IEEE CPMT 2010 Autumn Seminar on
Current Topics on Board Level Reliability of Electronics
Date: December the 8th, 2010
Time: 14:00 – 17:40
Place: Aalto University School of Science and Technology, Otakaari 7A, Seminar room 432
1400 Opening of the seminar
1401 “The Right Solder Paste for your Process”
Emmanuelle Guene – Inventec Performance Chemicals
1425 “Solder Paste Residue Corrosivity Assessments”
Emmanuelle Guene – Inventec Performance Chemicals
1450 “Optimization of the Surface Mount Process for Better Reliability”
Jussi Hokka – Aalto University
1515 “Formation of Microstructures in SnAgCu Solder Interconnections”
Vesa Vuorinen – Aalto University
1540 Coffee break
1600 “Effects of Alloying Elements on the IMC layers – Case of Cu and Ni”
Vesa Vuorinen – Aalto University
1625 “An Overview of Failure Mechanisms under Different Loading Conditions”
Toni Mattila – Aalto University
1650 “An introduction to Bond Testing”
Aubert Dupont - XYZTEC
1715 “Current and possible Future Methods for Solder Bond Testing”
Aubert Dupont - XYZTEC
1740 Closing of the seminar
