IEEE / CPMT Finland Chapter

Date: November the 12th, 2009
Time: 13:00 – 17:00
Place: Helsinki University of Technology, Otakaari 7

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The premier international packaging, components, and microelectronics systems technology conference, the Electronic Components and Technology Conference (ECTC) strives to offer its attendees an outstanding array of packaging technology information. This year’s conference will have 39 technical sessions, 16 professional development courses, a panel discussion, a plenary session, a CPMT Seminar, and a technology corner for exhibitors. The 60th ECTC will be held at the Paris Las Vegas Hotel, Las Vegas, Nevada, USA from June 1-June 4, 2010.

Date: September the 4th, 2009
Time: 15:00 – 17:00
Place: Helsinki University of Technology, Otakaari 7, meeting room Maxwell

IEEE Components, Packaging and Manufacturing Technology society welcomes you to a seminar with a focus on electronics packaging and reliability. The guest speakers of the seminar are Prof. Dr. Ephraim Suhir (Univ. of California) and Prof. James E. Morris (Portland State Univ.)

Dr. Suhir is a Distinguished Member of Technical Staff (ret) of Bell Labs and a Professor at the University of California, Santa Cruz, CA. He is Distinguished Lecturer of the IEEE CPMT Society. His main field of expertise is in the Structural Analysis of Microelectronic and Photonic Systems. See full bio.

Dr. Morris James E. Morris is a Professor of Electrical & Computer Engineering at Portland State University, Professor Emeritus at the State University of New York at Binghamton, and an IEEE Fellow.  He is also an IEEE-CPMT Distinguished Lecturer and the CPMT Society representative on the IEEE Nanotechnology Council.

The seminar will be held on Tuesday the 21st of April and will begin at 9:00. The seminar will be held at the Helsinki University of Technology (Otakaari 7A, seminar room Edison). We would kindly ask all those who are interested in joining the event to register by the 14^th of April . The seminar is free of charge.

AGENDA:

 9:30 Opening of the event

9:35 “Nanopackaging: Nanotechnologies and Electronics Packaging”, Prof. James E. Morris

10:30 “Predictive Modeling of the Dynamic Response of Electronic Structures to Shocks and Vibrations – Part I”, Prof. Ephraim Suhir

11:30 Lunch break (own cost)

12:15 “Predictive Modeling of the Dynamic Response of Electronic Structures to Shocks and Vibrations – Part II”, Prof. Ephraim Suhir

14:00 Coffee break

14:15 “Predictive Modeling of the Dynamic Response of Electronic Structures to Shocks and Vibrations – Part III” Prof. Ephraim Suhir

16:00 Discussion

16:30 End of the seminar

Date: March the 4th, 2009
Time: 14:00 – 16:00
Place: Helsinki University of Technology, Otakaari 7, meeting room Maxwell

Workshop on Thermal transport in Electronics and MEMS

Thermal transport is becoming a bottleneck for increased performance in future electronics and MEMS products. Sponsored by Swedish Foundation for Strategic Research (SSF) ProViking program, Swedish National Science Foundation, EU FP7 IP Program on ”Nanopack” and IEEE CPMT Nordic chapter, we organize the following workshop with invited speakers from various parts of the world to present their views on critical issues in thermal transport for electronics and MEMS products.

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The premier international packaging, components, and microelectronic systems technology conference, the Electronic Components and Technology Conference (ECTC) strives to offer its attendees an outstanding array of packaging technology information. This year’s conference will have 39 technical sessions, 16 professional development courses, a panel discussion, a plenary session, a CPMT Seminar, and a technology corner with over 70 exhibitors. The 59th ECTC will be held at Sheraton San Diego Hotel & Marina, San Diego, CA, USA from May 26 to May 29, 2009.

The European Microelectronics and Packaging Conference & Exhibition, EMPC 2009, will be held in Rimini, Italy on June 15-18, 2009. The EMPC addresses “everything in electronics between the chip and the system”.

IEEE/CPMT Finland chapter organized an autumn seminar on Thursday the 20th of November, 2008. The seminar was kindly hosted by Imbera Electronics Oy.

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The web pages hosted by the Finnish Chapter of IEEE Components, Packaging and Manufacturing Technologies (CPMT) society has been published!