Mechanical Reliability of Polymeric Materials & Plastic Packages of IC Devices
Hotel Concorde Saint-Lazare, Paris France -- November 29 - December 3, 1998
OBJECTIVE: This workshop is to address the state-of-the-art knowledge in the field of mechanics, physics and reliability of polymers employed in microelectronics and photonics.
SCOPE:
Mechanical behavior and short / long-term performance of polymeric materials.
Polymeric materials characterization *Thermal, mechanical, electrical, and optical properties of polymers
Fracture mechanics of polymers *Moisture sensitivity of polymers and plastic IC packages
Polymer Aging and reliability impact *Accelerated testing of plastic electronic packages
Mechanics, physics and chemistry of adhesion, adhesives and adhesively bonded joints
Stress concentration effects *Polymers at temperature and environmental extremes
Role of fillers in the mechanical behavior of polymers *Thermal management of systems with polymers
Interfacial phenomena impact on reliability *Dynamic and thermal loading of polymers
Manufacturing processes in plastics packaging *Reliability of surface mounted plastic packages
For more information of registration and possible late paper submission contact: Dr. Ephraim Suhir, email <suhir@lucent.com> or FAX 1 908 582 5106; Prof. Kikuo Kishimoto, email <kkishimoto@mep.titech.ac.jp>, FAX +81 3 5734 2501; Dr. Bernd Michel, email <michel@izm.fhg.de>, FAX ++49 30 46403 211.