TC-6
Announcement:
TC-6 has taken on a new mission: High Density Board Technology (HDBT)
To identify and nurture the latest developments in HDBT on a global basis. This includes SLC (Surface Lamina Circuitry) - like technologies, ALVIH (any layer via interconnection), and BBIT (Buried Bump Interconnection Technology) in organic technology as well as high density ceramics capable of meeting 5K-10K I/O’s per chip.
!!!! We need help !!!!
If you can help and want to team with other experts in these fields, please contact Connie S. Swager - D’Egidio at 1 914 766 2927 or email degidio@us.ibm.com.
Thanks for your help.

Minutes from the TC-6 meeting held at 7am on May 25 in Seattle during the ECTC.
Folks...Things are changing. During the TC Chair meeting on May 23 and the BOG meeting on May 24, the mission of TC-6 has been changed. All of the action items we had on our agenda have been moved to other TCs except one.
**BGA/Chip Array, in general have moved to TC-e chaired by Corey Koehler of Motorola.
**The BGA/Chip Array Workshop, specifically will stay with TC-6 until it is executed later in ‘98. Raj Master is coordinating that effort.
**Automotive Electronics and Aerospace Electronics is now with TC-14 chaired by Evan Davidson. This expands TC-14 beyond Computer systems.
**High Temperature Electronics has been moved to Emerging Technology, TC-15, with Ephraim Suhir.
**RF Packaging is now a TC in itself. TC-16 is led by Craig Gaw.
**Good Luck to everyone as they move on to new homes. I appreciate all your help this past year. Thanks to the 8 early birds that showed up for this TC meeting.
**The new mission of TC-6 is High Density Board Technology (HDBT): To identify and nurture the latest developments in HDBT on a global basis. Our immediate goal is to solicit papers for a session at ECTC in 1999. So far Rao Bonda, John Segelken, and C.P. Wong have volunteered to help. One suggestion from George Harman is the interest in low temperature (50 C) wire bonding on FR-4 boards in high volume production. I welcome anyone else’s help as well as suggestions for folks I can recruit.
-- submitted by Connie D-Egidio, IBM