NEPCON – East, June 1999
CPMT Speakers for the Wednesday Electro/IEEE-CPMT Symposium at Nepcon-East '99 June 14-16, 1999, in Boston, MA. The Advanced Microelectronics Components session is sponsored by the local IEEE/CPMT Society Boston Chapter - which has monthly meetings on state-of-the-art electronics packaging and manufacturing technologies as applied to all areas of computer & networking products. Contact the Chapter Chair for more information on Nepcon-East.

speakers:

CSP Technology Session

1.) James Forster - Texas Instruments, "CSP Burn-In
Socket Technology" (10:00 AM to 11:00 AM 6/15/99)

2.) Dino Santeusanio - AMP M/A - COM PB, "Bare Die Tape and Reel for High Volume Assembly" (11:00 AM to 12:00 PM 6/15/99)

3.) Vern Solberg - Tessera, "CSP Package Development" (1:30 PM - 2:30 PM 6/15/99)

4.) Ted Hannibal - IBIS Associates, Inc., "Cost Implications of CSP" (2:30 PM - 3:30 PM 6/15/99)

Thermal Management Session

5.) John Sofia - Analysis Tech, "The Fundamentals of Thermal Resistance Measurement" (1:30 PM - 2:00 PM)

6.) Dr. Bahman Tavossoli - Advanced Thermal Solutions, Inc, "Thermal Response of the Ultra-Performance BGA Heat Sink in Ducted and Unducted Flow Conditions .. An Experimental Investigation" (2:00 PM - 2:30 PM)

7.) Ramon Cajina - Flomerics, Inc., "Emerging Trends in Modeling IC Packages in CFD" (2:30 PM - 3:00 PM)

8.) David Lischner - Lucent Technologies, "A Review and Impact of JEDEC Standards for Thermally Characterizing Packaged IC's" (3:00 PM - 3:30 PM)