OFFICERS & BOARD OF GOVERNORS
President--John Stafford, 1 602 413 5509
Tech VP--Rao Tummala, 1 404 894 9097
Admin VP--H. Anthony Chan, 1 732 957 6754
Treasurer--L. Merrill Palmer, 1 619 675 2889
VP Publication--Paul B. Wesling,1 408 285 9555
VP Conferences--James Morris, 1 607 777 4774
VP Education--Albert Puttlitz, FAX 802 879 0466
Sr. Past President--Dennis Olsen, 1 602 413 5673
Jr. Past President--Ralph Wyndrum, 908 949 7409
Secretary--Ron Gedney, 1 703 834 2084
Executive Director-- Marsha Tickman,
1 732 562 5529

Elected Members at Large
1998 1999
Michael Lebby James E Billigmeier
Koji Nihei Harry K.Charles, Jr.
Ralph W. Russell Darvin R. Edwards
Barbara T. Reagor Philip E. Garrou
Elke Zakel Wulf Knausenberger
Harvey Miller Ephraim Suhir
2000
William Chen Craig Gaw
Tony W. C. Mak Larry Mann
John Segelken C. P. Wong

Standing Committee Chairpeople
Academic Affairs--Olgierd Palusinski
Educational Activities-- L. Mann
Distinguished Speakers-- A. F. Puttlitz
Fellows Search--Rao Tummala
Fellows--George G. Harman
Constitution & Bylaws--David W. Palmer
Finance--Ralph Wyndrum, Jr.
Long Range Planning--Dennis Olsen
Standards Chair - "Jack" Balde. 908 788 5190
Circuits and Devices magazine Editor--Joe Brewer, 904 445 8971
Membership--Ralph Russell, email: cpmt-membership@ieee.org
Chapter Development--R. W. Russell, II, cpmt-membership@ieee.org
Nominations--John Segelken, 1 803 939 2333
International Relations-- Leo Feinstein, 508 870 0051; Europe=Ephraim
Suhir, 908 582 5301; Far East= W. T. Chen, 65 874 8110
Joint Committee on Semiconductor Manufacturing--G. C. Cheek
Technical Committee Chairpeople
TC-1 Electrical Contacts, Connectors and Cables--
Gerald Witter, 708 244 6025
TC-2 Discrete and Integral Passive Components--T. Reynolds, Murata-Erie, 404 433 7825
TC-3 IC and Package Assembly -- C. Koehler, 602 413 5663
TC-4 Manufacturing Design & Process--Wyck Seelig, 908 771 2440
TC-5 Materials--Rajen Chanchani, 505 844 3482
TC-6 High Density Board Packaging--Connie D’Edgidio, 954 958 6916
TC-7 Environmental Stress & Reliability Test--Joseph Mantz, 425 702 2709
TC-8 Semiconductor Processing & Manufacturing--John Reekstin,
714 762 5077: Court Skinner, 408 721 7420
TC-9 Thermal Management & Thermomechanical Design--
Tony Mak, 508 853 5000
TC-10 Fiber Optics & Photonics-- Michael Lebby, 717 985 2535
TC-11 Electrical Test -- David Keezer, 404 894 4741
TC-12 Electrical Design, Modeling and Simulation--
Madhavan Swaminathan, 404 894 3340
TC-13 Power Electronics Packaging--Doug Hopkins, 607 729 9949
TC-14 Systems Packaging--Evan Davidson, 1 914 435 4810
TC-15 New Technology Directions--Ephrain Suhir, 908 582 5301
TC-16 RF and Wireless-- Craig Gaw, 602 413 5920
TC-17 MEMS and Sensor Packaging-- Karen Markus, 919 248 1437
TC-18 Wafer Level Packaging--Phil Garrou, 919 248 9261
TC-19 Education--Rao Tummala, 404 894 9097