Upcoming Meetings of Interest
1998 IEMT/IMC Symposium
April 15-17, 1998
Sonic City -Omiya, Tokyo, Japan
"Breakthrough for System Packaging"
67 papers to be presented in 14 technical sessions: CSP/BGA, MCM/3D Packaging, Flip-chip/Interconnection, Optical Components & Modules, Thick/Thin film, Process Technologies, Thermal Management, Packaging, Failure Analysis & Reliability, Modeling & Analysis, Substrate, Components, and Materials.
3 Invited Papers: Technology Trends in Taiwan, Advanced Substrate & Packaging Technologies, Low Cost/High Density Packaging & Interconnect.
In parallel will be a Microelectronics Show exhibition
Contact Secretariat: email@example.com, Tel: +81 3 5802 5366, Fax: +81 3 5802 5367.
9th Annual SEMI/IEEE Advanced Semiconductor Manufacturing Conference
September 23-25, 1998 -- Boston Massachusetts, USA
For more Info contact Margaret at <mkindling.semi.org> or Fax 1 202 289 0441.
Advanced Technology Workshop on Next Generation IC and Packaging
July 9-11, 1998 at Hilton Head, South Carolina, USA
The goal of the workshop is to address the next generation system needs associated with the design of complex, high I/O, multi-layered, highly integrated, high frequency ICs and packages. Key speakers from both industry and academia will be presenting papers related to system level optimization, mixed signal design, electrical links, optical links and modeling/simulation techniques.
For further information contact the General Chair Madhavan Swaminathan at <firstname.lastname@example.org>, or the Technical Co-Chairs Ron Bracken at <BRACKEN_RON_C@scr.org> and Alina Deutsch at <email@example.com>.
Electronic Manufacturing Technology Symposium
April 27-29, 1998
"Electronics Manufacturing and Development for Automotives"
web page: http://www.izm.fhg.de/CPMT_Germany/
4th VLSI Packaging Workshop of Japan
Nov 30 - Dec 2, 1998
Kyoto Kokusai, Kyoto, Japan
This workshop serves the growing need of our Information-Oriented Society which is becoming more reliant on Mobile Communication, Personal Computing, and Computer Networks. These systems require faster and higher-performance microelectronics devices, which are more depended on the packaging technology. As a result, this workshop focuses on technology such as BGA, CSP, Flip-chip, MCM and bare-chip packaging.
12 copies abstract by May 15, 1998
Mail to: Fuminori Ishitsuka
Optical Hardware Systems Lab, M8-411A
NTT Opto-electronics Laboratories
3-9-11, Midori-cho, Musahino-shi
Nonvolatile Memory Technology Conference
June 22-24, 1998, Albuquerque New Mexico
For registration and exhibitors information contact:
12250 Saraglen Drive
Saratoga, CA 95070 USA
Tel: 1 408 257 5702, Fax: 1 408 285 9670
Adhesives in Electronics 98
September 28-30, 1998
Regency Hotel, Binghamton, New York, USA
Short courses offered on Sunday September 27
Tours of IBM, Universal Instruments, and SUNY Univ.
Exhibition space available.
Technical Program: Materials, Processing and Manufacturing, Properties, Applications, Design, Reliability, Environmental.
For more information contact Conference Chair, James E. Morris: <firstname.lastname@example.org> or Fax 1 607 777 4464.