TUTORIAL T2: FAILURE ANALYSIS OVERVIEW

Speaker: Dr. Susan Li

Biography of Speaker:

Susan Li is the Global Device Analysis Lab manager and Sr. Member of Technical Staff at Spansion, headquartered at Sunnyvale, California. Her main responsibility is to supervise Spansion world-wide device analysis operations and lead tool/techniques development for failure analysis at 6 DA lab sites located at Penang and Kuala Lumpur, Malaysia; Suzhou, China; Bangkok, Thailand; Aizu, Japan; and Sunnyvale, USA. During 17 years with AMD/Spansion, she worked on multiple different products including networking, wireless, microprocessor devices and recently the Flash memory devices. Her main focus is to support design teams, product lines and manufacturing
groups for analyzing customer returns, debugging new products and performing failure analysis on existing products for quality and yield improvement.
Before she joined AMD in 1992, she earned a Master Degree in Materials Science and Metallurgy from Carnegie Mellon University, Pittsburgh, Pennsylvania, and a B.S.E.E. Degree in Electrical Engineering from Li; Spansion, USA Peking University, China. She has published 19 papers at international conferences and currently has 20 granted US patents.

Profession Affiliation:
Elected Board Member of Electronic Device Failure Analysis Society (EDFAS) for 2008 – 2012. Elected Chair for SEMATECH IC Failure
Analysis Council in 2008. ISTFA Tutorial Committee Member and Session Chair in 2002-2008; Invited Speaker on Multiple Chip Scale Packages Tutorial at International Symposium of Testing and Failures Analysis Conference (ISTFA) from 2002 –2008.