POWER ELECTRONIC PACKAGING
The CPMT Power Electronics Packaging Technical Committee (TC-13)
is jointly sponsored by several organizations. One is the Power
Sources Manufacturers Association (www.PSMA.com). The PSMA has
taken a leadership role to support development of a technology
roadmap for power electronics packaging. Dr. Doug Hopkins, Chair
of the Packaging Committee, is organizing this packaging roadmap.
A supportive initiative is to determine the current status
of power electronics packaging, thereby forming a benchmark for
the roadmap. This initiative, entitled STATPEP (Status of Power
Electronic Packaging), is being undertaken by PEI Technologies
at the National Microelectronics Research Centre, University College,
Cork, Ireland, under contract to the PSMA. PEI Technologies is
a joint industry / government / university R&D organization,
partially funded by the Irish Government and based within a number
of Universities in Ireland.
The proposed STATPEP approach is to review the packaging trends
in power supply development over the last 10 to 15 years and attempt
to define experience curves which may lead to useful prediction
tools for the industry, and its suppliers and customers. It is
proposed to work within the product framework defined by the PSMA
reports on Power in the Year 2000 (Bob Freund 1994) and Power
Technology Roadmap (Don Staffiere and Jim Sarjeant, 1997). A framework
for power electronics packaging was also defined and presented
at the Plenary session of 1998 Applied Power Electronics Conference
The first meeting of the STATPEP initiative was held at APEC93
in Disneyland and attended by 12 people representing 9 companies.
The initiative requires support from the power supply industry
and its suppliers to provide matching funds and product for evaluation.
All interested parties should contact: Dr. Sean Cian Mathuna,
email: omathuna @nmrc.ucc.ie or Arnold Alderman email: firstname.lastname@example.org.