TUTORIAL T4: MATERIAL SCIENCE AND ITS APPLICATIONS IN PACKAGE FA

Speaker: Dr. Tim Fai Lam; Spansion, China

Biography of Speaker:

Dr. Lam Tim Fai was born in Hong Kong in 1939. He gained his B.Eng and Ph.D. from the Beijing University of Science and Technology (Formerly Beijing University of Iron and Steel Technology), majoring in metallic physics and material science. From 1964 to 1989, he worked in the Shanghai Iron and Steel Research Institute in the fields of metal and alloy research and characterisation. During the 24 years there, he developed from an engineer to a deputy director of the research and test center of the institute.He joined Advanced Micro Devices Ltd (Singapore) in 1990 and has been working there as a Senior Failure Analysis Engineer, Principal Engineer, Member of Technical Staff and Senior Member of Technical Staff. His experience and knowledge in physics and material science enable him to solve a lot of key problems in IC packaging. Since 1994, his interest also included Finite Elements Analysis (FEA),one of a powerful tool in IC design and manufacturing. He built more than 700 FEA models to solve the problems raised from the AMD worldwide sites and published more than 100 internal formal reports in FEA, some of them were presented at international conferences and publications. He has been invited to give lectures or conduct workshops in AMD –SPASION worldwide sites and universities and education organizations in USA, Singapore, Thailand, Philippine and China, etc on the following topics:
1. “Material science and failure analysis in IC manufacturing”
2. “FEA Principals and its application in IC-Packaging” and
3. “SEM and EDX principals and applications”

He retired from AMD ( Singapore) in the end of 2002. Now he is working at SPANSION (China) Limited , Suzhou, as a Technical Consultant.