OFFICERS & BOARD OF GOVERNORS
Officers' email links
President--John Stafford, 1 602 413 5509
Tech VP--Rao Tummala, 1 404 894 9097
Admin VP--H. Anthony Chan, 1 732 957 6754
Treasurer--L. Merrill Palmer, 1 619 675 2889
VP Publication--Paul B. Wesling,1 408 285 9555
VP Conferences--James Morris, 1 607 777 4774
VP Education--Albert Puttlitz, FAX 802 879 0466
Sr. Past President--Dennis Olsen, 1 602 413 5673
Jr. Past President--Ralph Wyndrum, 732 420 2400
Secretary--Ron Gedney, 1 703 834 2084
Executive Director-- Marsha Tickman,
1 732 562 5529


  • Standing Committee Chairpeople
    Academic Affairs--Olgierd Palusinski
    Educational Activities-- L. Mann
    Distinguished Speakers-- A. F. Puttlitz
    Fellows Search--Rao Tummala
    Fellows--George G. Harman
    Constitution & Bylaws--David W. Palmer
    Finance--Ralph Wyndrum, Jr.
    Long Range Planning--Dennis Olsen
    Standards Chair - "Jack" Balde. 908 788 5190
    Circuits and Devices magazine Editor--Joe Brewer, 904 445 8971
    Membership--Ralph Russell, email: cpmt-membership@ieee.org
    Chapter Development--R. W. Russell, II, cpmt-membership@ieee.org
    Nominations--John Segelken, 1 803 939 2333

  • Next News Deadline:
    June 5 , 1999


  • CPMT SOCIETY NEWSLETTER
    EDITOR
    David W Palmer
    Org 1716, MS0874
    Sandia National Lab
    P.O. Box 5800
    Albuquerque, NM
    87185
    505 844 2138 .
    FAX 844 7011
    Send in your next story!

  • Composition: Amity Ming, Shirley Craig, Ginny Edmund

  • International Relations-- Leo Feinstein, 508 870 0051;
    Europe=Ephraim Suhir, 908 582 5301;
    Far East= W. T. Chen, 65 874 8110
    Joint Committee on Semiconductor Manufacturing--G. C. Cheek

  • Technical Committee Chairpeople
    TC webpages
    TC-1 Electrical Contacts, Connectors and Cables--
    Gerald Witter, 708 244 6025
    TC-2 Discrete and Integral Passive Components--T. Reynolds, Murata-Erie, 404 433 7825
    TC-3 IC and Package Assembly -- C. Koehler, 602 413 5663
    TC-4 Manufacturing Design & Process--Wyck Seelig, 908 771 2440
    TC-5 Materials--Rajen Chanchani, 505 844 3482
    TC-6 High Density Board Packaging--Connie D’Egidio, 954 958 6916
    TC-7 Environmental Stress & Reliability Test--Joseph Mantz, 425 702 2709
    TC-8 Semiconductor Processing & Manufacturing--John Reekstin,
    714 762 5077: Court Skinner, 408 453 9460
    TC-9 Thermal Management & Thermomechanical Design--
    Tony Mak, 508 853 5000
    TC-10 Fiber Optics & Photonics-- Michael Lebby, 717 985 2535
    TC-11 Electrical Test -- David Keezer, 404 894 4741
    TC-12 Electrical Design, Modeling and Simulation--
    Madhavan Swaminathan, 404 894 3340
    TC-13 Power Electronics Packaging--Doug Hopkins, 607 729 9949
    TC-14 Systems Packaging--Evan Davidson, 1 914 435 4810
    TC-15 New Technology Directions--Ephrain Suhir, 908 582 5301
    TC-16 RF and Wireless-- Craig Gaw, 602 413 5920
    TC-17 MEMS and Sensor Packaging-- Karen Markus, 919 248 1437
    TC-18 Wafer Level Packaging--Phil Garrou, 919 248 9261
    TC-19 Education--Rao Tummala, 404 894 9097

  • Representatives
    ABET Ad Hoc Visitors--W. Arthur Porter
    ECTC Coordinating Committee--C. P. Wong, 404 894 8391
    IEEE Press Liaison--Joe Brewer, 904 445 8971
    Intersociety Liaison--W. T. Chen, 65 874 8110
    MRS--
    IMAPS--Phil Garrou, 919 248 9261
    ASME--Ephraim Suhir, 908 582 5301, suhir@hogpa.att.com
    AVS--James Morris, 1 607 777 4774
    Solid State Circuits Council--Leslie J. Palkuti
    U. S. A. Pace Coordinator-- R. W. Wyndrum, Jr.
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