INTERNATIONAL CONFERENCE AND EXHIBITION ON
MULTICHIP MODULES AND
HIGH DENSITY PACKAGING
APRIL 15-17, 1998
Adam’s Mark Hotel, Denver, Colorado
for information: http://www.ishm.ee.vt.edu
R. Wayne Johnson, Ph.D., Auburn University,
Technical Program Chair
Leonard Schaper, Ph.D., University of Arkansas
Technical Program Co-Chair
Robert C. Frye, Ph.D., Lucent Technologies

PROFESSIONAL DEVELOPMENT COURSES
Tuesday, April 14, 1998, 9am - 5pm
** T1 - Multichip Modules: The Fundamentals
Instructor: R. Wayne Johnson, Ph.D., Auburn University
** T2 - Micro/Chip Scale Packaging
Instructor: Charles E. Bauer, Ph. D., TechLead Corp.
** T3 - ADVANCED PWBs: New Technologies for MCM-Ls, Portables and IC Packaging
Instructor: Happy Holden, TechLead Corporation
** T4 – MCM Thermal Management
Instructor: Al Krum, Raytheon Systems Company
** T5 – Modern Wirebonding Technology
Instructor: Harry K. Charles, Jr., PH. D., The Johns Hopkins University/APL
** T6 – Polymers for Electronic Packaging:
Materials, Processes and Reliability
Instructor: C. P. Wong, Ph. D., Georgia Inst. of Technology

TECHNICAL PROGRAM
Wednesday Morning, April 15

Session WA1, 9am - Noon
Session Chairs : Bill G. Petefish, Jeffrey K, Kennedy

**Building a Domestic High Density Flip Chip Organic Substrate Capability, ITRI, Sematech
**Adhesion Evaluation of Flexible Multilayer Substrate for MCM Application, Fujitsu
**A Comparative Analysis of RF-Characteristics of High Density MCM-L Technologies, ETH Zurich/Electronics Lab (IFE)
**MCM/KGD Development Roadmap in Japan -EIAJ Perspective, Toshiba Corporation; NEC Corp.
**First 4 Chip MCM-L Memory Module: The Road from Technology Assessment to Production, Motorola SPS
**Multichip Packaging in QFPs by PBO-Multilayer High Density Interconnect, Siemens Components

SESSION WA2, 9am – Noon
FLIP CHIP
Session Chairs: Deborah S. Patterson & Glenn A. Rinne

**Solder Joint Yield Modeling for Flip-Chip Assemblies,
University of Colorado

**Reflow-Curable Polymer Fluxes for Flip Chip Encapsulation
Anguila Technologies, Inc.; Auburn University
**The Flip Chip Bump Interconnection for Microwave and Millimeter-wave Devices, NEC Corporation
**Study of RF Flip-chip Assembly with Underfill Epoxy,
University of Colorado
**Evolution of A Unique Flip Chip MCM-L Package,
IBM Microelectronics
**Flip Chip Assembly on Rigid Organic Laminates: A Production Ready Process for Automotive Electronics,
Delco Electronics Corporation

SESSION WA3, 9am - Noon
Test Session Chairs: Paul Franzon, Steven Ladd

**Comparative Analysis of Testing Methodologies for Multi-Chip Laminate Substrates and PCBs,
W. M. Hague Company, Inc.
**Failure Analysis Techniques for SRAM Flip Chip MCMs,
Motorola
**Membrane Design for MCM and BGA Substrate Test,
Mentor Graphics
**Passive Component Inspection Using Machine Vision,
Georgia Institute of Technology
**Improving Yields Through Effective Diagnostics: A MCM-D/C Example, IBM Microelectronics
**A Probe Routing Algorithm for MCM Substrate Test,
Tufts University

Wednesday Afternoon, April 15
SESSION WP1, 2pm - 5pm
MCM-C and MCM-D
Session Chairs: Rick Sigliano and Chung W. Ho

**Low Cost MCM-D Substrates with Improved Thermal Characteristics, Hughes Aircraft Company
**Characterization and Optimization of LTCC for High Density Large Area MCMs, Lockheed Martin E & M
**AMI: A New Thin Film Substrate Technology
PCB Ltd.
**Adapting Multichip Module Foundries for MEMs Packaging
Air Force Institute of Technology; G. E. Corporate Research and Development; University of California at Los Angeles
**A New Concept for Using Al-Sheet as Integrated Substrate for One or Multichip Module Package,
Technical University of Sofia
**Yield and Process Issues Interconnect Production,
Raytheon TI Systems
**Low Cost MCM Package for Mobile Telecommunication,
Kyocera Corporation

SESSION WP2, 2pm - 5pm
Thermal Management
Session Chairs: Ajay P. Malshe and Chris Schaffer

**Thermal Management for Multifunctional Structures,
Martin Marietta Corporation
**Electrical and Thermal Considerations for a Novel 3-D Flex Electronic Packaging Concept,
University of Arkansas (HiDEC); Sheldahl Corporation

**Thermal Management of Flip Chip Modules,
Celestica Inc.
**Enhancement of Multichip Modules (MCMs) Cooling by Incorporating Micro-Heat Pipes and Other High Thermal Conductivity Materials into Microchannel Heat Sinks,
MJM Engineering; Fluent, Inc.
**Utilizing Low Forward Voltage Drop Power Semiconductors to Minimize Heat Sinking Requirements in Multichip Module DC Solid State Relays and Static Switching Applications,
Motorola SPS
**All Silicon Multi Chip Module with a Fully Integrated Cooling System, University of Cincinnati
**Graphite Fiber Composites for CTE Control in Thermal Management, Materials Innovations, Inc.

SESSION WP3, 2pm - 5pm: Design
Chairs: Greg Peterschmidt and Madhavan Swaminathan

**Managing High Frequency Signals with MCMs Signal Integrity Problems and Solutions Using MCMs,
Maxtek Components Corporation
**Designing Application Specifics Multichip IC Components,
Alpine Microsystems
**High Frequency Chip-to-Chip Signaling on a Rapidly Prototyped Flip-Chip MCM-D Substrate, MCC
**Simulation and Optimization of MCM Interconnect,
National Taiwan University
**A System Level Approach to a Structured MCM Design Methodology, IMEC VZW
**DFT Techniques for First-time Right MCMs-Exemplified by a Pentium MCM System, ETH Zurich Electronics Laboratory

SESSION THA1, Thursday Morning, April 16, 9am - Noon
Advanced Materials
Session Chairs: Daniel I. Amey and Dave Kellerman

**A New Low Loss Lead Free LTCC System for Wireless and RF Applications, DuPont
**Characterization and Processing of Low Dielectric Constant Thick Film Substrates for MCM-C, Materials Solutions; EMCA-Remex Products; MIT Lincoln Laboratories; Virginia Tech
**New Low Cost Interconnection Materials for High Frequency MCM Applications: Thick Films with Thin Film Performance, DuPont Electronic Materials
**High Performance Photo-Sensitive Dielectric for MCM-L,
Hitachi Research Laboratory
**A New Interlayer Interconnect Technology for Multilayer Fabrication, Sheldahl, Inc.
**CVD Diamond Wafers for Thermal Management Application in Electronic Packaging, Norton Diamond Film

SESSION THA2, 9am - Noon
CSP Session Chairs: Charles E. Bauer and Jon G. Aday

**Flip Chip Scale Packaging: Transferring the Flip Chip Density Requirements from the Motherboard to the Carrier,
Motorola, Inc.; Auburn University
**Properties of ALIVH-CSP using SBB Flip-Chip Technology
Matsushita Electric Industrial Co., Ltd.
**Reliability Evaluation of Chip-on-Flex CSP Devices,
GE Corporate R&D
**The Development of a Top-Bottom-BGA (TB-BGA),
Fraunhofer-Institut fur Zuverlassigkeit und Mikrointegration
**CSP Limitations Imposed by Mainboard Technology Limits,
Chip Supply, Inc.
**Trends in BGA Design Methodologies,
Xynetix Design Systems

SESSION THA3, 9am – Noon
RF & Telecom, Chairs: David J. Pedder and Eric Beyne

**Integrated Passive Components in MCM-si Technologies and their Application in RF-Systems,
SICAN Research and Development
**Microwave Multi-Chip Modules Using Low Cost Microwave Chip on Flex Packaging Technology, Lockheed Martin
**MCM-D & Direct Module Attach Technology for RF Applications, GEC Plessey Semiconductors
**Flip-Chip GaAs MMICs for Microwave MCM-D Applications, GEC-Marconi Materials Technology Ltd.
**Multichip-Modules for Micro-and Millimeter-Wave Applications-a Challenge?, Daimler-Benz Aerospace
**Low-complexity MCM-D Technology with Integrated Passives for High Frequency Applications,
Philips Research; Philips Research-England

Thursday Afternoon, April 16
SESSION THP1, 2pm – 5pm: Interconnect
Session Chairs: George G. Harman and Happy Holden

**Thermosonic Gold Wire Bonding to Palladium and Silver Finishes on Laminate Substrates, Auburn University; Alabama Microelectronics Science and Technology Center
**Wirebonding Reinventing the Process for MCMs,
The Johns Hopkins University
**Bare Chip Stacking Structure for MCM Production,
Sumitomo Metal Mining; Flextronics International, Inc.
**Vibration-induced Fatigue Failures in Bonding Wires Used in Stacked Chip Modules, Goddard Space Flight Center/ NASA
**Transcription Solder Bump Technology using Evaporation Method, Fujitsu Limited
**Low Cost Alternatives in Evaporative Bumping,
Motorola
**FlipChip Interconnects with Electro-plated, Extended Eutectic Solder Bumps, University of Arkansas

SESSION THP2, 2pm – 5pm
High Density Interconnect on Flex
Session Chair: John W. Balde

**flexPAC - A Low Cost Approach to Chip Size Packaging,
Fraunhofer Institut Fuer; Technical University of Berlin
**flexPAC - A Manufacturing Process for a Low Cost CSP,
Pac Tech-Packaging Technologies GmbH; Fraunhofer Institute Reliability and Microintegration (IZM)
**Multilayer Film Substrates with 30Micron Vias for MCM Applications, Hightec MC AG
**Microvias and Flex - An Enabling MCM-L Technology,
Teledyne Electronic Technologies
**Thin Film Passives Elements on Polyimide Film,
GE Research & Development
**Feasibility Study of Thermally Integrated Mechanical Configuration for a Novel 3D Flex MCM,
University of Arkansas (HiDEC)

SESSION THP3, 2pm – 5pm
KGD Session Chairs: Jim Rates and Jody Van Horn

**Motorola’s First FC MCM-L Using TrueDie, Motorola
**KGD Production for Controlled Chip Collapse Connection (C4) Applications, IBM Microelectronics
**Investigations on Some KGD Approaches for MCMs for Space Applications, Matra Marconi Space France (MMSF); ESA/ESTEC - European Space Agency; CNES-France Space Agency
**Test Methods Used to Produce Highly Reliable Known Good Die (KGD), Texas Instruments
**Membrane Probe with Pyramidal Tips for a Bare Chip Testing, Hitachi, Ltd.
**Case Studies in the Use of Silicon Contacts to Test and Burn-in Flash Memory, Microprocessors, FPGAs and SRAM in Bare Die and CSP Formats, Bear Technology
**Replaceable Chip Module RCM, Gryphics, Inc.

SESSION THP4, 2pm – 5pm: Reliability
Session Chairs: Richard K. Ulrich and Tom Evans

**Comparison of TapeBGA, MetalBGA, and ViperBGA Using the PAQC Chip, Symbios Logic, Inc.
**Complete Stress State Measurements in Chip on Board Packages, Auburn University
**Hermetic-Equivalent Packaging of Data Accumulator MCM-L Modules for General Aviation Avionics Applications,
Rockwell International
**Solder Joint Reliability Modeling for a 540-I/O Plastic Ball-Grid-Array Assembly, University of Colorado; Intel Corporation
**A Study on Solder Joint Reliability Including FEM Simulations on Silicon Substrate MCM-D, Ericsson
**Void Free Die Attachment for Multichip Modules Using Solder Alloys, Scientific Sealing Technology