ITherm98 big success in Seattle
The ITherm98 conference in Seattle was held from May
27-30 with 225 in attendance for the 75 peer reviewed papers.
On the 27th, three well attended courses were held: Thermal Design
of Electronic Systems, Introduction to Thermomechanical Phenomena
in Packaging, and Thermostructural Benchmarks for Packaging Analysis.
The conference emphasized current cooling products and applications.
Extensive discussions of air cooled heat sinks, as well as some
discussion of heat pipe technology and cooling of high power electronics
were included. Thermal issues related to flip chip packaging of
die and electronic cooling at component level and system level
were among the topics of discussion.
-- submitted by Dave Benson, ASME