Announcing the joint, international
ASME/IEEE-CPMT/IMAPS/SPE/AFM Workshop
MECHANICAL RELIABILITY OF POLYMERIC MATERIALS & PLASTIC IC PACKAGES
Sponsored by the Electrical & Electronic Packaging Division, ASME International, in cooperation with the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society, International Microelectronics and Packaging Society (IMAPS), Society of Plastics Engineers (SPE), and the
Association Francaise de Mecanique (AFM)
Paris, November 29 - December 3, 1998
Hotel Concorde Saint-Lazare, 108 rue Saint-Lazare-75008,
Tel: (33)(1)40.08.44.44, fax (33)(1)42.93.01.20
Call for Registration
WORKSHOP Polymeric materials are widely used in engineering, including the areas of microelectronics and photonics. Examples are: plastic packages of integrated circuit (IC) devices, adhesives, various enclosures and plastic parts, polymeric coatings of optical silica fibers, and even polymeric
lightwave guides. Polymeric materials are inexpensive and lend themselves easily to processing and mass production techniques. The reliability of these materials, however, is usually not as high as the reliability of inorganic materials and is often insufficient for particular applications, thereby limiting the area of the technical use of polymers. We intend to bring together mechanical, electrical, optical, reliability, industrial,
and manufacturing engineers; materials scientists, applied physicists and chemists, to discuss and advance experimental and theoretical methods, techniques and approaches aimed at the prediction and improvement of the short- and long-term performance of polymeric materials for different applications, and, particularly, those used in plastic packages of IC devices.
OBJECTIVE The objective of the workshop is to address the state-of-the-art knowledge in the field of mechanics, physics and reliability of polymers, including those employed in microelectronics and photonics engineering.
SCOPE The scope of the workshop includes, but is not limited to, the following major topics:
**mechanical behavior, and short- and long-term performance of polymeric materials
**polymeric materials characterization: thermal, mechanical, electrical, optical, and other properties of polymers
**fracture of polymeric materials
**moisture sensitivity of polymeric materials and plastic packages of IC devices
**aging and its effect on the long-term reliability of polymeric materials
**accelerated testing of polymeric materials and plastic electronic packages: approaches and techniques
**mechanics, physics and chemistry of adhesion, adhesives, and adhesively bonded joints
**stress concentration effects in polymeric materials and plastic electronic packages
**performance of polymeric materials at high and low temperatures, and in harsh environments
**role of fillers in the mechanical behavior and performance of polymeric materials
**thermal management of systems, employing polymeric materials (including electronic components and photonic devices),
**interfacial phenomena, affecting the polymeric materials reliability
**response of polymeric materials to dynamic and thermal loading
**manufacturing processes in plastics engineering
**reliability problems associated with manufacturing, testing,
surface-mounting and operation of plastic electronic packages.
TUTORIALS The program of the workshop will include tutorials (short courses) on various aspects of the reliability of polymeric materials, with an emphasis on microelectronics and photonics applications. The partial list of tutorials includes: "Failures in Plastic Packages of IC Devices: Understanding, Prediction, and Prevention" (E. Suhir, Lucent);
"Polymers for Electronic Packaging: Materials, Processes, and Reliability" (C. P. Wong, Georgia Tech.);
"Cooling of Plastic Packages of IC Devices: Application of Computational Fluid Dynamics" (D. Agonafer, IBM).
AUDIENCE Engineers and scientists dealing with, and/or interested in, the mechanical reliability of polymeric materials, especially those used in the "high-technology" field

For more information, contact:
**Dr. Ephraim Suhir, Chair, Bell Laboratories, Lucent Technologies, 600 Mountain Ave., Room 1D-443, Murray Hill, NJ 07974, USA, tel. 908-582-5301,
fax 908-582-5106, e-mail: suhir@lucent.com

**Prof. Kikuo Kishimoto, Co-Chair, Tokyo Institute of Technology, 2-12-1, O-okayama, Meguro-ku, Tokyo 152, Japan, tel&fax +81-3-5734-2501, e-mail:
kkishimoto@mep.titech.ac.jp
**Prof. Dr. Bernd Michel, Co-Chair, Fraunhofer Institute for Reliability and Microintegration, Gustav-Meyer-Allee 25, D-13355 Berlin, Germany, tel. ++49-30-46403-200, fax ++49-30-46403-211, e-mail: michel@izm.fhg.de
**Prof. Dr. Jian Lu, Co-Chair, Universite de Technologie de Troyes, 12 Rue Marie Curie, BP 2060, 10010 Trayes Cedex, France, tel. (33) 3 25715651, fax (33) 3 25715675, e-mail: lu@univ-troyes.fr

Visit the ASME web site for future announcements and updates regarding the Workshop:
http://www.asme.org/conf/POLY98/index.htm or contact:
Brian Bigalke, Meetings & Conferences, ASME, Ph: 212-705-7057 / Fx: 212-705-7856 / Email: bigalkeb@asme.org