International Electronics Manufacturing
Technology Symposium
IEMT
October 18-20, 1999, Austin Texas
The IEMT is an international forum on manufacturing technology
including papers on research, development, and applications of
manufacturing technology for electronic components, assemblies
and systems. It is the second largest IEEE/CPMT conference in
the US and is held in the US each fall and also annually in either
Japan or Europe.
The conference features technical sessions, panels and opportunities
to meet with experts in the area. The 1999 symposium will be run
concurrently with SEMICON Southwest, providing an excellent opportunity
to view the most recent manufacturing equipment and trends in
the semiconductor industry.
The Symposium is now solicting technical papers on current
unpublished work in the following broad areas:
- Advanced Interconnect Manufacturing: Flip Chip Technology
and Chip Scale Packaging, Micro-via substrates and laser vias,
BGA and CGA
- Semiconductor Manufacturing: Semiconductor Processing and
Manufacturing Analysis
- System Specific Packaging (OEM): Packaging and Interconnection
of high frequency devices, packaging and Interconnection of MEMs
devices, Automotive Electronics and Space/Military systems, Display
Manufacturing and Packaging, Optoelectronics
- Emerging Technologies: Design for Environment and Intelligent
Manufacturing, Silicon on Insulator (SOI), Si-Ge packages, Late-breaking
News on Emerging Technologies, Integrated Passive Components.
- Process Modeling and Control: Manufacturing Cost Reduction
and Cost Modeling, Manufacturing Cycle Time Reduction, Process
Optimization.
- Test and Reliablilty: Product/System Reliability and Testing
- Manufacturing Operations Improvement: Integrated Design and
Manufacturing, Manufacturing Management World wide, System Quality
and Product Integrity.
Abstracts of 250 words are expected by March 26, 1999 (late
ones may be accepted). Send to Yeon Kim at email [ykim@emi.org].