Mechanical Reliability of Polymeric Materials & Plastic Packages of IC Devices
Hotel Concorde Saint-Lazare, Paris France -- November 29 - December 3, 1998
OBJECTIVE: This workshop is to address the state-of-the-art knowledge in the field of mechanics, physics and reliability of polymers employed in microelectronics and photonics.
SCOPE:Mechanical behavior and short / long-term performance of polymeric materials. *Polymeric materials characterization *Thermal, mechanical, electrical, and optical properties of polymers, * Fracture mechanics of polymers *Moisture sensitivity of polymers and plastic IC packages.* Polymer Aging and reliability impact *Accelerated testing of plastic electronic packages, *Mechanics, physics and chemistry of adhesion, adhesives and adhesively bonded joints, *Stress concentration effects *Polymers at temperature and environmental extremes, *Role of fillers in the mechanical behavior of polymers *Thermal management of systems with polymers, *Interfacial phenomena impact on reliability *Dynamic and thermal loading of polymers
For more information on registration Dr. Ephraim Suhir, email <suhir@lucent.com> or FAX 1 908 582 5106; Prof. Kikuo Kishimoto, email <kkishimoto@mep.titech.ac.jp>, FAX +81 3 5734 2501; Dr. Bernd Michel, email <michel@izm.fhg.de>, FAX ++49 30 46403 211.