International Flip Chip Workshop
6:00 PM on March 12 until 12 Noon on March 14.
Chateau Elan, Braselton, GA

General Chair: Dan Baldwin, Georgia Tech

Technical Chairs: Dr. Johan Liu, IVF , Sweden
Dr. Andreas Schubert, Fraunhofer, Berlin, Germany
Dr. Raj Master, AMD, USA
Past General Chair: Dr. Rao R. Tummala

Technical Sessions:
Novel Applications of Flip Chip Technology: MEMS, Optoelectronics, etc.
Low Cost Flip Chip Processing & Applications
Advanced Flip Chip Interconnect Materials & Underfills
Advances in Thermomechanical Modeling & Reliability
Advances in Flip Chip Processing & Inspection Equipment - Placement, Reflow, Inspection, Despensing, Curing

Short Courses:
Polymers in Microelectronics - Prof. C.P. Wong, Georgia Tech
Next Generation of Flip Chip - Prof. Dan Baldwin, Georgia Tech
Next Generation of Packaging - Prof. Rao Tummala, Georgia Tech

5th International Advanced Packaging Materials Conference
8:00 AM on March 15 until 12 Noon on March, 17. Chateau Elan, Braselton, GA

General Chair: Prof. C.P. Wong (Representing Georgia Tech)
Technical Chairs: Dr. Jim Morris (Representing IEEE-CPMT)
Dr. P.E. Garrou
Past General Chair: Dr. Rao R. Tummala

Technical Sessions:
Manufacturing Process Controls
Adhesives
Consumer Electronic Material Issues- Cellular Phones
Substrates, HDI, Dielectrics
Integral Passive Materials
Thermal Management Materials
Underfills & Encapsulant Materials
Interfacial Adhesion
Microwave Materials
Automotive/Harsh Environment Applications
Mechanics of Materials
Optoelectronics Materials
On-Chip Interconnect Materials

Reception & Poster Session, March 16, 6:00 PM

Packaging Research Center Tour at Georgia Tech
March 16, 2:00 PM - 6:00 PM

2nd International Academic Conference at Georgia Tech, Atlanta, GA
1:00 PM March 17 until 12 Noon March 20.

General Chair: Prof. Rao R. Tummala

Theme: Next Generation of Packaging Research & Education in the 21st Century
Research Sessions:

Design, Test, High Density Wiring, Flip Chip Assembly, Integrated Passives, Opto/RF, Thermal, and Reliability

Steering Committee
USA
University of Minnesota - Avram Bar-Cohen
University of Colorado - Roop Mahajan
Lehigh University - Ray Pearson
SUNY, Binghamton - Jim Morris
Cornell - Peter Krusius
University of Arizona - John Prince
University of Arkansas - Len Schaper
Oregon State University - Vijay Tripathi
University of Illinois - Jose Shutte-Aine
Virginia Tech - Aicha A.R. Elshabini
Paul Wesling - IEEE/TANDEM
Abroad
City U of Hong Kong - Y.C. Chen
University of Tokyo - Consortia - Prof. Tadatomo Suga
Fudan University, Shanghai, China - Prof. Xiang Fu Zong
National University - Singapore - Prof. Andrew Tay
KAIST - Taejon, Korea - Prof. K.W. Paik
Tech. University of Berlin - Prof. Herb Reichl
Indian Inst. of Science, Bangalore, India - Prof. N.J. Rao
Please contact IMAPS; Phone 703-758-1060 or 1-888-GO IMAPS; E-Mail; imaps@imaps.org to register for the first two conferences and call
or E-Mail Debra Kelley at 404-894-9097 (dkelley@ee.gatech.edu) to register for the Academic Conference.