Technically Co-sponsored:
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Tutorial Program:
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Speaker: Dr. Gennadi BERSUKER, SEMATech, USA Title: Gate Stack Reliability: Towards Microscopic Description Abstract:Aggressive scaling combined with the proliferation of new materials complicates reliability evaluation of the advanced gate stacks. View More |
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Speaker: Dr. Kristof CROES, IMEC, Belgium Title: TSV-Integration and 3D-Stacking: Reliability Challenges, Thermal Management Problems and CPI Abstract:3D integration is a technology that allows vertically connecting basic electronic components. View More |
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Speaker: Prof. Chee Lip GAN, Nanyang Technological University, Singapore Title: Reliability Issues for Copper Interconnects and Low-k Dielectrics Abstract:Back-end-of-line (BEOL) reliability issues such as electromigration, stress migration and low-k dielectric breakdown continue to be a key concern in the current and future technologies. View More |
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Speaker: Prof. Juin J. LIOU, University of Central Florida, USA Title: Electrostatic Discharge (ESD) Protection Solutions of BiCMOS/CMOS Integrated Circuits Abstract:Electrostatic discharge (ESD) is one of the most prevalent threats to electronic components. It is an event in which a finite amount of charge is transferred from one object (i.e., human body) to the other (i.e., microchip). View More |
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Speaker: Dr. Dave VALLETT, IBM, Essex Junction, VT Title: Fault Isolation Techniques for Package and Die Level Failure Analysis Abstract:Microelectronic and now nanoelectronic fault isolation has become increasingly challenging with higher density packaging, transistor counts into the billions, scaling below 32 nanometers, and new materials. View More |
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Speaker: Dr. Stuart WRIGHT, EDAX, USA Title: An Introduction to EDS and EBSD for Microelectronics Applications Abstract:This tutorial will focus on two complementary scanning electronic based techniques: x-ray energy dispersive spectroscopy (EDS) and electron backscatter diffraction (EBSD). View More |