Announcing the 2nd Annual
ASME / IEEE-CPMT / SPE / AFM Workshop (POLY’99)
" POLYMERIC MATERIALS FOR MICROELECTRONICS & PHOTONICS
APPLICATIONS:
MECHANICS, PHYSICS, RELIABILITY, PROCESSING"
Paris, France / December 12-15, 1999
Sponsored by the American Society of Mechanical Engineers (ASME
International),
in Cooperation with the IEEE Components, Packaging & Manufacturing
Technology Society (IEEE-CPMT);
Society of Plastics Engineers (SPE); Materials Research Society
(MRS); Association Francaise de Mecanique (AFM)
CALL FOR PAPERS
www.asme.org/conf/POLY99/index.htm
WORKSHOP:
Polymeric materials are widely used in engineering, including
the areas of microelectronics and photonics. Examples are: plastic
packages of integrated circuit (IC) devices, adhesives, various
enclosures and plastic parts, polymeric coatings of optical silica
fibers, and even polymeric lightguides. There are numerous and
rapidly growing opportunities for the application of polymers
for diverse functions in the "high-technology" field.
Polymeric materials are inexpensive and lend themselves easily
to processing and mass production techniques. The reliability
of these materials, however, is usually not as high as the reliability
of inorganic materials and is often insufficient for particular
applications,. thereby limiting the area of the technical use
of polymers. We intend to bring together mechanical, electrical,
optical, reliability, industrial and manufacturing engineers;
materials scientists, applied physicists and chemists, to discuss
and advance experimental and theoretical methods, techniques and
approaches aimed at the prediction and improvement of the short/long-term
performance of polymeric materials for different applications,
and particularly those used in plastic packages of IC devices.
OBJECTIVE:
The objective of the workshop is to address the state-of-the-art
knowledge in the field of mechanics, physics and reliability of
polymers employed in microelectronics and photonics engineering.
SCOPE:
The scope of the workshop includes, but is not limited to, the
following major topics:
Mechanical behavior and short and long-term performance of polymeric
materials;
Polymeric materials characterization;
Thermal, mechanical, electrical, optical and other properties
of polymers;
Fracture mechanics of polymeric materials;
Moisture sensitivity of polymeric materials and plastic packages
of IC devices;
Organic microelectronics;
Polymer lightguides;
Aging and its effects on the long-term reliability of polymeric
materials;
Thermal and electric field effects on damage and fracture of polymeric
materials;
Accelerated testing of polymeric materials and plastic electronic
packages: approaches and techniques;
Mechanics, physics and chemistry of adhesion, adhesives and adhesively
bonded joints;
Stress concentration effects in polymeric materials and plastic
electronic packages;
Performance of polymeric materials at high/low temperatures and
in harsh environments;
Role of fillers in the mechanical behavior and performance of
polymeric materials;
Thermal management of systems employing polymeric materials (including
electronic components and photonic devices);
Interfacial phenomena affecting the polymeric materials reliability;
Response of polymeric materials to dynamic and thermal loading;
Manufacturing processes in plastics engineering;
Reliability problems associated with manufacturing, testing, surface-mounting
and operation of plastic electronic packages.
New and emerging technologies for future electronic and photonic
systems.
TECHNICAL COMMITTEE, INTERNATIONAL LIAISONS, KEY-NOTE AND
INVITED SPEAKERS (Preliminary and Partial List): D. Agonafer,
IBM, USA; A. Chudnovsky, University of Illinois at Chicago, USA;
L. Dhar, Lucent Technologies, USA; R. Dudek, Fraunhofer Institute,
Germany; T. Ishigure, Keio University, Yokohama, Japan; G. Harman,
NIST, USA; K. Kishimoto, Tokyo Institute of Technology, Japan;D.
Ingman, Technion, Israel; L. Keer, Northwestern University, USA;
Y. Koike, Keio University, Japan; J. Liu, Institute for Production
Engineering Research, Sweden; J. Lu, Universite de Technologie
de Troyes, France; B-J. Lwo, Chung-Cheng Institute of Technology,
Taiwan; S. Matsuoka, Brooklyn Polytechnic University, USA; J.
Morris, Binghamton University, USA; B. Michel, Fraunhofer Institute,
Germany; O. Nalamasu, Lucent Technologies; M. Pecht, University
of Maryland, USA; J. Stafford, Motorola,USA; E. Suhir, Lucent
Technologies, USA; A.Tay, National University of Singapore, Singapore;
R. Tummala Georgia Institute of Technology, USA; P.Wiltzius, Lucent
Technologies, USA; C.P. Wong, Georgia Institute of Technology,
USA; R. Wool, University of Delaware, USA; R. Wyndrum , AT&T
Laboratories, USA, S. Yi, Nanyang Technological University, Singapore;
G. Zaikov, Russian Academy of Sciences, Russia.
TUTORIALS:
The program of the workshop will include tutorials (short courses)
on various aspects of the reliability of polymeric materials for
microelectronics and photonics applications. The partial list
of tutorials includes:
Failures in Plastic Packages of IC Devices: Understanding, Prediction
and Prevention / Instructor: Ephraim Suhir, Lucent Technologies,
USA
Polymers for Electronic Packaging: Materials, Processes and Reliability
/ Instructor: C.P. Wong, Georgia Tech, USA
Application of Computational Heat Transfer to Thermal Management
of Plastic Packages of IC Devices/Instructor: Dereje Agonafer,
IBM, USA
AUDIENCE:
Engineers and scientists dealing with, and/or interested in the
mechanical reliability of polymeric materials... especially those
used in the "high-technology" field.
SUBMISSION OF ABSTRACTS:
Prospective authors should submit a 300-word abstract (with complete
business/e-mail addresses, and phone/fax numbers) by July 1, 1999
to the following workshop paper coordinator or to the general
chairman of the workshop:
DAPHNE McINTYRE
TECHNICAL PAPER COORDINATOR
311 - 46 Avenue, S.W., Calgary, Alberta,
Canada T2S 1B5
Ph: 403.287.1804 / Fax: 403.287.0659
e-mail: daphnem@netcom.ca
Dr. EPHRAIM SUHIR, GENERAL CHAIRMAN
Bell Laboratories
600 Mountain Ave., Room 1D-443,
Murray Hill, NJ 07974 USA
Ph: 908.582.5301 / Fx: 908.582.5106
email: suhir@lucent.com
www.asme.org/conf/POLY99/index.htm
Deadlines:
Electronic and Hard Copy Submission of Paper Abstract:
July 1, 1999
Author Notifications of Abstract Acceptance: July
15, 1999
Full Paper Submission: August 1,
1999
Acceptance Notifications: August 15, 1999
Revised Paper Submission: September 1, 1999
POLY’99 INTENT TO PARTICIPATE
Mail/Fax to: B. Bigalke, ASME Int’l., Three Park Ave., NY,
NY 10016, USA / Fx: 212.591.7856 / Ph: 212.591.7057 / Email:
bigalkeb@asme.org
PRCODE: PARIS99
Visit the ASME/POLY’99 web site for hotel information;
program announcements, updates and abstract submission guidelines.
www.asme.org/conf/POLY99/index.htm
or contact: Brian Bigalke, Meetings & Conferences, ASME International
Tel: 212.591.7057 / Fax: 212.591.7856 / Email: bigalkeb@asme.org