SANTA CLARA VALLEY CHAPTER
For our IC packaging focused members, we’ve covered developments from design to implementation. Here is the lineup:
**January -- Ed Combs of ASAT on "TBGAs" and Dick Pommer of ASTI (Allied Signal) on "Multilayer Flex for IC Packaging"
**February -- Bill Schmidt of SGI on "Chip Packaging of Systems of the Next Decade"
**April -- Jim Howard of HADCO -- "PCBs Meet BGAs and CSPs"
**May -- "Chip Scale vs. Flip Chip", a panel discussion among John Smith of Tessera, Peter Elenius of Flip Chip Technologies, and Jim Young of Intarsa.
**June -- Dr. Vivek Mansingh of Aavid on "Thermal Dissipation of BGAs and QFPs"
**September -- Steve Bird of HADCO PCA Design on "Designing with Chip Scale Packages"
**November -- Eric Bogatin spoke of "Parasitic Extraction in Packaging for High Speed"
**December -- Richard Godin of Cookson MPM on "Flip Chip by Metal Jet"

For our Manufacturing Engineering focused members we had two plant tours:
**March -- Tanon, a Contract Manufacturer
**October -- 3COM, a major networking equipment manufacturer.
(We took July and August off.)
-- submitted by Harvey Miller -- Program Chair