HIGH DENSITY PACKAGING
HDP '99 Technical Program
Denver, Colorado --- Adam’s Mark Hotel
For more information [www.imaps.org]

Wednesday April 7
Morning
Session WA1: Advanced Materials
9 am - Noon
Session Chairs:
Dave Kellerman, Materials Solutions
Daniel Amey, DuPont
3-Layered 3D Flex Based MCM: Electrical Characterization and Reliability Issues
A. P. Malshe, W.B. Morrison, R.A. Railkar, W. D. Brown, University of Arkansas (HiDEC-MEEG); T.G. Lenihan, University of Arkansas/Sheldahl, Inc.
Comparison of Die Level Stress with Convection and Variable Frequency Microwave Encapsulant Curing for Chip-on-Board
Yida Zou, R. Wayne Johnson, Jeffery C. Suhling, Auburn University; Joe Harris, Cheryl Kromis, Nextek, Inc.; Iftikhar Ahmad, Denise Tucker, Zak Fathi, Lambda Technologies
Laminate Compatible AvatrelTM Dielectric Polymers
R. Shick, W.C. McDougall, S. K. Jayaraman, B. L. Goodall, L. F. Rhodes, BF Goodrich Company; P. Kohl, S. A. Bidstrup-Allen, P. Chiniwallay, Georgia Institute of Technology
GeleaseTM – How to Solve your Problems with Grease Pump-Out during Temperature Cycling
Ron Hunadi, Rich Wells, Jason Sanders, Lisa Pecorari, Thermoset, Chemical Products Division
Cost Trade-offs of Constrained Sintering of Low Temperature Cofired Ceramic
Jay Page, D. I. Amey, R. Draudt, S. J. Horowitz, E. Polzer, J. Cicognani, H. Kojo, DuPont
Aluminum Silicon Carbide (AlSiC) Thermal Management Packaging for High Density Packaging Applications
Mark Occhionero, Robert A. Hay, Richard W. Adams, Kevin P. Fennessy, Ceramics Process Systems Corp.
Session WA2: MCM-L
9 am - Noon
Session Chairs:
Bill Petefish, W.L. Gore & Assoc.
Cameron Ogden, HADCO Corp.
Low Cost Few-Chip XLAMTM BGA Packages
Larry Smith, C.H. Ang, MicroModule Systems (MMS); Foo-Ming Fu, Dean Perkins, Compaq Computer Corporation
Reflow-Curable Polymer Fluxes for Flip Chip Encapsulation
M. Albert Capote, Sherry Zhu, Ligui Zhou, Anguila Technologies, Inc.; R. Wayne Johnson, Jeff Suhling, Auburn University
Multichip Modules with Laminated MicroInterconnect
John Schultz, Y. Kevin Chen, Bill Egbert, Didier Kane, 3M
Multilayer Planarization of Polymer Dielectrics
Punit Chiniwalla, Rahul Manepalli, Kimberly Farnsworth, Mary Boatman, Brian Dusch, Paul Kohl, Sue Ann Bidstrup-Allen, Georgia Institute of Technology
Multichip Modules for Automotive Applications
Arzu Simsek, Wilhard Strohschein, Herbert Reichl, Fraunhofer Institut FhG-IZM
Diagnosis, Analysis and Feedback System in MCM-L Production
Jukka Kivijarvi, Nokia Mobile Phones Ltd.
Is Palladium Finishing a Real Enabler in the Hybrid MCM-L PBGA Module Arena?
Stefano Oggioni, IBM Italy
Session WA3 (Invited Papers): Technologies for Satellite Radio
9 am - Noon
Session Organizer: Jack Balde, IDC
Session Chairs:
Augustin Coella-Vera, Alcatel Space
Leon Alkalai, Jet Propulsion Labs
Adaptive Method for Reducing Clock Skew in an Accumulative Z-Axis Interconnect System
Lee Boyce, Gary Bolotin, Jet Propulsion Laboratory
Microwave (12-30 GHz) MCM-D Functions
EricBeyne, IMEC; TBD, Alcatel
Use of Encapsulated Devices in Space Applications; Do We Need Ruggedization?
Christian Val, 3D Plus
X2000 Program Modular 3D Interconnect Avionics Architecture for Deep Space Applications
Don Hunter, Jet Propulsion Laboratory
Advanced Packaging Technologies used in NASA’s 3D Space Flight Computer
Leon Alkalai, Jet Propulsion Laboratory
Hybrid 640 Mbits 3D Memory Stack
S.Albinet, N.Venet, A.Coello-Vera, Alcatel Space
afternoon
Session WP1: Applications
2 pm - 5 pm
Session Chairs:
Leonard Schaper, University of Arkansas (HiDEC)
Theodore Tessier, Micro Systems Engineering
Improving World’s Smallest GPS: CSP vs. Wire Bond
Michael Scheffler, Etienne Hirt, Jean-Pier Wyss, Gerhard Troster, Swiss Federal Institute of Technology
A 3-Dimensional MCM-L Technology for High Reliability Medical Electronics Applications
Theodore G. Tessier, M. Johnson, D. McCann, Micro Systems Engineering; M. Schaldach, J. Muller, Micro Systems Engineering GmbH; U. Franke, M. Starke, Biotronik GmbH
A Multi-Chip Module for Physics Experiments
Silvano Motto, R. Mariani, S. Giovannetti, CAEN Microelettronica; A. Benso, S. Chiusano, P. Prinetto, Politecnico di Torino
A Novel MCM Structure for High Performance Digital and Mixed Signal Applications
Christopher Cotton, Dennis Kling, Raytheon Company; Timothy Schaeffer, Mayo Foundation
On the Use of Bare-Die FPGAs in Miniaturized Systems
Claudio Truzzi, Eric Beyne, IMEC
Fujitsu/Sun UltraSparcIIi Processor Based MCM
Michelle Hou, Fujitsu Microelectronics; Dev Malladi, Chris Furman, Maryjane Krebser, Steve Boyle, Sun Microsystems
Session WP2: Design & Test
2 pm - 5 pm
Session Chairs:
Cynthia Martin, Intel; Greg Peterschmidt, Mentor Graphics
Laser Testing of MCM-D Structures
Deborah M. Mechtel, United States Naval Academy; Harry K. Charles, Jr., A. Shaun Francomacaro, The Johns Hopkins University APL
New CAD Strategies for IC/Package Co-design
Linh M. Nguyen, M.A. Maher, Tanner Research, Inc.
Product-Design Planning and Thermal Management are Best Friends in a Set-Top Terminal
Gino Caporizzo, Frank Mittal, General Instruments Corporation
Voltage Ringing Control for Coupled RLC Interconnects in High-Speed PWB Designs
Chia-Chi Chu, Jau-Yien Lee, Yen-Ping Cheng, Wen-Liang Tseng, Chang Gung University; Happy T. Holden, Westwood Associates, Inc
Analysis of Crosstalk Energy Applied to Ultra-High-Speed Parallel Microstrip and Strip Lines with Conductor Thickness and Shielding Effectiveness
Settapong Malisuwan, Vichate Ungvichian, Florida Atlantic University; Lin Lu, Qualcomm, Inc.
Innovative Packaging Solution to withstand Harsh Environment just with Cots Components Inside
Marylise Hie, Dassault Electronique
Feasibility Analysis to Reduce Cycle Time of Advanced Package Design
Kevin Rinebold, Xynetix Design Systems, Inc.
Session WP3: CSP
2 pm - 5 pm
Session Chair:
Glenn W. Gengel, Sheldahl, Inc.
Chip Scale Package Integrity Assessment by Isothermal Aging
Reza Ghaffarian, Jet Propulsion Laboratory
High Density Wirebond Packages: Chip Scale and New Chip Scale PBGAs
M. J. Kuzawinski, IBM
Active Pixel Sensor (APS) Package
Frederick R. Hyatt, Taichaun Ding, Tong Hsing Electronic Ind., Ltd.; Carl Lehtonen, Ray Petit, Silicon Coast, Inc.
A Pentium Micro-Motherboard using Multiple CSPs for Mobile and Embedded Systems
Howard Green, Cell Computing, Inc.
Substrate Requirements for Effective Integration of Chip Scale Packages and Multichip Modules in Portable Wireless Products
Tom Swirbel, Motorola, Inc.
Three Dimensional High Density MCM Package Assembly and Analysis
M. Nakkar, P. Franzon, A. Glaser, M. Roberson, K. Williams, G. Rinne, NC State University
Thursday April 8
Session THA1: Substrate Processing
9 am - noon
Session Chairs:
Albert Lin, Apack Technologies, Inc.
Yee L. Low, Lucent Technologies
A New MCM-D Technology with In-substrate Passive and Active Functions and Wafer-Scale Flip-Chip BGA
Emmanuel Chataigner, Dassault Electronique; Joaquin Lopez Contreras, DICRYL
Passive Integration Process on Standard and High Resistivity Silicon
Hannu P. Kattelus, H. Ronkainen, T. Riihisaari, VTT Electronics
RF-Characterization of PBO/Cu-Technology
Alexander Dabek, H. Hedler, N. Ammann, P. Heide, Siemens AG
Solutions to the Need for Higher Interconnect Density on PWBs: Build up Technology and Micro Vias
Daniel Lambert, Jean Joly, Bull TPAM
Advanced Via Hole Plugging Methods for HDIS Applications
Stephen G. Pierce, North Corporation (USA), Inc.
Plasma Processed Flexible and Rigid-Flexible HDIs and MCMs
Walter Schmidt, Dyconex Ltd.
Session THA2: RF and Telecom
9 am - noon
Session Chairs:
Eric O.L. Beyne, IMEC
David Pedder, Mitel Semiconductors
Role of Packaging and Interconnections in Cellular Phones
Helena Pohjonen, Nokia Mobile Phones
Single-Chip or Single-Package Radios
S. Donnay, P. Wambacq, M. Engels, I. Bolsens, IMEC-VSDM
A MCM Single-ended Downconverter for the DCS1800 Mobile Phone Band
Colin Faulkner, Ronald Arnold, David Pedder, Mitel Semiconductor
Design and Test of Microwave Modules
Tarja A. Juhola, Cornell University; Boris Kerzarl, Mehran Mokhatari, Lester F. Eastman, Royal Institute of Technology
A Digital Cellular Phone MCM – A Manufacturing Report
Georg Meyer-Berg, Siemens AG
Microwave MCM-C Utilizing Low Loss LTCC and Photo-patterning Processes
Charles J. Sabo, Michael P. O’Neill, Peter Barnwell, Heraeus Cermalloy
Session THA3: Interconnect
9 am - noon
Session Chairs:
George G. Harman, NIST; Lee R. Levine, Kulicke & Soffa
Micro-Jet Printing of Solder and Polymers for Multi-Chip Modules and Chip-Scale Packages
Donald J. Hayes, David B. Wallace, W. Royall Cox, MicroFab Technologies, Inc.
3D Si-onSi Stack Package
Helmut Kanbach, J. Wilde, Daimler Benz AG Research and Technology; F. Kriebel, KSW Microtec GmbH; E. Meusel, Dresden University of Technology
Development of Solderless Joining Technologies Using Conductive Adhesives
Hiroaki Takezawa, Matsushita Electric Industrial Co., Ltd.
TBD
Mark A. Eshelman, Jon W. Brunner, Ivy Wei Qin, Kulicke and Soffa Industries, Inc.
Thermosonic Gold Wirebonding to Electrolessly-Metallized Copper Bondpads over Benzocyclobutene
Richard K. Ulrich, Mohammed Wasef, University of Arkansas
Wire Bonder Process Optimization and Mechanical Configuration for Palladium-Plated Leadframes
Anand A. Shukla, Kulicke & Soffa Industries, Inc.; Rodel Roderos, Liygie Olimpo, Texas Instruments Philippines, Inc.
afternoon
Session THP1: MCM-C&D
2 pm - 5 pm
Session Chairs:
Rick Sigliano, Kyocera America; Chung Ho, MicroModule Systems
A New 16 x 16 ATM Switching Multichip Module with High Performance
Youngmin Lee, D.E. Chung, S.P. Lee, J.H. Na, C.W. Ju, Seong-Su Park, Min Kyu Song, ETRI Microelectronics Technology Laboratory
Multilayer High Density Interconnect Flex
Bill Chou, S. Beilin, J. Jiang, M. Lee, M. McCormack, M. Peters, Y. Takahashi, V. Wang, Fujitsu CPT, Inc.
Performance of LTCC Materials Systems in 2-GHz Resonator Applications
Michael R. Ehlert, National Semiconductor Corporation; Rick Draudt, DuPont Electronics
80-Gbit/s MCM-C Technologies for High-Speed ATM Switching System
Katsuhito Okazaki, Nobuaki Sugiura, Akio Harada, NTT
Large Area LTCC Substrate and High Density Off-Module Interconnect Developments
Edward G. Palmer, C. Michael Newton, Harris Corp.
Fabrication of a High-Density MCM-D for a Pixel Detector System using a BCB/Cu Technology
M. J. Toepper, L. Dietrich, G. Engelmann, S. Fehlberg, J. Wolf, O. Ehrmann, H. Reichl, TUB/Fraunhofer IZM; P. Gerlach, K.-H. Becks, University of Wuppertal
Thermal Behavior Analysis of a MCM-D Technology
Enric Cabruja, M. Lozano, J. Santander, A. Collado, M. Ullan, E. Lora-Tamayo, CNM-IBM (CSIC)
Session THP2: Electrical Modeling & Analysis
2 pm - 5 pm
Session Chairs:
Ronald J. Lomas, Univ. of Michigan
Mary Ann Maher, Tanner Research
Transmission Line Clock Driver
Matthew E. Becker, Thomas F. Knight, Jr., MIT
Quantifying the Impact of a Non-Ideal Ground Return Path
Andrew Byers, Melinda Piket-May, University of Colorado; Steve Hall, Intel Corporation
Microwave Frequency Model of Flip-Chip Interconnect using Anisotropic Conductive Film
Woonghwan Ryu, Myung-Jin Yim, Junho Lee, Young-Doo Jeon, Seungyoung Ahn, Kyung-Wook Paik, Joungho Kim, KAIST (Korea Advanced Institutes Science and Technology); Young-hwan Yun, Seog-heon Ham, Yong-hee Lee, Samsung Electronics
Equivalent Circuit Synthesis of Two-Port Embedded Passive Components
Kwang Lim Choi, Madhavan Swaminathan, Georgia Institute of Technology
Using Combined SPICE-FDTD Simulation to Model High-Speed Systems
Ian Rumsey, Jason Mix, Melinda Piket-May, University of Colorado
Modeling and Electrical Analysis of Seamless High Off-Chip Connectivity (SHOCC) Interconnects
L.W. Schaper, S. Alfonso, J. P. Parkerson, W. D. Brown, S. S. Ang, H. A. Naseem, University of Arkansas (HiDEC)
Electrical Design of a MCM for a 2.5 Gbps Network Switch
P. Vichot, G. Clatterbaugh, B. Grabow, The Johns Hopkins University; M. Piket-May, University of Colorado at Boulder
Session THP3: Flip Chip
2 pm - 5 pm
Session Chairs:
Deborah Patterson, Flip Chip Technologies
Glenn A. Rinne, Unitive Electronics
The Use of Area I/O or a Look at Future Architectures
Etienne Hirt, Michael Scheffler, Gerhard Troster, Swiss Federal Institute of Technology
Flip Chip on Laminate Manufacturability
Jing Qi, R. Wayne Johnson, Auburn University; Erin Yeager, Mark Konarski, Larry Crane, Loctite Corporation
Process and Reliability Characteristics of Polymer Flip Chip Assemblies Utilizing Stencil Printed Thermosets & Thermoplastics
Richard Estes, Polymer Flip Chip Corp.
Generic Fatigue Model for 1st and 2nd-Level Interconnects with and without Chip Underfill
Giulio Di Giacomo, Li Li, IBM Microelectronics
TBD
C. Dustin Johnson, Brett Fennell, Daniel Baldwin, Georgia Institute of Technology
Design for Reliability in Flip Chip Applications
Hong Yang, Jim Leal, Flip Chip Technologies
High Alignment Accuracy (1m) Flip Chip Bonding Technology for Opto Electronics Devices
Akira Yamauchi, Toray Engineering Co., Ltd.
Friday April 9
Morning
Session FA1: Reliability
9 am - Noon
Session Chairs:
Jesse S. Jaspal, IBM
Richard Ulrich, University of Arkansas
Future Packaging Reliability Testing
Thomas C. Evans, Symbios Logic, Inc.
Real-time Measurement of Thermally Induced Warpage for Packages Subjected to Soldering Reflow Temperature Profile by Phase-shifting Shadow Moiré Technique and ESPI Technique
Prof Sheng Liu, Jiabin Dai, Wayne State University; Hua Lu, Motorola, Inc.
Integrated Processing Mechanics Modeling and Monitoring for Stress Build-up on Wafer Processing and Packaging
Zhengfang Qian, Jianjun Wang, Sheng Liu, Wayne State University; Yifan Guo, Motorola
Intermetallic Growth in Small Ball Bonds
Klaus Dittmer, Suresh Kumar, Frank Wulff, K&S Packaging Materials Group
Underfilling BGA and CSP for Harsh Environment Deployment
Steven J. Young, Computing Devices
Use of Plastic Encapsulated Devices in Space Applications. Do We Need Ruggedization?
Christian M. Val, 3-D Plus; Marc Billot, French Space Agency
Using Thermal Stress Simulation to Estimate Stacked Memory Module Reliability under Thermal Cycle Test
Sakae Kitajo, Seiichiro Ohkawa, Naoji Senba, Katsumasa Hashimoto, Nobuaki Ebihara, NEC Corporation
Session FA2: Integrated Passives
9 am - Noon
Session Chairs:
Timothy Lenihan, Sheldahl
Howard M. Clearfield, Dow Chemical Company
Non-trimmed Buried Resistors in Green Tape Circuits
Joseph R. Rellick, DuPont Electronic Materials
Embedded Capacitors and Resistors within Low Temperature Cofired Ceramic on Metal (DiPak) Multilayer Packages for Millimeter Wave Applications
William A. Vitriol, David Bates, Bob Street, DLI
Integrated Thin Film Capacitor Arrays
David Liu, M. Kennedy, G. Korony, S. Makl, J. Mevissen, R. Heistand, AVX Corporation
Integrated Spiral Transformers
Robert C. Frye, Peter R. Smith, Bell Laboratories, Lucent Technologies; Yeong J. Yoon, Yicheng Lu, Rutgers University
Distributed Microwave MCM-D Circuits for X- and K-Band Applications
Philip Pieters, Steven Brebels, Eric Beyne, IMEC
Wafer Level Packaging of Integrated Passive Devices on Glass
Sunil Wijeyesekera, D.H. Bolton, N. Patel, M. Cabusora, A. Jua, S. Liang, T. Sasgawa, H. Clearfield, Intarsia Corporation