Atlanta CPMT Keeps Busy
2nd Academic Conference at Georgia Tech
Below is a list of the 10 sessions for the 2nd Academic Conference held at the Georgia Institute of Technology by the Packaging Research Center, a National Science Foundation Engineering Research Center, on March 18-20. This conference involves a total of 40 papers from Japan, Singapore, China, Korea, Hong Kong, India, Germany, U.K. and the U. S. The program involves both Next Generation of Research and Education and, in each, it addresses both the ongoing programs and future challenges.

Sessions included:
Conference Overview
Electrical Design
RF and Opto Packaging
Integrated Substrates
Thermal Management
Flipchip and Underfill
Reliability
Also included were two special sessions - one relating to Electronic Packaging Education and the other about Electronic Packaging Research and Educational activities around the world in various countries.

For more information contact Rao Tummala or Debra Kelley at 1 404 894 9097 or use the web site http://www.ee.gatech.edu/research/PRC/.