[ September 13, 2010 to September 16, 2010. ] Organized by IEEE-CPMT since 2006, the Electronics System Integration Technology Conferences ESTC conference series is the premier venue for academics and industry to present and discuss the latest developments in assembly and interconnection technology and new applications.

Just like its highly successful predecessor events in Dresden (2006) and Greenwich (2008) ESTC 2010 will again feature a [...]]]></description>
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		<item>
		<title>CPMT Finland Autumn Seminar 12.11.09</title>
		<link>http://ewh.ieee.org/r8/finland/cpmt/?p=364</link>
		<comments>http://ewh.ieee.org/r8/finland/cpmt/?p=364#comments</comments>
		<pubDate>Fri, 16 Oct 2009 09:10:00 +0000</pubDate>
		<dc:creator>admin</dc:creator>
				<category><![CDATA[Events]]></category>
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		<description><![CDATA[[ November 12, 2009; 13:00 to 17:00. ] Date: November the 12th, 2009
Time: 13:00 - 17:00
Place: Helsinki University of Technology, Otakaari 7

Preliminary Program:

1300 Tilaisuuden avaus

1305 ”MEMS vuonna 2010”
Prof. Hannu Kattelus (VTT)

1335 "MEMS-pohjaisen kiihtyvyysanturin miniatyrisointi"
Sami Nurmi (VTI Technologies)

1405 ”MEMS-pohjaisten anturien valmistukseen liittyvät haasteet”
Tomi Salo (Vaisala)

 1430 Kahvitauko

1500 ”Kosteusanturit ja niiden vaatimukset rakennussovelluksissa”
Fahim Al-Neshawy (TKK)

1530 ”Anturisovellukset urheilussa”
Heikki Nieminen (Suunto)

1600 "Anturisovelluksia mobiililaitteissa"
Terhi Rautiainen (Nokia)

1630 Keskustelua

1700 Tilaisuuden päätös

Pyydämme kaikkia [...]]]></description>
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