Symposium on Microelectronics
(31st International Symposium on Microelectronics – IMAPS)
Many CPMT members are presenting or attending this meeting in San Diego from October 31 thru November 4, 1998. There are 250 presentations, 18 short courses, and a 3D packaging workshop. In parallel is the Wireless Communications Conference. One can register on-line at www.imaps.org. The short courses include:
Oct 31
Hybrid Microelectronics
Failure Analysis
MultiChip Modules
Solder Attachment Reliability for BGAs, CGAs, TSOPs
Low Cost Solder Bumped Flip chip
Adhesion Science
Wire Bonding in Microelectronics
Polymers for Electronic Packaging
Designing with Integrated Passives
Nov 1
Power Hybrid Design and Fabrication
Plated-through Holes/Vias
RF/Microwave Hybrids
Screen Printing
Micro/Chip Scale Packaging
Metal Plating for Electronics
Failure Mode Effects Analysis
Process Engineering Fundamentals
Solder Joint Reliability – Practical Perspectives

Technical Sessions include
Nov 2 AM –
Wireless Applications
Printed Wiring & Laminated Technology
Materials Characterizations
Manufacturing Optimization & Laser Processing
Emerging Technologies & MEMS Devices
Advanced Technology Power Packaging
Nov 2 PM
RF & Microwave Applications
Flex Circuits
Materials Technology
Advanced Manufacturing Processes
Ball Grid Array
High Density Power & Optoelectronic Solutions
Nov 3 AM
RF & Microwave Materials
Buildup Technology
Integrated Passives
Thermo-Mechanical Modeling
CSP Reliability
Novel Thin and Thick Film Ceramic Technologies
Nov 3 PM
Poster Session
Digital TV & Digital Display Developments
Reliability
Wire Bonding
Thermal Materials & Substrates
Flip Chip & Underfill
Ceramic for Wireless Applications
Nov 4 AM
Medical Electronics
Thick/Thin film Technologies
Reliability Testing/ Evaluation
Thermal Design & Applications
CSP Technologies
Integration of Ceramics with Si
Nov 4 PM
Developments in Intelligent transportation
Advanced Ceramic Substrate Technology
Systems Reliability
Sensors
Thermal Modeling & Processes
Plenary Session

On Sunday, November 1, Tom Borden of JPL and Jim Lyke of the USAF Phillips Labs will put on an Advanced Technology Workshop entitled "3D Packaging"

To phone in registration with Credit card: 1 888 464 6277 or 1 703 758 1060.