EPEP '99

8th Topical Meeting on Electrical Performance of Electronic Packaging

Sponsors: IEEE MTT and CPMT

October 25-27, 1999

Catamaran Resort Hotel, San Diego California

Co-Chairs; M. Swaminathan -- Georgia Tech; madhavan.swaminathan@ee.gatech.edu

Ravi Kaw -- Hewlett Packard; ravi_kaw@hp.com

Call for Papers

The general subject of the meeting is the electrical design, analysis, and characterization of electronic interconnections and packaging structures for performance-driven, high speed/high complexity electronic systems. A forum will be provided for the discussion of the following topics as they relate to chip-to-chip and on-chip interconnections in electronic systems:

• Package analysis, including numerical methods and algorithms; electro-magnetic analysis tools; advances in transmission-line techniques.
• RF/microwave packaging structures and their electrical performance.
• MMIC modules and high density packaging.
• Experimental characterization techniques and testing procedures
• EMC/EMI effects; prediction and measurement of radiation from inter-connect structures and packaged systems; EMI sources and novel solutions.
• Electrical requirements, limits of performance.
• Novel design methods, wire placement and routing systems.
• Electrical design implications for low cost, high volume packaging.
• Optoelectronic packaging; structure and system applications.
• Packaging concerns for wireless communication; design and modeling.
• Current and future issues related to on-chip interconnections; performance evaluation tool development.
• New and innovative interconnect and packaging structures and their electrical performance.
• Power distribution and package resonance; advances in modeling core switching noise, and design of novel solutions.

Paper Submission:

An original and 3 copies of a summary, not to exceed FOUR PAGES, in single-column format, including illustrations, are required for paper selection. In your cover letter, prioritize 3 key words that best represent your paper. The title of the paper and the names and affiliations of all authors, including complete mailing address, telephone, FAX number and e-mail must appear on the first page of the summary, as well as the 35 word abstract. Submission should be sent no later than July 9, 1999 to the following address:

Updated information about the conference can also be found on the web page at: http://intermix.engr.arizona.edu/~epd/#EPEP