IEEE CPMT Finland Chapter

The 14^th Electronics Packaging Technology Conference (EPTC 2012) is an International event organized by the IEEE Reliability/CPMT/ED Singapore Chapter and sponsored by IEEE CPMT Society.

EPTC 2012 will feature technical sessions, short courses/forums, an exhibition, social and networking activities. It aims to provide a good coverage of technological developments in all areas of electronic packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts in the field.

Since its inauguration in 1997, EPTC has developed into a highly reputed electronics packaging conference in Asia and is well attended by experts in all aspects related to packaging technology from all over the world.

Looking forward to your participation in the 14^th EPTC to be held from 5 to 7 Dec 2012, Resorts World Sentosa, Singapore.

Organized by IEEE-CPMT since 2006, in association with IMAPS-Europe, the Electronics System Integration Technology Conferences (ESTC) conference series is the premier global European event that brings together key researchers, innovators, decision-makers, technologists, businesses, and professional associations working in interconnect and packaging technologies for electronic system integration in order to present, demonstrate, and discuss the latest developments in assembly and interconnection technology and new innovative applications.

Just like its highly successful predecessor events in Dresden (2006), Greenwich (2008) and Berlin (2010), ESTC 2012 will again feature a powerful technical program, as well as professional short courses on various microelectronic packaging technologies. The concurrent exhibition will facilitate the presentation of state-of-the-art technological services and equipment to an interested audience of international decision-makers from science and industry.

The ESTC 2012 Conference will take place at the RAI Conference and Exhibition Centre of Amsterdam, The Netherlands, 17-20 September 2012.

Dear friends,

John Lau, IEEE Fellow, ITRI, Taiwan, is on the way to visit Chalmers and give a lecture entitled: “Evolution, Challenge, and Outlook of Si/IC Integrations” on May 2, 15-16.30, Venue: Fasrummet, MC2, Chalmers. You are all very welcome.

The premier international packaging, components, and microelectronics systems technology conference, the Electronic Components and Technology Conference (ECTC) strives to offer its attendees an outstanding array of packaging technology information. This year’s conference will have 39 technical sessions, 16 professional development courses, a panel discussion, a plenary session, a CPMT Seminar, and a technology corner for exhibitors. The 61st ECTC will be held at the Walt Disney World Swan and Dolphin Resort, Lake Buena Vista, Florida, USA from May 31 – June 3, 2011.

ASTR 2011 will provide a forum for ASTR knowledge and share ideas that address intra and inter industry endeavors to limit and eliminate field failures of products. The focus will be on rapidly finding design weaknesses, developing robust systems, and improving strategies to cost effectively screen defects and weaknesses in electronic and electro-mechanical hardware and structural systems while reconciling twin needs of obtaining high product quality and reliability with that of low product development and manufacturing costs and timely introduction of new products to market.

2011 ASTR Workshop will be an international event: members of the organizing committee came from all over the world. We expect that about 250 reliability engineers will participate in the 2011 event. Important deadlines are: abstract submission: March 15, 2011; final presentation (full-length paper) submission in electronic format: August 15, 2011.

The event will be held at the Hyatt at Fisherman’s Wharf, San Francisco, CA, USA from September 28 – 30, 2011.

See you in San-Francisco in September 2011!

Current Topics on Board Level Reliability of Electronics

Date: December the 8th, 2010
Time: 14:00 – 17:40
Place: Aalto University School of Science and Technology, Otakaari 7A, Seminar room 432

1400 Opening of the seminar

1401 “The Right Solder Paste for your Process”
Emmanuelle Guene – Inventec Performance Chemicals

1425 “Solder Paste Residue Corrosivity Assessments”
Emmanuelle Guene – Inventec Performance Chemicals

1450 “Optimization of the Surface Mount Process for Better Reliability”
Jussi Hokka – Aalto University

1515 “Formation of Microstructures in SnAgCu Solder Interconnections”
Vesa Vuorinen – Aalto University

1540 Coffee break

1600 “Effects of Alloying Elements on the IMC layers – Case of Cu and Ni”
Vesa Vuorinen – Aalto University

1625 “An Overview of Failure Mechanisms under Different Loading Conditions”
Toni Mattila – Aalto University

1650 “An introduction to Bond Testing”
Aubert Dupont - XYZTEC

1715 “Current and possible Future Methods for Solder Bond Testing”
Aubert Dupont - XYZTEC

1740 Closing of the seminar

PRINTABLE ELECTRONICS
– State of the art and commercialization

Date: June the 17th, 2010
Time: 13:00 – 17:00
Place: Aalto University School of Science and Technology, Otakaari 7A, Seminar room 432

Preliminary Program:

1300 Tilaisuuden avaus

1301 ”Printed intelligence research at VTT”
Arto Maaninen (VTT)

1330 “Inkjet in electronics manufacturing – direct chip attachment“
Matti Mäntysalo (TUT)

1400 ”Printed organic devices and nanoimprint lithography”
Tapio Mäkelä (VTT / Åbo Akademi University, Funmat)

1430 ”Printed electronics for high frequency applications”
Jussi Putaala (University of Oulu)

1500 Kahvitauko

1530 ”Lumedy – New life of light”
Jukka Hast (Lumedy / VTT)

1600 “Enabling low cost and green electronics by printed battery“
Marko Hanhikorpi (Enfucell)

1630 “Intelligent packaging applications and printed electronics“
Juha Maijala (StoraEnso)

1700 Tilaisuuden päätös

Pyydämme kaikkia osallstujia rekisteröitymään seminaariin lähettämällä viestin osoitteeseen toni.t.mattila(at)ieee.org.

Date: April the 7th, 2010
Time: 14:00 – 16:00
Place: Aalto University School of Science and Technology, Otakaari 7, meeting room Maxwell

Organized by IEEE-CPMT since 2006, the Electronics System Integration Technology Conferences ESTC conference series is the premier venue for academics and industry to present and discuss the latest developments in assembly and interconnection technology and new applications.

Just like its highly successful predecessor events in Dresden (2006) and Greenwich (2008) ESTC 2010 will again feature a powerful technical program, as well as professional short courses on modern technologies. The concurrent exhibition will facilitate the presentation of state-of-the-art technological services and equipment to an interested audience of international decision-makers from science and industry.

Date: November the 12th, 2009
Time: 13:00 – 17:00
Place: Helsinki University of Technology, Otakaari 7

Read the rest of this entry »