Luncheons at ECTC
At the ECTC luncheon on May 26 several awards were presented. The best ECTC paper award was given for "High Performance No Flow Underfills for Low-Cost Flip-Chip Applications" by a team from Georgia Tech (C. P. Wong, S. Shi, G. Jefferson). Several papers were given the "Outstanding" rating. "Thermal Coastline-Leadframes for High Power at No Cost" by Tom Moore of Analog Devices and "Transient Liquid Phase Sintering Conductive Adhesives as Solder Replacements" by Ormet Corp. and Boeing both won these accolades.
Dr. Thomas D-Stefano of Tessera gave the presentation "Extension of Chip Scale Packaging into the Next Century". He saw the natural trend of dimension scaling on ICs as pushing the growth of function of the packaging unit, in particular the routing of clock, power, and ground.
The CPMT Luncheon was held on May 27th. CPMT President John Stafford (Motorola) summarized the challenges facing CPMT and some restructuring that is underway. Robert Hahn ("High Power MCM") was awarded the "Best Transaction Paper" by Vice President of Publications, Paul Wesling (Tandem Computers). Paul also discussed the trend to CD-ROM for proceedings (this year’s ECTC was in both paper and CD).
Prof. Kanji Otsuka of Meisei University was presented with his IEEE Fellow Certificate, the highest level of IEEE member. Dr. Mark Mielliar-Smith, the President of SEMATECH, gave a presentation "Critical Technology in the Semiconductor Industry". It was exciting to see the appreciation that silicon oriented consortium has for the efforts of the CPMT members.