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IPFA 2012 will be devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability and yield, especially those related to advanced process technologies. The technical sessions include, but are not limited to, the following areas:

* SAMPLE PREPARATION, METROLOGY AND MATERIAL CHARACTERIZATION
* ADVANCED FAILURE ANALYSIS TECHNIQUES
* PRODUCT RELIABILITY EVALUATION AND APPROACHES
* NOVEL GATE STACK/DIELECTRICS AND FEOL RELIABILITY AND FAILURE MECHANISMS
* DIE-LEVEL/PACKAGE-LEVEL FAILURE ANALYSIS CASE STUDY, RELIABILITY AND FAILURE MECHANISMS
* PHOTOVOLTAICS & NOVEL DEVICE RELIABILITY AND FAILURE MECHANISMS
* ADVANCED INTERCONNECTS AND BEOL RELIABILITY AND FAILURE MECHANISMS

Plan now to be part of this exciting conference and do visit this website again when the full information are available in April 2012.