17th IEEE INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS - IPFA 2010
Suntec Singapore, International Convention & Exhibition Centre, Singapore
05-09, July, 2010

Welcome to IPFA 2010!

The 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2010) is organized by the IEEE Reliability/CPMT/ED Singapore Chapter. The Symposium is technically co-sponsored by the IEEE Electron Device Society, IEEE Reliability Society and supported by Singapore Exhibition and Convention Bureau.

IPFA 2010 will be devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability and yield, especially those related to advanced process technologies.

In a paper exchange arrangement with ESREF and ISTFA, the Best Papers from ESREF 2009 and ISTFA 2009 will be presented at IPFA 2010, while the best oral papers in reliability and failure analysis from IPFA 2010 will be presented at the corresponding conferences.

The best papers from Failure analysis and Reliability disciplines, respectively, in IPFA2009 are:

An Advanced Reliability Improvement and Failure Analysis Approach to Thermal Stress Issues in IC Packages” by M. Hertl, D. Weidmann and A. Ngai

Can a MOSFET Survive From Multiple Breakdowns?” by X. Li, C.H. Tung and K.L. Pey

We look forward to your continued support in IPFA 2010.
 

For more information, please contact:
IPFA secretariat in Singapore:
Mrs Jasmine Leong
Email:ipfa@pacific.net.sg