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Call for Papers
2nd ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC’98)
8-10 December 1998
Raffles City Convention Centre, Singapore
Organised by: IEEE Reliability/CPMT/ED Singapore Chapter
Technically Co-Sponsored by: IEEE CPMT Society in Cooperation With: ASME, IMAPS, Centre for IC Failure Analysis & Reliability, Gintic Institute of Manufacturing Technology, Institute of Materials Research and Engineering, Institute of Microelectronics, Nanyang Technological University, National University of Singapore.
OBJECTIVE
Following the great success of the inaugural Electronic Packaging Technology Conference (EPTC) in 1997 in which over 200 participated, the Second EPTC will be held in Singapore on 8-10 December 1998. The main objective is to provide a forum for package development engineers, scientists and researchers to present their findings and innovations, and to exchange ideas in electronic packaging technology. This conference is being organised by the CPMT Chapter of IEEE Singapore. The organisers aim to establish EPTC as a major electronic packaging conference in the South East Asian region where the bulk of the world’s electronic packaging activities are taking place. It is hoped that the Conference will engender useful interactions between electronic packaging engineers, scientists and researchers from all over the world.
CONFERENCE TOPICS
Papers on any aspect of electronic packaging are invited for presentation. Topics covered include:
1. Single Chip Packaging: PEM, QFP, BGA, CSP, TAB, COB, LOC, flip chip.
2. Multi-Chip Packaging: MCMs, known good die, direct chip attach, 3-D and hybrid packaging.
3. Packaging of Electronic Systems.
4. Materials and Processing: material properties, characterization and processing techniques.
5. Modeling and Simulation: thermomechanical modeling, computer simulation, design tools.
6. Assembly and Manufacturing: assembly issues, manufacturing processes and equipment, yield.
7. Interconnection Technology: wirebonding, TAB, flip chip, fine-pitch, conductive polymers.
8. Reliability: failure analysis, reliability testing and data analysis, accelerated models, pop-corning, effect of moisture, solder joint reliability.
9. Thermal Management: air cooling, liquid cooling, cooling of high-power devices, heat spreaders, heat sinks, cooling of electronic equipment.
SELECTED PAPERS FOR IEEE TRANSACTIONS
The Conference Proceedings will be an official IEEE publication. Selected papers presented at the Conference will be considered for publication in the IEEE Transactions of CPMT.
EXHIBITION
An exhibition will be held in conjunction with the Conference.
GENERAL CHAIR, Andrew Tay, National U of Singapore
SUBMISSION OF ABSTRACTS
You are invited to submit an abstract of about 500 words describing the contents of your proposed paper. You may include a few important figures. Submission of Abstracts: 30 June 1998. Abstracts should be submitted to:
EPTC’98 Secretariat CTMA Pte Ltd
425A Race Course Road
Singapore 218671
Tel: (65) 2998992, Fax: (65) 2998983, ctmapl@singnet.com.sg
INTERNET WEBSITE
For updates and further details please visit our Internet website at http://cicfar.ee.nus.sg/eptc98.html.