CPMT Restructures its Technical Committees
Dr. Rao Tummala, the Technical VP of our CPMT Society, proposed a restructuring plan of the Societys Technical Committees (TCs). He said the current list is outdated and the current TCs do not adequately address the growing needs of the Societys members, particularly in new and emerging technologies. He also indicated that the current TCs do not comprehensively represent the system level needs.
A team of current TC chairs led by Dr. Tummala redefined the mission of the TCs to include:
**Organizing new TCs for emerging, critical, comprehensive and system-level technologies consistent with both Industry and CPMT membership needs.
**Generating and promoting papers within its technical scope in cooperation with the CPMT Transactions Editors.
**Organize symposia, workshops, short courses on both educational and research topics at CPMT conferences and at conferences with other societies with which CPMT cooperates.
The suggested methodology involves identifying new strategic technologies, moving mature technologies to the manufacturing TC, eliminating those that are non-strategic or inactive, and identifying champion experts to head up each of the TCs. Dr. Tummala stresses the need for yearly confirmation of each of the TCs and the TC technology as a way to assure the Societys progress.
The new line up of TCs still under consideration by the CPMT Board of Governors are:
TC-1 Electrical Contacts, Connectors and Cables
Chair: Gerry Witter Vice: Gunther Horn
TC-2 Discrete and Integral Passives
Chair: Tom Reynolds Vice: Larry Mann
TC-3 IC and Package Assembly (BGA, Flip Chip)
Chair: Corey Koehler, Vice: Raj Master/ Dan Baldwin
TC-4 Manufacturing-Design and Process
Chair: Wyck Seelig Vice: Kam Yeung
Chair: Rajen Chanchani Vice: TBD
TC-6 High Density Board Packaging
Chair: Connie DEgidio Vice: TBD
Chair: Joe Mantz Vice: Kirk Gray
TC-8 Semiconductor Processing and Manufacturing
Chair: John Reekskin/Court Kinner
Vice: Henry Blazek
TC-9 Thermal Management & Therm-Mechanical Design
Chair: Tony Mak Vice: Gerard Kelley
TC-10 Fiber Optics and Photonics
Chair: Michael Libbey Vice: Laury Watkins
TC-11 Electrical Test
Chair: David Keezer Vice: TBD
TC-12 Electrical Design, Modeling, and Simulation
Chair: M. Swaminathan Vice: John Prince
TC-13 Power Electronics Packaging
Chair: Douglas Hopkins Vice: P. McCluskey
TC-14 Systems Packaging
Chair: Evan Davidson Vice: J. Kruchowski
TC-15 New Technology Directions
Chair: Ephraim Suhir Vice: TBD
TC-16 RF and Wireless
Chair: Craig Gaw Vice: Joy Laskar
TC-17 MEMS and Sensor Packaging
Chair: Karen Marcus Vice: Bill Chen
TC-18 Wafer Level Packaging
Chair: TBD Vice: TBD
Chair: Rao Tummala Vice: Paul Wesling
Dr. Tummala is requesting volunteers to fill the open positions
in the above TCs. Additional members in each of the above committees
are needed and welcome. Those interested, please get in touch
with Rao by email: email@example.com.
1998 2nd TC-9 E-Mail Newsletter