16th IEEE INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA2009)

Dushu Lake Higher Education Town, Suzhou, China
06-10 July, 2009

Welcome to IPFA 2009! Welcome to Suzhou, China!

The 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2009) is organized by the IEEE Reliability/CPMT/ED Singapore Chapter in cooperation with IEEE Nanjing Section in China. The Symposium is technically co-sponsored by the IEEE Electron Device Society, IEEE Reliability Society.

IPFA 2009 will be devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability and yield, especially those related to advanced process technologies.

IPFA Proceedings are indexed by EI (Classification Code 002346) and included in IEEE Xplore digital library.

In a paper exchange arrangement with ESREF and ISTFA, the Best Papers from ESREF 2008 and ISTFA 2008 will be presented at IPFA 2009, while the best oral papers in reliability and failure analysis from IPFA 2009 will be presented at the corresponding conferences.

We look forward to your continued support in IPFA 2009.

IPFA 2009 Organizing Committee

General Chair:
    Xianzhong Song; Suntech Power Co., Ltd, China
    email: xzsong@suntech-power.com

General Co- Chair:
    Gan Chee Lip; Nanyang Technological University, Singapore
    email: clgan@ntu.edu.sg

Technical Programme Chair:
    Tim Fai Lam; Spansion, China
    email: lamtflin@yahoo.com

Technical Programme Co-Chair:
    JM Chin; Advanced Micro Devices. Singapore
    email: JM.Chin@amd.com

    MingXiang Wang; Soochow University, China
    email: Mingxiang_Wang@suda.edu.cn

IPFA Board Chair:
    John Thong; National University of Singapore, Singapore
    email: john_thong@nus.edu.sg