ITherm’98 big success in Seattle

The ITherm’98 conference in Seattle was held from May 27-30 with 225 in attendance for the 75 peer reviewed papers. On the 27th, three well attended courses were held: Thermal Design of Electronic Systems, Introduction to Thermomechanical Phenomena in Packaging, and Thermostructural Benchmarks for Packaging Analysis. The conference emphasized current cooling products and applications. Extensive discussions of air cooled heat sinks, as well as some discussion of heat pipe technology and cooling of high power electronics were included. Thermal issues related to flip chip packaging of die and electronic cooling at component level and system level were among the topics of discussion.
-- submitted by Dave Benson, ASME