International Workshop on Integrated Power Packaging (IWIPP)
September 18-20, 1998
Ramada Congress Hotel, Chicago, IL
The First International Workshop on Integrated Power Packaging
(IWIPP) will be held in Chicago, IL from September 18-20, 1998
at the Ramada Congress Hotel. The main objective of this Workshop
is to provide a forum for information exchange in the area of
electronic packaging relevant to power electronics. Topics to
be covered include, but not limited to: 3-D power packaging, CAD
tools, EMI effects in packaging, fabrication techniques, high
temperature reliability, integration, material systems and thermal
management. Important application areas of interest include, but
not limited to: appliances, automotive, drives, lighting, portable
electronics, power supplies and telecom. The Workshop will consist
of one day of short course (s) on September 18, two panel sessions
on the evening of September 19, a plenary session on September
19 morning, a luncheon speech on September 19, and several technical
sessions on September 19 and 20, 1998.
Dr. Krishna Shenai of the University of Illinois at Chicago,
Chicago, IL is the General Chairman and Dr. Douglas Hopkins of
SUNY, Binghamton, NY is the Technical Program Chairman of the
Workshop.
The IWIPP is sponsored by IEEE PELS, IAS and CPMT Societies
and will be held in cooperation with PSMA. A Workshop Proceedings
consisting of technical papers will be made available to all participants
at the Workshop.
The deadline for submission of technical papers is as follows:
Deadline for paper submission: May 15, 1998
(200-word abstract and two-page summary including figures)
Notice of acceptance: June 15, 1998
Camera-ready manuscript due by: Aug. 1, 1998
For further information, please contact:
Dr. Krishna Shenai, General Chairman
University of Illinois at Chicago, Chicago, IL
Tel: (312) 996-2633; Fax: (312) 996-0763
E-mail: shenai@eecs.uic.edu
Dr. Douglas C. Hopkins, Technical Program Chairman
State University of New York (SUNY), Binghamton, NY
Tel: (607) 777-2333; Fax: (607) 777-4464
E-mail: D.Hopkins@IEEE.Org
Mr. Robert Myers, Workshop Manager
Myers/Smith, Inc., Los Angeles, CA
Tel: (310) 287-1463; Fax (310) 287-1851
E-mail: bob.myers@ieee.org