IEEE European Systems Packaging Workshop
January 25th - 27th, 1999

The Blarney Park Inn, Blarney Ireland
Monday, Jan 25th
Lunch at 12:00 Noon

Session I Telephone and Satellite Technology
Chairs Kari-Pekka Estola NOKIA
Petri Savolainen, NOKIA

1.- System Design aspects for Telephone Technology -- Jan Johansson, Ericsson
2.- Technical Solutions for Wireless Communications Systems -- David Pedder, Mitel
3.- Low Power RF for Project Bluetooth -- Holger Hussmann, Nokia
4.- On Microwave MCMs in PTFE --
Leif Bergstedt, Ericsson (Tentative) ( An invited paper)
5.- Micromechanical Systems for RF -- N.N. Phillips, IMEC

5:00 PM Reception and Dinner at 6:30 PM
8:00 PM Session II High Density Interconnect and MEMS
Chairs: Daniel Lambert, BULL -- Eric Beyne, IMEC

1.- Heterogenous Integration
Gerard Nicolas, LETI and John Barrett, NMRC
2.- CUMULUS: Wafer level Chip Scale Packaging
Eric Beyne, IMEC
3.- Direct chip-to-Chip contacts or Chip Flex Interconnects Through
the use of Very Thin Anisotropic films Claude Massit, Matra Space
4.- Packaging Issues for a Sensor for Fat and Protien in Milk
Cian O'Mathuna, NMRC

Tuesday Morning - breakfast 7:30 AM

9:00 AM Session III European Union Packaging Projects
Chairs: John Barrett, NMRC -- David Pedder, MITEL

1.- European Union Packaging Projects -- Dave Pedder, Mitel
2.- EUREKA Industrial Initiative for Microsystem Uses
N.N Phillips , IMEC
3.- BATEL: A European Chip Scale Packaging Project
( Speaker TBD )
4.- A review of Current European Activities in MST Packaging
J.M. Wilkinson, Technology for Industry
5.- EP-MCM: High Density Packaging for European Manufacturers
Rory Doyle, NMRC

Free Afternoon to visit Kinsale, Blarney Castle, Cork

Dinner 6:30, open bar at 5:00PM

8:00 PM Session IV Advanced Interconnection I
Chair: Johan Liu, IVF Tim Lenihan, Sheldhl
1.- Development of Smart Cards using Light-Curable Adhesives
Katrin Persson, Arun Junai and Johan Liu, IVF
2.- FLINT - Fine Feature built up PCBs ( Speaker TBD )
3.- HICAAP: Power Electronics Packaging of Integrated Convertor
Modules for Photovoltaic Applications -- Mike Meinhardt, PEI Technologies
4.- Packaging for a Microrelay -- ( TBD ) IMEC

Breakfast 7:30 AM

9:00 AM Session V Advanced Interconnection Applications II
Chair: Johan Liu, IVF & Tim Lenihan, Sheldahl

1.- HIPERPRINT: High Performance PCBs for
Telecommunicaitons and RF Applications
Maria Vereeken, IMEC-INTEC
2.- Interconnection Technologies, Very Fine Line Thick Films
Jean-Claude Tual, Matra Marconi Space
3.- Advanced Interconnect using microvia technologies
Tim Lenihan, Sheldahl
4.- New Possibilities for Microwave and Millimeter Wave Systems
through the use of Microwave MCM-D with Integrated Antennas
Steven Brebels, IMEC
5. MCM / PCB Interposers
Didier Sampson, Matra
6.- FLIPPAC: High Density Assemblies for Information Processing and
Communications
Daniel Lambert, Bull

12:00 Lunch

1:15 Arranged tour of the NMRC Laboratories at Lee Maltings, UCC. Cork

See Cork Ireland meeting details at NMRC Home Page [http://nmrc.ucc.ie]

Submitted by John Barrett, NMRC
General Chair
and John Balde, IDC, Program Chair

John W. Balde , Senior Consultant
Interconnection Decision Consulting
Flemington, New Jersey U.S.A
908-788-5190 Phone, 908-782-3351 Fax