First Call for Papers

2nd Workshop on

Advances in Printed Circuit Board and Substrate Technologies Requirements for Flip Chip, CSP and BGA

June, 28 - 29, 1999, Berlin, Germany

The increasing demand for miniaturization and increased performance of electronic devices and products together with new generations of packages like Flip Chip, CSP, and BGAs cause a revolutionary challenge in PCB industry. Is the European PCB industry prepared to meet these challenges? Are high end substrate technologies like MCM-D and MCM-C becoming more competitive to PCB due to the increased technical requirements?

Workshop is organized by the German Chapter of the CPMT together with the PCB Magazine.

Topics:

• State of art of PCB Technology
• Built - up - Technology for PCB's
• MCM-D thinfirm substrates
• Rigid and flexible substrates
• Substrates for Flip Chip in Package and Flip Chip on Board
• New requirements for Microvia Technologies
• Alternative substrates to organic materials
• Final metallisation for Flip Chip and CSP
• Markets, trends and cost
• Fine line ligh density PCB's
• Multilayer ceramic substrate and MCM-C
• Fine Line Solder Mask Technology
• Equipment infrastructure, material infrastructure

Abstracts:

Authors are invited to submit a 100-200 word abstract describing recent work. Clearly describe the nature of the work, explain its significance and hightlight novel features. On the title page please indicate title, name and affiliation of all authors and suggested topics. Also identify a contact author and include a complete mailing address, e-mail-address, phone and fax number.

Send to:

Deadline for submission of abstracts: April 30, 1999

phone +49 30 467 815 - 55, FAX +49 30 467 815 - 51

Email: erlebach@pactech.de