This page is being redirected to IEEE IPFA 2013 website...


IEEE IPFA Web Site
an image

Menu

Technically Co-sponsored:

an image
an image

Supported by:

an image

Platinum Sponsor:

an image

Gold Sponsor:

an image

Silver Sponsor:

an image

 

IPFA 2012 REGISTRATION INFORMATION

The IPFA 2012 online registration system is open from 20 March 2012 to 29 June 2012. For registration after 29 June 2012, please contact the IPFA Secretariat: ipfa@pacific.net.sg. Only online registration will be accepted.

For 5 or more registrations (tutorials and symposium counted separately) from the same organisation, there will be a 10% discount. Please do the online registration and send an email with the excel file of the registration details to the IPFA Secretariat: ipfa@pacific.net.sg

To register, please go to this link: http://www.ipfa.net/web/IPFAReg

 

Registration fee for Symposium

Includes luncheons and tea breaks for 4 to 6 July 2012, one banquet ticket and one set of conference booklet and CD-ROM

 

On or before

7 May 2012

After 7 May

2012

On or after

18 June 2012

IEEE Member

S$680

S$720

S$800

Non-member

S$850

S$900

S$1000

Student (fulltime only)

S$425

S$450

S$500



 

Registration fee for Tutorials

For each full day (1 combination = 2 topics) session - includes one luncheon, two tea breaks and one set of tutorial notes

 

On or before

7 May 2012

After 7 May

2012

On or after

18 June 2012

IEEE Member

S$340

S$360

S$400

Non-member

S$425

S$450

S$500

Student (fulltime only)

S$210

S$225

S$250


IPFA 2012 �TUTORIAL SESSIONS

DATE / TIME 2 July 2012 (Monday)
MORNING (8:30 am - 12:00 noon)

T1: Reliability Issues for Copper Interconnects and Low-k Dielectrics

Prof. Chee Lip GAN, Nanyang Technological University, Singapore

AFTERNOON (1:30 pm - 5:00 pm)

T2: TSV-Integration and 3D-Stacking: Reliability Challenges, Thermal Management Problems and CPI

Dr. Kristof CROES, IMEC, Belgium



DATE / TIME 3 July 2012 (Tuesday) - two parallel sessions
MORNING (8:30 am - 12:00 noon)

T3: Gate Stack Reliability: Towards Microscopic Description

Dr. Gennadi BERSUKER, SEMA Tech, USA

T4: Fault Isolation Techniques for Package and Die Level Failure Analysis

Dr. Dave VALLETT, IBM, USA

AFTERNOON (1:30 pm - 5:00 pm)

T5: Electrostatic Discharge (ESD) Protection Solutions of BiCMOS/CMOS Integrated Circuits

Prof. Juin J. LIOU, University of Central Florida, USA

T6: An Introduction to EDS and EBSD for Microelectronics Applications

Dr. Stuart WRIGHT, EDAX, USA



TUTORIAL COMBINATIONS:

* T1+T2    * T3+T5    * T3+T6    * T4+T5    * T4+T6

©Copyright 2011 IPFA/IEEE. All Rights Reserved