IPFA 2012
Marina Bay Sands Singapore
2 - 6 July 2012

PLATINUM SPONSOR

FEI COMPANY OF USA (S.E.A.) PTE LTD       Booth No: A08
1 Jalan Kilang Timor
#04-02 Pacific Tech Centre
Singapore 159303
Tel: (65) 6272 0050
Fax: (65) 6272 0034
Website: www.fei.com
Contact: Mr. Paul Lawrence – Business Development Manager (Electronics Business Unit – Asia)
Email: Paul.Lawrence@fei.com

Solve challenging yield issues with FEI solutions for extreme high resolution imaging and analysis. FEI helps you get your designs right, get to market first, and up to full production fast. Keep pace with shrinking nodes using our defect analysis, materials characterization, metrology and device edit solutions. Inspect for and analyze defects/failures with multiple image views: top down, cross-sectional (subsurface), and 3D volume. Collect compositional data to identify particles or track excursion origins. Study materials for next generation devices. Edit prototype devices. Visit us to learn how FEI will help you reduce costs and increase profitability.

GOLD SPONSOR

DIGIT CONCEPT       Booth No: A16 & A17
ASIA AMERICAS EUROPA
Taiwan California France
Website: www.digit-concept.com
Tel: (33) 231 354 354
Fax: (33) 231 354 355
Email: info@digit-concept.com

Contacts on the booth :
     Jackie YANG, Asia Director in Taiwan
     Michael OBEIN, Technical Support Manager, Vice-President
     Frederic BEAUQUIS, Application Engineer, Team Leader
     Dr Matthew LEFEVRE, Application Engineer
     Francois KERISIT, Application Engineer

DIGIT CONCEPT supplies since 20 years not only equipments for Failure Analysis on semiconductors but also new techniques and technical improvements for the existing FA techniques.

We have acquired a position of worldwide leader on the market of LASER IC Decapsulation with the SESAME1000 and the NEW SESAME500. This equipment allows decapsulation improvements in making a pre-opening by LASER ablation which also allows to strongly reduce the acid consumption. It is then possible to decapsulate easily all types of IC packages and it is compatible with Cu wires.

A plasma option can be integrated turning it into a SESAME2000 about which we have deposited with the CNES (Space Agency) a Worldwide Patent.

NEW Sesame777Cu : New release of CHEMICAL Decap Equipment : +10°C to 250°C for Cu wires and all types of package.

In Europe, DIGIT CONCEPT also distributes exclusively the following : BsetEQ (Plasma equipments), FAInstruments (Inspection and Thermal Analysis equipments), MultiProbe (Atomic Force Probe), Ultra Tec USA (Sample preparation equipments), and consumables for FA.

So we have the knowledge not only for Decap but for all the FA flow. Hope to see you on our booth and have a time for a complete demonstration of our Sesame Range. Of course you are also welcome in our 5 Worldwide Expertise Centers.

SILVER SPONSOR

DCG SYSTEMS, INC.       Booth No: A14
45900 Northport Loop East
Fremont, California 94538
USA
Website: www.dcgsystems.com
Contact: Nicole Berens - Marketing Communications
Tel: 1 510 897-6526
Fax: 1 510 897-6801
Email: Nicole_berens@dcgsystems.com

DCG Systems delivers the best innovative technology to maximize finding the invisible defect. With this unmatched technology, DCG is revolutionizing the FA, yield, debug and characterization solutions for the semiconductor industry. With operations in the U.S., Japan, Taiwan, Korea, Malaysia, Singapore, Israel and Germany, DCG delivers competitive cost and performance advantages to IDMs, wafer foundries and fabless chip companies worldwide. www.dcgsystems.com.