IPFA 2008 Technical Program Steering Committee (TPSC) Members

Novel Gate Stack/Dielectrics and FEOL Reliablity and Failure Mechanisms
Guido Groeseneken, IMEC, Belgium
KL Pey, NTU, Singapore
Jim Stathis, IBM Research, USA
M. Ashraf Alam, Purdue, USA
DS Ang, NTU, Singapore
C K Maiti, IIT, India
Mingxiang Wang, Soochow University, China

Advanced Interconnects and BEOL Reliability and Failure Mechanisms
Jeffrey Gambino, IBM, USA
Gan Chee Lip, NTU, Singapore
Zsolt Tokei, IMEC, Belgium
Christine Hau-Riege, AMD, USA
Ehrenfried Zschech, AMD, Germany
Michael Chang, BASF, Singapore

Novel Device Reliability and Failure Mechanisms
Tao GuoQiao, Philips, Netherlands
M Natarajan, Chartered, Singapore
John Thong, NUS, Singapore
Steve Chung, NCTU, Taiwan 
Tao GuoQiao, Philips, Netherlands
Ingrid DeWolf, IMEC, Belgium
Vincent Lee, IME, Singapore
Susan Li, Spansion
Robert Mertens, KU Leuven, Belgium
Vince Barias, SunPower Philippines Manufacturing

Die/Package-Level Failure Analysis Case Study and Failure Mechanisms
Andre Touboul, Uni of Bordeaux, France
Alastair Trigg. IME, Singapore
Sim Kian Sin, Intel, Malaysia
Young-Chang Joo, Seoul National U, Korea
Young-Bae Park, Andong National University, Korea
T F Lam, Spansion, China
Howard TH Tang, UMC, Taiwan
Yusihiro Fukuda, Oki, Japan
Dr. Alex Mendenilla, NXP Philippines
Tee Tong Yan, Amkor, Singapore

Advanced Reliability Evaluation and Approaches
Tony Oates, TSMC, Taiwan
Lim Yeow Kheng, Chartered, Singapore
Prasad Chaparala, NS, USA
JK Wang, Broadcom, USA
Tan Kok Tong, CentiForce, Singapore

Advanced Failure Analysis Techniques
Christian Boit, Tech Univ Berlin, Germany
JM Chin, AMD, Singapore
Ludwig Balk, U Wuppertal, Germany
Phillippe Perdu, CNES, France
Mike Bruce, AMD, USA
Alan Street, Qualcomm, USA
Hugo Bender, IMEC, Belgium
Prof Zeng Wei, Fudan Univ, China
Prof Li Yuesheng, Fudan Univ, China
Eddie Er, Chartered, Singapore
Lim Soon, SSMC, Singapore

Sample Preparation, Metrology and Material Characterization
MK Radhakrishnan, NanoRel, India
Tung Chih Hang, IME, Singapore
Alan Craven, Univ Glasgow, UK
Sam Subramanian, Freescale, USA
Hans Juergen Engelmann, AMD
Prof Wu Xiao-Jing, Fudan Univ, China
Y.F. Hsieh, MA Tech, Taiwan
David Su, TSMC, Taiwan
Tang Leijun, IME, Singapore