The
Electronic Components and Technology Conference offers papers
covering a wide spectrum of topics, including not only electronic
components, but also new developments in all areas of electronics
technology. For example, photonics packaging, assembly, reliability,
and materials have many sessions.
This is the main meeting of the CPMT Society held in partnership
with EIA. In 1998 over 240 papers, posters, and short courses
were presented by companies, universities, and research institutes
from around the world. The audience of 766 for the conference
and 391 in the ten tutorial short courses included representatives
from a multitude of universities and companies eager to stay abreast
of the rapidly changing Global Electronics Technology Evolution/
Revolution.
Topics of Interest:
Papers presenting new developments and knowledge in the following
areas are invited:
Components -- New passive or active component technologies,
integrated/embedded components, component applications, component
performance and reliability usability and reliability.
Connectors -- New or improved devices or techniques,
emphasis on high density and performance for multichip and surface
mount applications.
Education -- Education for engineering curricula
in the 21st century and collaborative research and engineering
programs between universities, government, or industry. How to
use the Internet/Computer to further working engineers’ education.
Harsh Environment Packaging -- special packaging
methods for high or low temperature, chemical plant, automobile,
space probes, long storage, high vibration electronic systems.
Interconnections -- First level, cost-effective
interconnection technologies including TAB, wirebond, flip-chip,
conductive polymers, bare chip on glass, FR4, and flex for temporary
or permanent interconnects. Special attention to an emerging technology
- high density interconnect.
Manufacturing Technology -- JIT, SPC, robotics,
design for manufacturability, ISO cost identification and control,
manufacturing processes, yield, test, manufacturing equipment.
Materials and Processing -- Adhesives, interconnection
materials, ceramics, metals, composites, thermal materials. Accommodation
of IC with Copper and Low K dielectric in the package.
MEMS and Sensor Packaging -- Special consideration
such as particle-free chip singulation, vacuum or controlled atmosphere
sealing, access to sensor by environment. A growing area with
few general techniques.
Modeling and Simulation -- Electrical, thermal,
optical and mechanical modeling, simulation and characterization.
Multichip Packaging -- Design, fabrication, new
technologies for high density / high speed applications, known-good
die (KGD), direct chip attach, MCM-C, MCM-D, MCM-L, 3-D, hybrid
packaging, SMT, thick and thin film.
Opto-Electronics -- Packaging for fiber-optic modules,
infra-red wireless, consumer opto-electronics, flat-panel, projection
and micro-displays, optical amplifiers, lasers, detectors, waveguides
OEICs, and passive components and WDMs.
Poster -- Papers can be submitted on any of the
listed major topics. The Poster sessions are integral to the meeting
with large attendance.
Quality and Reliability -- Assessment failure analysis,
reliability testing and data analysis, reliability modeling, accelerated
models, qualification of components and systems, KGD, incremental
quality improvement, TQM.
Single Chip Packaging -- New packaging technologies,
designs, materials/ configuration addressing performance, density
and cost. Special emphasis on array, fine pitch, ultrathin and
high lead count packaging, CSP, BGA enhanced SMT, DCA, COB.
Paper Submission
A 500 word abstract describing the scope, content, uniqueness
and key points of the proposed papers are required for paper selection
and session assignment. The paper must consist of work not published
or presented previously. Both oral and poster presentations are
given at the conference. However, both forms of presentation require
a manuscript. Send a copy of the abstract, outline, and no more
than two subcommittee suggestions (for which you wish the paper
to be considered) with your phone number, email address, telex
and facsimile by October 15 to: