Call for Papers -- A Special Section on Microsystems Packaging
In the IEEE/CPMT Transactions on Advanced Packaging
Guest Edited by Professor Tai-Ran Hsu, San Jose State University, San Jose, California
The rapid expansion in applications of microsystems in the aerospace, automotive, biotech, communications, defense, environmental protection, medicine and pharmaceutical industries has prompted strong interest in the packaging of these systems and devices. Estimated costs related to packaging of microsystems can be as high as 75 to 95% of the total cost of the products. This high cost is mainly attributed to the unique engineering challenge of the packaging of these systems. Unlike microelectronics packaging, microsystems packaging requires not only the protection of the delicate sensing or actuating elements, but often these elements are required to be exposed to the working media, which are hostile and damaging to the sensor or actuator materials. Electromechanical packaging of microsystems is thus a critical technology in the overall product development. Established companies rarely publicize their design methodologies for commercially proprietary reasons. Consequently, comprehensive microsystems packaging design has been virtually non-existent in open literature. To address this critical problem, as well as future trends in this field, a Special Section on the packaging design of microsystems is planned for an upcoming issue of the IEEE Transactions on Components, Packaging and Manufacturing Technology, Part B: Advanced packaging.
We solicit manuscripts for this Special Section. Topics of interest are, but not limited to, as follows:
· Design methodologies (concept, analysis and optimization). · Critical issues related to microsystems packaging.
· Modeling and simulation in product packaging. · Selection and utilization of packaging materials.
· Packaging design for manufacturability. · Quality assurance and cost reductions.
· Future trends in microsystems packaging.
Prospective authors are invited to send manuscripts of 12 to 18 double-spaced pages (plus figures and tables referenced in the text) by December 31, 1998, directly to the Guest Editor. Three copies of the contribution are needed at this time (no originals). Lead authors should include a full mailing address, phone, FAX numbers and e-mail address, if available, to aid in communication. The reported material must be original, unpublished work. All manuscripts will be peer-reviewed and must follow the IEEE guidelines found on the back cover of any IEEE Transactions. Contact the Guest Editor for an author's kit with useful information for manuscript preparation.
Guest Editor: Professor Tai-Ran Hsu, Phone: (408) 924-3905; FAX: (408) 924-3995, e-mail: firstname.lastname@example.org