48th ECTC Program Sessions
Seattle, Washington, May
To Register: Jim Bruorton, Fax 1 864 963 6521, email <margieballinger@kemet.com>

Tuesday, May 26, 1998 8:00 AM - 12:00 PM
Session 01: Connectors
Chairs: Tim Adams, Brush Wellman, Irvin H. Brockman
"Testing the Mechanical and Electrical Integrity of Surface Mount Modular-Flex Interconnects"
Advanced Circuit Technology, Inc.
"Nonlinear Mechanical Modeling of Electrical Connectors Using Simple Numerical Methods and Secant Modulus Data"
Brush Wellman Inc.
"Stubbing and Mating Mechanics of Separable Connectors"
AMP Incorporated
"Optimized Contact Design for High Current Applications"
Viking Electronics, Inc.
"Formation of Electrical Contact Through an Alodine Coating"
New Mexico State University
"The Interface Resistance Between A Cadmium Plated Connector and An Alodined Aluminum Bracket"
New Mexico State University
"Study on the Method of Reliability Predication for Contact"
Hebei University of Jianguo

Session 02: Modeling & Simulation: Thermal/Mechanical I
Session Chair: Suresh K. Sitaraman
"Optimization of the Thermal Fatigue Reliability of Polymer Stud Grid Array Packages using Micro-Macro Finite Element Modeling" IMEC -- Siemens LPT
"Enhancement of Multichip Modules (MCMs) Cooling by Incorporating Micro-Heat Pipes and Other High Thermal Conductivity Materials into Microchannel Heat Sinks"
FLUENT, Inc.
"Transient Heat Conduction Analysis of Electronic Packages by Coupled Boundary and Finite Element Methods"
University of Arizona
"Thermal Simulation and Validation of the Fast Static Ram 164 Lead FC-PBGA Package with Investigation of Package Thermal Performance in a Generic CPU Module"
Motorola, Inc.
"Thermal Characterization of Multi-Die BGA Packages"
Rockwell Semiconductor Systems
"Thermal Dissipation Analysis in Flip Chip on Board and Chip on Board Assemblies"
Georgia Institute of Technology
"Solder Joi8nt Reliability of a Lead-Less RF Transistor"
Ericsson Components AB

Session 03: Underfill for Flip Chip Applications
Sessions Chairs: Phil Garrou, CP Wong
"Reworkable Underfill Encapsulants for Flip-Chip Applications"
Georgia Institute of Technology
"Flow Properties of Liquid Underfill Encapsulations and Underfill Process Considerations"
University of Arkansas
"Analysis of the Effects of Underfill Encapsulant and Laminated Substrate on the Thermo-Structural Behavior of a Flip Chip Laminate BGA Package" Johnson Matthey
"Methodology for Screening High Performance Underfill Materials" LSI Logic
"Investigation of the Effects of Fluxing and Toughening Agents on the Properties of the No-Flow Underfill Encapsulant"
Georgia Institute of Technology
"Enhancement of Underfill Encapsulant Performance for Flip-Chip Applications by Use of Silane Additive"
Georgia Institute of Technology
"Polymer Interfacial Adhesion in Microelectronic Assemblies"
University of Arizona

Session 04: Advanced PWB Materials Technology
Session CoChairs: R. Bratchun, Greg Chen
"Epoxy-Based Aqueous-Processable Photodielectric Dry Film and Conductive Via Plug for PCB Build-up and IC Packaging"
DuPont Photopolymer and Electronic Materials
"Recent Advancements in MCM-L Imaging and Via Generation by Laser Direct Writing"
Technical University of Budapest
"P4 Process - A Novel Multilayer High-Density Thin-Film Buildup Technology on PWB"
Georgia Institute of Technology
"New High-Density Multilayer Technology on PCB"
NEC Corporation
"Improvements and Recent Advances in Nanocomposite Capacitors Using a Colloidal Technique"
Georgia Institute of Technology
"Barium Titanate/Epoxy Nanocomposite Dielectric Materials for Integrated Thin Film Capacitors"
Cornell University

Session 05: High Speed Optoelectronic Modules
Session CoChairs: Craig A. Gaw, Torsten Wipiejewski
"Flip Chip Equipment for High-End Optoelectronic Modules"
Karl Suss America
"Low Cost 10 Gb/s Receiver Module" Nortel Corporation
"A Compact, MU Interface 2.5-Gb/s Optical Transmitter Module with an Embedded LD-Driver IC" NTT
"Unisolated 2.5Bits Uncooled Gain-Coupled 1300 nm DFB Lasers for Low Cost Applications"
Hewlett Packard Company
"A New Family of Ferruleless Fiber-Optic Transceivers"
Honeywell Micro Switch
"Automatic Power Control of a VCSEL Using an Angled Lid TO56 Package" Motorola, Inc.
"A Compact Optical Active Connector: An Optical Interconnect Module With An Electrical Connector Interface"
NTT Opto-electronics Laboratories

2:00 PM - 6:00 PM
Session 06: Integrated/Embedded Passive Components
Session CoChairs: Amit P. Agrawal, Rao Bonda
"Solution for the Microelectronics Industry"
AVX Corporation, Pennsylvania State University,
KEMET Electronics Corporation
"Direct-Write Fabrication of Integrated, Multilayer Ceramic Components" Sandia National Laboratories
"Thin Film Resistors and Capacitors for Multichip Modules"
Institute if Microelectronics

"Electroless Ni-P Thin Film Resistors for MCM-L Based Technologies"
Georgia Institute of Technology, Motorola, Inc.
"Electrical Characterizations of Multilayered Thin Film Embedded Passive Devices"
University of Arkansas, Sheldahl Corporation
"Anodization for Forming Thin Film Embedded Capacitors in MCM-D and MCM-L Substrates"
University of Arkansas
"High-Performance RF Coil Inductors on Silicon"
Lawrence Livermore National Laboratory,
University of California, Berkley

Session 07: Joining Processes & Materials
Session CoChairs: Eric Perfecto, Peter Slota, Jr.
"Fluxless FC-Soldering in 02 Purged Ambients"
Mikroelektronik Centret, DTU
"Intermetallic Compound Growth on Ni,Au/Ni, and Pd/Ni Substrates with Sn/Pb, Sn/Ag, and Sn Solders"
Ford Research Laboratory
"A Few Issues in Prediction of Solder Joint Thermal Fatigue Life" Hewlett-Packard Company
""Eutectic Sn-Bi as an Alternative Pb-Free Solder"
Hewlett-Packard Company
"High Temperature Joints Manufactured at Low Temperature"
University of California, Irvine
"Reliability Studies of Plastic Ball Grid Array Assemblies Reflowed in Nitrogen Ambient - Effect of Solder Joint Geometry" City University of Hong Kong

Session 08: Flip Chip Interconnections
Session CoChairs: Corey Koehler, Gordon Roberts
"GHZ Package - An Overview"
Ericsson Microwave Systems
"Reliability Investigations for Flip Chip on Flex Using Different Solder Materials" Technical University of Berlin, Fraunhofer Institute IZM
"Flip Chip for AMD K6 Microprocessor"
Advanced Micro Devices
"A Study of a New Flip Chip Packaging Process for Diversified Bump and Land Combination"
Nitto Denko Corporation
"Flip Chip Interconnect System Prepared by Wet Chemical Metallization" Dresden University of Technology – LPKF Laser & Electronics GmbH
"Flip-Chip Bonding on 6 um Pitch Using Thin-Film Microspring Technology"
Palo Alto Research Center

Session 09: Modeling & Simulation: Thermal/Mechanical II
Cochairs: R. Mahajan, Erdogan Madenci
"Impacting Electronic Package Design by Validated Simulations" Motorola, Inc. – Rockwell Semiconductor
"Analysis and Modeling Verification for Thermal-Mechanical Deformation in Flip-Chip Packages"
University of Texas at Austin
"Application of Thermoelastic Lamination Theory to Predict the Warpage of a Symmetric, Simply Supported Printed Wiring Board During Temperature Cycling"
Georgia Institute of Technology
"Process Modeling of Sequential Build-Up of Multi-Layered Structures" Georgia Institute of Technology
"The Effect of Underfill Imperfections on the Reliability of Flip Chip Modules - FEM Simulations and Experiments"
Dresden University of Technology – Cornell University
"Moisture-Induced Interfacial Delamination Growth in Plastic IC Packages During Solder Reflow"
National University of Singapore
"Constitutive and Damage Model of Solders"
Northwestern University

Session 10: Aerospace Fiber-Optic Components
Session CoChairs: Mark W. Beranek, Michael Lebby
"777 Optical LAN Technology Review" The Boeing Company
"High Rate Data Link Interfaces for the International Space Station" The Boeing Company
"Photonics for the Space Environment" SDL, Inc.
"C.O.T.S. Fiber Optic Interconnect Solutions for Mobile Platforms" RIFOCS Corporation
"Low Cost MCM-L Fiber Optic Transmitter Package"
Teledyne Electronic Technologies
"High Performance, Low-Cost Chip-On-Board (COB) FDDI Transmitter and Receiver for Avionics Applications"
Boeing Information, Space and Defense Systems
"Electroplated Hermetic Fiber" SpecTran Specialty Co.

Wednesday, May 27
8 am - 12 noon
Session 11: Interconnections II: Flip Chip Bumping
Session CoChairs: Matt Schwiebert, Paul A. Totta
"Stencil Printing Process Development for Low Cost Flip Chip Interconnect" Motorola Semiconductor Products Sector
"A Cost-effective Assembly Process for Clip Chips on FR-4"
Dresden University of Technology
"Tacky Dots Transfer of Solder Spheres for Flip Chip Applications" Texas Instruments Incorporate -- DuPont
"Development of Ball Bump Forming Process and Machine Using Solder Paste and CSP" Mitsubishi Electric Corporation
"Micro-Ball Bump for Flip Chip Interconnections"
Nippon Steel Corporation

Session 12: Manufacturing Tech I: Chip Level Processing
Session CoChairs: Claude Ladouceur, Tom Swirbel
"Surface Tension Aspects of the Chip on Board Assembly Process" Kester Solder
"Tacky Dots Technology for Flip Chip and BGA Solder Bumping" DuPont Electronics
"Packaging Motorola’s First FC MCM-L Using TrueDie TM"
Motorola SPS
"Overmold Technology Applied to Cavity Down Ultrafine Pitch PBGA Package" IBM Canada
"Compression Flow Modeling of Underfill Encapsulants for Low Cost Flip Chip Assembly" Georgia Institute of Tech
"Preventing Popcorning: What Does It Cost The Industry?
National Semiconductor Corporation
Session 13: CSP - (Single Chip Packaging I) 8 am - 12noon
Session CoChairs: Raj N. Master, Dennis R. Olsen
"Chip Scale Packaging for Memory Devices"
Hitachi Research Laboratory
"Reliability Characterization of Chip-Scale Packages"
Motorola, Inc.
"Technical Evaluation of a "Near" Chip Scale Size"
IBM Microelectronics
"On Thermal Stress and Reliability of a PBGA Chip Scale Package" IBM Microelectronics
"JACS-Pak Flip Chip-Chip Scale Package Development and Characterization" Motorola Semiconductor Product Sector
"Influence of Process Variables on the Reliability of Chip Scale Package Assemblies" Intel Corporation
"Board Level Reliability of CSP"
Sharp Corporation VLSI Laboratories

8:00 AM - 12:00 PM Session 14: Proposed Approach to Packaging Education in the 21st Century
CoChairs: Rao R. Tummala, Albert F. Puttlitz
"Teaching Electronics Packaging Education Using Interactive Multimedia" Georgia Institute of Technology
"A Multi-disciplinary Sophomore Course in Electronics Packaging" State University of New York
"Internet Based Modules For A National Course on Thermal Design of Electronic Products" University of Maryland–University of Minnesota–Auburn University
"Packaging Education For The 21st Century"
University of Illinois at Urbana-Champaign
"Proposed Strategies for Microelectronic Packaging Education for Next Generation Engineers" Tufts University
"RF and Wireless Course for Graduate Education"
Virginia Polytechnic Institute & State University

8: - 12 Session 15: Optical Microbench Technology
Session CoChairs: Mino F. Dautartas, Masataka Itoh
"Hybrid Integrated Silicon Optical Bench Lightguide Circuits"
Lucent Technologies/Bell Laboratories
"Hybridly Integrated Optical Transceiver Module for Access Networks" Matsushita Electronics Corporation
"ASOC - A Silicon-Based Integrated Optical Manufacturing Technology" Bookham Technology Ltd.
"Mass Production Techniques for Optical Modules"
NEC Corporation
"Low Cost/High Volume Laser Modules Using Silicon Optical Bench Technology" Bell Laboratories/Lucent Technologies
"Monolithic Integrated Optical Micro-Bench for Photonics Packaging" TRW Inc.
"MEMS Packaging for 3-D Micro Mirror Switches"
Rockwell Science Center

2:00 PM - 6:00 PM
Session 16: Modeling & Simulation: Electrical Modeling I
Session CoChairs: Ravi Kaw, John L. Prince
"Modeling the Power Rails in Leading Edge Microprocessor Packages" Hewlett-Packard Company
"Core Logic Simultaneous Switching Noise Measurements on a 500MHz CMOS Chip on a CBGA SCM" IBM Corporation
"Effects of On-chip and Off-chip Decoupling Capacitors on Electromagnetic Radiated Emission" Korean Advanced Institutes Science and Technology Samsung Electronics
"A New Analytic Model of Simultaneous Switching Noise in CMOS Systems" Hanyang University
"Synthesis of High-Speed Interconnects Under Constraints on Timing and Signal Integrity" Hewlett-Packard Company
"Interconnect Simulation Using Order Reduction and Scattering Parameters" Univ. of Illinois at Urbana-Champaign
"Smart Packages and Interconnect Substrates - Computing Functions Through Signal Line Coupling" Cornell University

2:00 PM - 6:00 PM Session 17: Education Needs and Directions in the 21st Century
Session CoChairs: Jim Morris, Paul Wesling
"The Implications of Roadmapping on University Research"
National Electronics Manufacturing Initiative, Inc.
"Multimedia Support for Learning Advanced Packaging Manufacturing Practices" Georgia Institute of Technology
"Standards-Based Multimedia Education for Electronics Packaging" Tandem Computers, Inc.
"Modern Technologies of SMT require a High Level of Ability and know-how of Engineers, Technicians and Employees"
Dresden University of Technology
"Education Project for the Development of Curricula, Research and Prototyping Facility in the Field of Electronics Interconnection and Packaging"
Technical University of Budapest
"Introduction to Electronic Packaging: An Undergraduate Textbook" Georgia Institute of Technology

2 - 6 Session 18: BGA - (Single Chip Packaging II)
Session CoChairs: Karla Y. Carichner, Jeffrey A. Knight
"Electrical Characterization of Flip-Chip Package Alternatives for Next Generation Microprocessors"
Silicon Graphics, Inc.
"High Performance Thin Film Single Chip Module"
IBM Microelectronics
"A Study of High Density and Reliability BGA Package With Solder Ball Lands of Oval Type" Anam Industrial Company
"Multi-Layer Organic Substrate Design for Optimum Mechanical Performance of Flip-Chip PBGA Package"
Clemson University
"Thermally Enhanced Flip-chip BGA with Organic Substrate"
Mitsubishi Electric Corporation
"Ball Grid Array (BGA) Packages with the Copper Core Solder Balls" Texas Instruments Japan
"Ceramic Ball Grid Array for AMD K6 Microprocessor Application" Advanced Micro Devices, IBM Corporation

2:00 PM - 6:0 PM Session 19: Reliability Testing
Session CoChairs: Donna Noctor, Ephraim Suhir
"Solder Joint Fatigue Life of FleXBGA Assemblies"
Motorola, Inc.
"Reliability and Failure Analysis of Thermally Cycled Ball Grid Array Assemblies" Jet Propulsion Laboratory,
Boeing Information, Space & Defense Systems
"Characterization of Underfill/Passivation Interfacial Adhesion for Direct Chip Attach Assemblies Using Fracture Toughness and Hydro-Thermal Fatigue Resistance Measurements" Cornell University
"Die Cracking in Clip Chip Assemblies"
State University of New York--IBM Corporation
"A New Solder Joint Modeling Tool for IC Package Designers" Lucent Technologies--National Institute of Standards & Technology
"Reliability Analysis for Molded Array Package"
Motorola, Inc.
"Long Term Exposure Electromagnetic Effects on Discrete Analog and Digital Electronic Devices" Boeing Information, Space & Defense Systems Rome Laboratory

2 - 6 Session 20: Parallel Optoelectronics
CoChairs: Laurence S. Watkins, Daniel B. Schwartz
"Parallel Optical Link (PAROLI) for Multichannel Gigabit Rate Interconnections" Siemens AG
"Packaging for a 40-Channel Parallel Optical Interconnection Module With Over 25-Gb/s Throughput"
NTT Opto-electronics Laboratories
"High Performance VCSEL Arrays for Optical Interconnection" University of Ulm
"Optoelectronic/VLSI" Bell Laboratories/Lucent Technologies
"Packaging of VCSEL, MC-LED and Detector 2-D Arrays"
GEC Marconi Materials Technology Ltd.
"Termination of Small Diameter (125 um) Plastic Optical Fiber for 1x12 Data-communication"
University of Ghent-IMEC
"Recent Advances in Fiber-Optic Backplane Connectors"
AMP Incorporated

Thursday, May 28, 1998
8:00 AM - 12:00 PM Session 21: Manufacturing Technology II: PWB & Soldering
Session CoChairs: Tom Poulin, Tony Suppelsa
"Electrical Design and Simulation of High Density Printed Circuit Boards" Motorola Radio Products Group
"Manufacturing Experience with High Performance Mixed Dielectric Circuit Boards" IBM Microelectronics
"A Relative Comparison of PWB Warpage Due to Various Simulated Soldering Process" Georgia Institute of Technology
"Development of Single-Point Laser Bonding Process for TCP Outer-Lead Bonding" NEC Corporation
"Solid State UV-Laser Technology for the Manufacture of High Performance Organic Modules"
W. L. Gore and Associates--Electro-Scientific Industries
"Precision Molding of Plastic Connectors Directly on Single-Mode Fibers" Ericsson Components AB
"The Execution of Aggressive PBGA Substrate Yield Learning in an Existing PWB Facility"
Hadco Corporation—IBM Corporation

8 - 12 Session 22: Reliability of Flip Chip Packaging
Session CoChairs: Harry Charles, Robert Howard
"Stress in Flip Chip Assemblies"
Georgia Institute of Technology
"Effective Thermomechanical Properties of Underfill Materials for Flip-Chip Packaging Applications"
Georgia Institute of Technology
"Thermomechanical Reliability Assessment of Large Organic Flip-Chip Ball Grid Array Packages"
W. L. Gore and Associates
"Reliability and Process Evaluation of Electroless Nickel-Gold/Solder Flip Chip Interconnect Technology"
Motorola, Inc.
"Reliability of Flip Chip on Board - First Order Model for the Effect on Contact "Integrity of Moisture Penetration in the Underfill" University of Twente
"Thermal Fatigue of Solder Flip-Chip Assemblies"
Thomson Multimedia
"Thermo-Mechanical Analysis of Solder Joint Fatigue and Creep in a Flip-Chip on Board Package Subjected to Temperature Cycling Loading" Georgia Institute of Tech

8:00 AM - 12:00 PM Session 23: Multichip Technologies
Session CoChairs: Joseph W. Soucy, Jack Balde
"Advanced ATM Switching System Hardware Technology Using MCM-D, Stacking RAM Micro-Processor Module"
NTT Network Service Systems Laboratories
"Hermetic-Equivalent Packaging of GPS MCM-L Modules for High Reliability Avionics Applications"
Rockwell International—Dow Corning Corporation
"Use of Highly Compliant Adhesives in the Large Area Materials and Processing of MCM-D Substrates"
Georgia Institute of Technology
"Characterization of the Electrical Performance of Buried Capacitors and Resistors in Low Temperature Co-Fired (LTCC) Ceramic" NMRC, University College Cork
"Known Good Die, Die Replacement (Rework), and Their Influences on Multichip Module Costs"
The Johns Hopkins University
"An Innovative Technique for Packaging Power Electronics Building Blocks Using Metal Posts Interconnected Parallel Plate Structure"
Virginia Polytechnic Institute and State University

8 - 12 Session 24: Reliability of Plastic Packages
Session CoChairs: Darvin R. Edwards, Jo Caers
"Enhancing Moisture Resistance of PBGA" Institute of Microelectronics—Hewlett-Packard Singapore (Pte) Ltd.--
Lucent Technologies—Hitachi Chemical
"Analysis of Delamination and Cracking in IC Packages Using a New Variable-Order Singular Boundary Element"
National University of Singapore
"Investigations on Popcorn Cracking of T-QFP Packages"
Fraunhofer Institut Zuverlaessigkeit and Mikrointegration Siemens AG
"Brittle Fracture of PBGA on Electroless Ni/Immersion Au in As-Assembled and Aged Conditions"
Hewlett-Packard Company
"Resolution and Signal Loss in Acoustic Microscopy of Encapsulated IC Packages" Sonoscan Inc.
"Visco-Elastic-Plastic Properties and Constitutive Modeling of Underfills" Wayne State University
"Real-Time Warpage Measurement of Electronic Components with Variable Sensitivity"
Clemson University—Intel Corporation

8 - 12 Session 25: Polymer Fibers and Waveguides
Session CoChairs: Mitchell S.Cohen, Martin Groeneveld
"Intrasystem Interconnection in Telecommunication Platforms Using Plastic Optical Fiber" Univ of Alabama at Birmingham—Lucent Technologies
"Graded Index Plastic Optical Fibers: Quo Vadis?"
Boston Optical Fiber
"Optically Interconnected Integrated Circuits to Solve the CMOS Interconnect Bottleneck" University of Gent—IMEC-MAP—GEC Marconi Materials Tech. Ltd.—University of Olm—Eidgenossische Technische Hochschule—Vrije Universiteit Brussel—University of Dortmund—University of Oxford—Framatomc Connectors International
"Plastic VCSEL Array Packaging and High Density Polymer Waveguides for Board and Backplane Optical Interconnect Applications" GE R&D—AMP Incorporated—Honeywell— Allied Signal
"Hybrid Optical Switch Using Polymer Waveguides and Semiconductor Optical Amplifiers (SOAs)"
University of Colorado, Electrical Engineering
"Cost-Effective and High-Density Integration of Monitoring Photodetector Arrays onto Polymeric Guided-Wave Components" IMEC/University of Gent—AKZO NOBEL
"ORMOCERs , New Photo-patternable Dielectric and Optical Materials for MCM Packaging" Fraunhofe-Institute fuer Silicatforschung—Technische Universitat Berlin—Ericsson IMC Microsystems—Motorola, Inc.—Bull—W. C. Heraeus

2:00 PM - 6:00 PM
Session 26: Interconnections III: Adhesive Interconnects
Session CoChairs: Ted Tessier, Rajen Dias
"Is There a Future for Conductive Adhesives in Flip-Chip Technology?" Alcatel Bell—Rijks Universiteit Gent
"Electrically Conductive Adhesives at Microwave Frequencies" Chalmers University of Technology—Ericsson Microwave Systems--IVF
"Development of Low Cost, Low Temperature Conductive Adhesives" T.J. Watson Research Center
"Anisotropic Conductive Film (ACF) Interconnection for Display Packaging Applications"
Korean Advanced Institutes Science and Technology
"Development of 0.025 mm Pitch Anisotropic Conductive Film (ACF)" Nitto Denko Japan
"A Novel Flip Chip Packaging Technology Using Non-Conductive Resin Sheet" Nitto Denko Corp.

2:00 PM - 6:00 PM
Session 27: Modeling & Simulation: Electrical Modeling II
Session CoChairs: J. Peter Krusius, Michael Lamson
"Synthesis of RF Circuits Using Embedded Passive Components for Mixed Signal Applications"
Georgia Institute of Technology
"Theoretical and Experimental Approach for Model Extraction of Multiconductor Interconnects with Multiple Meshed Power and Floating Planes on an APCB" Intel Corporation
"Interconnection Line Structure on MCM-Si For Giga-Hertz Quasi-TEM Signal Transmission"
Korea Advanced Institutes Science and Technology
"Single Integrity Optimization of High-Speed VLSI Packages and Interconnects" Carleton University
"Sensitivity Analysis of Circuit Response with Respect to Interconnect Parameters in Both Time and Frequency Domain" University of Arizona—University of Illinois at Urbana-Champaign
"Dielectric Constant and Loss Tangent Measurement Using a Stripline Fixture" University of Arizona
"Validity of the Mutual Inductor Model for Electromagnetic Coupling Between Vias in Integrated-Circuit Packages and Printed Circuit Boards" State Univ of NY at Binghamton

2:00 PM - 6:00 PM Session 28: Single Chip Packaging III
Session CoChairs: E. Jan Vardaman, Rick Sigliano
"High Density, Organic Flip Chip Package Substrate Technology" W. L. Gore and Associates, Inc.
"Pad Redistribution Technology for Flip Chip Applications"
Institute of Microelectronics
"Comparison of the Shear Strength and Reliability Between Gold-Plated and Bare Copper Lands of a BGA Package"
Anam Industrial
"A CMOS Image Sensor Module Applied for a Digital Still Camera Utilizing the TOG (TAB On Glass) Bonding Method"
Toshiba Corporation
"RF Flip Module BGA Package"
Bell Laboratories--Lucent Technologies
"Study of Molding Compound for BGA"
Sumitomo Bakelite Co., Ltd.
"Development of Moisture-proof Thin and Large QFP with Copper Lead Frame" Toshiba Corporation

2 - 6 Session 29: Interfacial Adhesion Technology
Session CoChairs: Wayne J. Howell, Jim Morris
"Effects of Plasma Treatment on PBGA Package and Plastic Package Using Copper Leadframe" Samsung Electronics Co.
"Adhesion Integrity Evaluation of Plastic Encapsulated Semiconductor Package"
Toshiba Corporation—Anam Industrial Co., LTD
"The Effect of Die Attach Layer Delamination on Thermal Performance of Plastic Packages"
Anam Semiconductor—Amkor Electronics
"Optimal Oxidation Control for Enhancement of Copper Leadframe - EMC Adhesion in Packaging Process"
Anam Industrial Co.—Toshiba Corporation
"An Analytical Characterization and Reliability Testing of an Adhesion Enhancing Zn-Cr Leadframe Coating for Popcorn Prevention" Siemens Components Pte Ltd, University of New South Wales—Siemens AG ,Olin Metals Research Laboratories
"Surface Treatment of Copper for the Adhesion Improvement to Epoxy Mold Compounds" Institute of Microelectronics
"The Evaluation of the High-reliable Adhesive Film for T-BGA" Toshiba Corporation—Iwate Toshiba Electronics Co.

2 - 6 Session 30: Low-Cost Optoelectronic Packaging
Session CoChairs: William M. Sherry, Atsushi Takai
"New Types of Optoelectronic Molding Compounds"
Dexter Electronic Materials
"Adhesives for Optical Devices"
NTT Advanced Technology Corporation
"A Reliability Study of an Epoxy-Bonded Fiber-Coupled Laser Assembly" University of Colorado—Electro-Optics Division, Melles Griot
"Low Power Consumption Molded Gigabit Fiberoptic Transceiver Module" Sumitomo Electric Industries, Ltd.
"Long Wavelength Transparent Epoxy Mold Optical Data Link" Sumitomo Electric Industries, Ltd.
"Packaging Aspects of the Jitney Parallel Optical Interconnect" IBM Corporation—Lexmark Corporation
A Cost Effective Ceramic Package for LD/PD Module in Subscriber System" Kyocera Corporation

Session 31: Poster, Tuesday, May 26, 1998
9:00 AM - 12:00 PM & 2:00 PM - 5:00 PM
Session Chair: Steve Bezuk
"Thermal Impedance of Microwave Integrated Circuits With Localized Small Heat Sources"
Boeing Information, Space and Defense Systems
"Analytical and Experimental Study on a Piezoelectric Linear Motor" Nanyang Technological University
"Three-Dimensional Die Surface Stress Measurements Using (111) Silicon Test Chips" Auburn University
"The Development of Top-Bottom-BGA (TB-BGA)"
Fraunhofer-Institut fur Zuverlasssigkeit und Mikrointegration
"Property Trend Analysis and Simulations of Adhesive Formulation Effects in the Microelectronics Packaging Industry Using Molecular Modeling"
Johnson Matthey Electronics
"Integrated Solenoid-Type Inductors for High Frequency Applications and Their Characteristic" Samsung Electronics Co., LTD—Georgia Institute of Technology
"Characterization of a No-Flow Underfill Encapsulant During the Solder Reflow Process" Georgia Institute of Technology
"Advanced MCM Wirebonding" The Johns Hopkins University
"Evaluation of Solder Joint Reliability between PWB and CSP Using High TCE Ceramic Material" Kyocera Corp
"Probabilistic Prediction of Wirebility and Routing Requirements for High Density Interconnect Substrates"
Cornell University
"High Performance Packaging Technique for Clamped Gain Amplifier Array Modules Fabrication"
Alcatel Alsthom Corporate Research Centre
"Optical Coupling Approaches for Dual Output Waveguides to Detectors" TRW Inc.
"Scaleable High Power Pump Laser Modules with High Efficiency and High Reliability" Lucent Technologies
"Electrical Modeling of the Chip Scale BGA"
Rutgers University
"MCM Structures with Poled Dielectrics to Improve Testability" U.S. Naval Academy—The Johns Hopkins University
"Encapsulant Materials for Flip Chip Assembly"
State University of New York—IBM Corporation
"Improvement in Reliability with CCGA Column Density Increase to 1mm Pitch" IBM Corporation
"Electrical Properties and Fatigue Failure of Plastic Ball GridArray Assemblies - Effect of Thermal Shock"
City University of Hong Kong
"Thermocompression Bonding of Aluminum Bump in TAB Applications" T. J. Watson Research Center
"Computational Simulation of Underfill Encapsulation of Flip-Chip ICs" CFD Research Corporation— National Semiconductor Corporation
"Thermosonic Flip Chip Bonding System with a Self-Planarization Feature Using Polymer" University of Colorado
"IC Chip Stress During Plastic Package Molding"
Sandia National Laboratories
"Evaluation of Flip Chip Underfill Segregation Using Acoustic Microscopy" Georgia Institute of Technology
"Evolution of Encapsulating Compound’s Properties During Post Mold Cure" LG Chemical Ltd/Research Park
"Multi-Domain Analysis of PBGA Solder Connect for Structural Design Optimization"
Boeing Information, Space and Defense Systems

Session 32: Poster Wednesday, May 27 1998
9:00 AM - 12:00PM & 2:00 PM - 5:00 PM
Session Chair: Steve Bezuk
"TMA, DMA, DCS, and TGA of Lead Free Solders"
Express Packaging Systems, Inc.
"Fatigue Testing of a Simplified Flip-Chip Structure and Flip-Chip with Underfills by a Six-Axial Mini Fatigue Tester"
Wayne State University
"Micro-Macro Moire and Phase Shifting Techniques for Resolving Global/Local Deformation Electronic Packages"
Wayne State University—Motorola, Inc.
"Integrated Flow-Thermomechanical and Reliability Analysis of a Low-Air Cooled Flip Chip-PBGA Package"
IBM Microelectronics
"Characterization of Underfill Materials for Functional Solder Bumped Flip Chips on Board Applications"
Express Packaging Systems, Inc.
"Moisture Diffusion and Delamination Modeling of IC Packages" Institute of Microelectronics
"Electromagnetic Analysis of High-Density Multi-Chip Module Substrates Having Semi-Custom Interconnects"
University of South Carolina
"A New Technique for the High Frequency Characterization of Capacitors" Intel Corporation
"Load Resistor Effect on Intermodulation Distortion in CATV Pins" AMP/Lytel Division
"Design, Simulation and Technological Realization of a Reliable Packaging Concept for High Power Laser Bars"
Technical University of Berlin—Fraunhofer-Institute for Reliability and Microintegration
"Optimization of Channel Configurations (Width and Length) For Heat-Pipe Enhanced Microchannel Heat Sinks"
MJM Engineering Co.—FLUENT, Inc.
"A New Non-Epoxy Die Attach Adhesive"
Occidental Chemical Corporation
"Thermal Analysis of a Chip Scale Package Technology"
Motorola Semiconductor Products Sector
"o/e MCM-L/D Packaging with New Patternable Dielectric and Optical Materials" Ericsson—IMC Microsystems—Motorola, Inc.—Technische Universitat Berlin—Fraunhofer-Institut fuer Silcatforschung

"Trends in BGA Design Methodologies"
Xynetix Design Systems
"Transient Thermal Measurement of Laser Diodes"
University of California, Irvine
"Thermo-Mechanical Fatigue and Creep of Two Solder Alloys" Wayne State University
"Advanced Materials for Thermal Interfaces"
Johnson Matthey Electronics
"Resolving Micro-Deformation by a Micro-Speckle Method Under SEM" Wayne State University
"Creep Behavior Study of a Clip-Chip Package by Both FEM Modeling and Real Time Moire Interferometry"
Wayne State University
"In Package Micro Aligner For Fiber Optical Packaging"
The Boeing Company
"Comparison of Advanced Measurement and Modeling Techniques for Electrical Characterization of BGA’s"
National Sun Yat-Sen University—Advanced Semiconductor Engineering Inc.