23rd International Electronics Manufacturing
Technolgoy Symposium (IEMT98) Advanced Program
Monday, October 19
Flip chip, BGA and Packaging 1
8:30 am-12:00 noon
Deborah Patterson, Flip Chip and George Riley, Hycomp
**Performance of Evaporated and Plated Bumbs on Organic and Ceramic Substrates
**Integration of Flip Chip Assembly in the SMY Process:Manufacturing & Productivity Issues
**Flip-Chip Manufacturing Using Wafer-Applied Multilayer Encapsulants
**Flux-Free Process for Placement and Attach of Solder Balls to Wafers, Flip Chips and All BGA Packages
Scientific Sealing Tech.
**Zincation Characterization for Electroless
**A Parametic Study of the Design
Constraints and Manufacturing Tolerances
for Controlled Impedance TBGA Designs, 3M
Manufacturing Process and Product Improvement
8:30 am-12:00 noon
Chairs: Paul Conway, Loughborough Univ. and Qing Tan,
**Cycle Time Estimation for Printed Circuit Board Assemblies
Rensselaer Polytechnic Institute
**Implementation of a "Perfect Launch" Process in a Semiconductor Fab to Improve the Effectiveness of Automotive New Product Ramps, Harris Semiconductor
**Analysis of Factors Affecting Component Placement Accuracy in SMT Electronics Assembly
Georgia Inst. of Tech.
**Investigation of the Correlation of Peel Strength and Pad Adhesion Measurements Using Different Printed Circuit Board Base Materials, Hewlett-Packard Gmbh, PRCO
**Accompanying Quality Assurance for High Level Processing of Advanced Packages, Univ. Erlangen
**Analysis and Application of Vibration Behavior for Wire-Bonding Capillary by Transmission Laser Vibrometer,
BOARD LEVEL ASSEMBLY, 8:30 am-12:00 noon
Michael Salagoity, Solectron and N.Ekere, Univ. of Salford
**A Comprehensive Evaluation of the Strength of AART Solder Joints, Universal Instrumens Corporation
**Rapid Prototype Modeling of PCB Assembly Machines
Louisiana State Univ.
**An Intelligent Closed-Loop Control of Solder Paste Stencil Printing, Nottingham Trent Univ.
**Building Step and Repeat Lithography Sucess into HDI Process, MRS Technology
**Character Study of Direct Imaging Technique for Stencil Printing of Thick Boards in Alternative Assembly and Reflow Technology(AART), Universal InstrumentsDEK Printing Machine
**Qualification of the Tape-and-Reel Packing System Ensures Quality to the Customer, Motorola
RELIABILITY AND TEST 1:30 pm-5:30pm
Chairs: Achyuta Achari, Ford/Visteon and Scott Popelar, IC Interconnect
**Real-Time Popcorn Measurement of a Plastic Ball Grid Array Package during Solder Reflow
Express Packaging Systems, Inc.
**Effect of Solder Reflow. Temperature Profile on Plastic Package Delamination, Motorola, Inc.
**Designed Experiment to Assess Flip-Chip-On-Board (FCOB) Reliability, Lucent Technologies
**Manufacturing Test and Measurement Technology for Wideband Interconnects Using Transient Thermal Pulses
Univ. of Texas at Austin
**Nondestructive Detection of Defects in Multilayer Ceramic Capacitors Using an Improved Digital Speckle Correlation
Method with Wavelet Packet Noise Reduction Processing
City Univ. of Hong Kong
**The Implementation of an In-Scribe Product Test Strategy to Optimize Manufacturing Constraint and Improve Yield (metric) Performance, Harris Semiconductor
**Test Head Scheduling in a Semiconductor Test Facility,
Motorola, Inc. and Univ. of Texas at Austin
SEMICONDUCTOR PROCESSING 1 1:30 PM-5:00 PM
Chairs: Gerold Neudeck, Purdue Univ. and
Malcom Grief, SpeedFam
**The Reliability Improvement on Self-Aligned Contact COMS by Optimizing Poly Etching,
Semiconductor Manufacturing Company
**Atmospheric Downstream Plasma Etching of Si Wafers,
Trusi Technologies, Inc.
**In-Situ Nitride Mask Open, Applied Materials, Inc.
**In-Situ Shallow Trench Isonlation Etch with Clean Chemistry, Applied Materials, Inc.
**Stabilization of Alumina Slurries in Presence of Oxidizers for Tungsten Chemical Mechanical Polishing, Univ. of Florida
**Evaluation of Manufacturing Handling Properties of Hydrogen Peroxide Based Tungsten CMP Slurry,
EMERGING TECHNOLOGIES IN ELECTRONICS MANUFACTURING 1:30
Chairs: Hassan Hashemi, Rockwell and Kasumi Allen, Shindo
**Solderability Testing in Nitrogen Atmosphere of Plasma Treated HASL Finish PCBs for Fluxless Soldering
Univ. of Salford
**New Epoxy Molding Compound for SMT Packaging with PPF Lead Frame, Toshiba Chemical Corporation
**Surface Contamination of Bonding Pads Incapable of Au Wire Bonding, Advantest Analysis Laboratory Ltd.
**The Research University as a Place to Develop Manufacturable Niche Photonic Products, Purdue Univ.
**Low-Cost Manufacturing Strategy for Miniature Packaging
**Packaging Requirements and Solutions for CMOS Imaging Sesors,
**Development of High-K Composites for Embedded Capacitors, Georgia Institute of Technology
Tuesday, October 20
FLIP CHIP, BGA AND PACKAGING II
8:30 am-12:00 noon
Chairs: Lahki Goenka, Ford/Visteon and
E. Jan Vardaman, TechSearch International
**Evaluation of Process Parameters for Flip Chip Stencil Printing Cost Analysis: Solder Bumped Flip Chip on Board Versus Wire Bonding Chip on Board,
Express Packaging Systems, Inc.
**Squeegee Bump Technology, Motorola, Inc.
**A Novel MCM Package for RF Applications,
**Failure Modes and Effects Analysyis (FMEA) of Flip Chip Devices Attached to Printed Wiring Boards (PWB), Medronic
**Reliability Performance Assessment and Characterization of Fine Pitch Mold Array BGAs, Motorola SPS
ENVIRONMENTALLY CONSCIOUS MANUFACTURING 8:30 am-12:00 noon
Chairs: Laura Mendicino and Paul Thomas Brown, Motorola
**Development, Implementation and Verification of a Design for Environment (DFE) Methodology on a Notebook
Computer Case, Univ. of Texas & Motorola Air Products
**A Strategy for Reducing PFC Emissions, Motorola, Inc.
**Implications of EPAs Risk Management Program to Semiconductor Manufacturers, Motorola
**A Comparison of Chilled Ozone and CO2-Based Supercritical Fluids as Replacements for Photoresist-Stripping Solvents, Los Alamos National Laboratory & Hewlett-Packard
LUNCHEON SPEAKER 12:00 noon-1:00 pm
David J. Williams, Professor of Manufacturing Engineering, Loughborough University of Technology
ELECTRONIC SYSTEMS RELIABILITY PANEL
1:30 pm-5:00 pm
Chairs: Bob Munroe, Motorola and Claude Hilbert, MCC
**Board Level Reliability for a Laminate CSP, Toshiba
**Reliability Performance and Failure Mode of High I/O Thermally Enhanced Ball Grid Array Packages,
Lucent Technologies Bell Laboratories
SEMICONDUCTOR PROCESSING II 1:30 pm-5:00 pm
Chairs: Dave Kayton, Harris Semiconductor
and Walt Trybula, SEMATECH
**Effects of Epitaxial Silicon Technology on the Manufacturing Performance of Wafer Fabrication Lines
**Integration of Non Photo Sensitive Polymide into an Existing Photo Resist Process, Medtronic/Micro-Rel
**Statistical Process Control in a Wafer Fabrication Environment, Medtronic
**Using the Theory of Constraints Production Application in a Semiconductor Fab with a Reentrant Bottleneck, Harris Semiconductor
**Methodology for Optimization of Zone Control for Multiple-Lamp Wafer-Heating Systems, Eaton Corporation
**Analysis of Copper Plating Baths, Dionex Corporation
Wednesday, October 21
INTERCONNECT 8:00 am-12:00 noon
Chairs: Tom Goodman, TechSearch International and
Marnie Knadler, Abpac
**Lab Sessions and Prototyping in Interconnection and Packaging Education, Technical Univ. of Budapest
**The Viscoelastic Characteristics of Solder Paste Under High Frquency Oscillatory Shear, Univ. of Salford
**Evaluation of Conductive Adhesives for Industrial SMT Assemblies, Solectron
**A Method of Heatsink Fabrication for Millimeter Wave High-Power Gunn Devices, Hughes Research Laboratories
**Staggered Radial Bond Pad Layout with Dual Constant Wire Pitch for Bond Pad, Motorola
**Thermosonic Bonding of High-Power Semiconductor Devices for Integration with Planar Microstrip Circuitry,
Hughes Research Laboratories
**70 Micron Fine Pitch Wire Bonding,
National Semiconductor Corp.
MODELING 8:00 am-12:00 noon
Chairs: Ken Keys, Cleveland State University and
John Konopka, IBM
**Modeling via Formation in Photosensitive MCM Dielectric Materials Using Sequential Neural Networks,
Georgia Institute of Technology
**Reducing Costs and Increasing Throughout Using Model-Based Process Control on Sputtering Systems, Univ. College Cork and Texas Instruments
**Fatigue Reliability of Solder Interconnects for First and Second Level Packaging, IBM Microelectronics
**New Generation Thin Plastic Packages Deliver Higher Levels of Power and Reliability Performance, Siliconix
**Neural Network-Based Real Time Thermal Design Expert,
**Performance Enhanced Design Using C2BGA Substrate,
ProLinx. Inc. and Enabling Solutions, Inc.
Register Beginning July 21 on the web.
SEMI OnLine at <www.semi.org>
see SEMICON Southwest 98 registration form.
by fax: call 1 512 447 9378 to get forms