IPFA 2012
Marina Bay Sands Singapore
2 - 6 July 2012

IPFA 2012 will be devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability and yield, especially those related to advanced process technologies. The technical sessions include, but are not limited to, the following areas:

* SAMPLE PREPARATION, METROLOGY AND MATERIAL CHARACTERIZATION
* ADVANCED FAILURE ANALYSIS TECHNIQUES
* PRODUCT RELIABILITY EVALUATION AND APPROACHES
* NOVEL GATE STACK/DIELECTRICS AND FEOL RELIABILITY AND FAILURE MECHANISMS
* DIE-LEVEL/PACKAGE-LEVEL FAILURE ANALYSIS CASE STUDY, RELIABILITY AND FAILURE MECHANISMS
* PHOTOVOLTAICS & NOVEL DEVICE RELIABILITY AND FAILURE MECHANISMS
* ADVANCED INTERCONNECTS AND BEOL RELIABILITY AND FAILURE MECHANISMS

Please Click here to obtain full Information on technical program.

TECHNICAL SESSION OVERVIEW: 3-DAY SYMPOSIUM (4 TO 6 JULY 2012)

4 JULY 2012 (WEDNESDAY)	5 JULY 2012 (THURSDAY)	6 JULY 2012 (FRIDAY)
8:30am to 10:15am Session 1: OPENING CEREMONY Keynote Address Exchange Papers	8:30am to 10:30am Session 5: ADVANCED INTERCONNECTS & BEOL RELIABILITY & FAILURE MECHANISMS AND PRODUCT RELIABILIY EVALUATION AND APPROACHES	8:30am to 10:15am Session 10: DIE/PACKAGE-LEVEL FAILURE ANALYSIS CASE STUDY AND FAILURE MECHANISMS III
TEA BREAK: 10:15am	TEA BREAK: 10:30am	TEA BREAK: 10:15am
10:45am to 12:10pm Session 2: DIE/PACKAGE-LEVEL FAILURE ANALYSIS CASE STUDY AND FAILURE MECHANISMS I	11:00am to 12:10pm Session 6: SAMPLE PREPARATION, METROLOGY AND MATERIAL CHARACTERIZATION I	10:45am to 12:10pm Session 11: ADVANCED FAILURE ANALYSIS TECHNIQUES II
LUNCH: 12:10pm	12:10pm to 2:00pm Session 7: POSTER SESSION /LUNCHEON /"ART OF FA" PHOTO CONTEST	LUNCH: 12:10pm
1:35pm to 3:00pm Session 3: ADVANCED FAILURE ANALYSIS TECHNIQUES I	2:00pm to 3:00pm Session 8: SAMPLE PREPARATION, METROLOGY AND MATERIAL CHARACTERIZATION II	1:35pm to 3:00pm Session 12: DIE/PACKAGE-LEVEL FAILURE ANALYSIS CASE STUDY AND FAILURE MECHANISMS IV
TEA BREAK: 3:00pm	TEA BREAK: 3:00pm	TEA BREAK: 3:00pm
3:30pm to 5:10pm Session 4: NOVEL GATE STACK/DIELECTRICS AND FEOL RELIABLITY AND FAILURE MECHANISMS	3:30pm to 4:40pm Session 9: DIE/PACKAGE-LEVEL FAILURE ANALYSIS CASE STUDY AND FAILURE MECHANISMS II	3:30pm to 4:40pm Session 13: NOVEL DEVICE RELIABILITY AND FAILURE MECHANISMS
	- CONFERENCE BANQUET - RIVER CRUISE CUM BBQ DINNER AT GRAND COPTHORNE WATERFRONT HOTEL	CLOSING CEREMONY