First Call for Papers

Area Array Packaging Technologies

Workshop on Flip Chip and Ball Grid Arrays

Berlin Germany

November 15-17, 1999 after Productronica

Organizer: IEEE CPMT German Chapter --- Conference Chair: Dr. Elke Zakel, PacTech

Subjects:

Flip Chip FCOB and FCIP

• Bumping
• Low cost technologies
• Soldering, fluxless processes
• Adhesive bonding
• Underfill, encapsulation
• Flip Chip on glass
• Flip Chip on MCM-L, MCM-D and MCM-C substrates
• Flip chip on rigid and flexible printed wiring boards
• Assembly processes
• Compatibility to SMT
• Burn-in, test and repair
• Reliability
• Electrical and mechanical simulation
• Cost
• Applications
• Equipment

Chip Size Packages

• Packaging concepts
• Interconnection technology
• Performance
• Testing
• Molding encapsulation
• Applications and cost
• Reliability
• Inspection and testing
• Electrical and thermal performance
• Burn-in
• Equipment
• Reliability
• Standardization of packages and test methods
• Process control
• Yield issues
• Repair
• Applications

Ball Grid Array

• Design rules
• Plastic, ceramic, and tape BGA
• Assembly
• Single-chip and multi-chip packages
• Molding, encapsulation technology
• Advantages compared to FC assembly of bare die and BGA packages
• Cost markets

Paper Submission

Papers may be extended abstracts or full papers. In either case, clearly describe the nature of the work, explain its significance and highlight novel features. On the title page, please indicate title, name and affiliation of all authors, an abstract of 100 words and suggested topics. Also identify a contact author and include a complete mailing address, email address, phone and fax numbers.

Abstracts must be received by July 31, 1999. Authors will be notified of paper acceptance by end of August, 1999. The extended abstracts supplemented with up to four of your most important figures or full papers have to be submitted by September 30, 1999 and will be implemented in a conference handout which will be given to all attendees.

Send to:

Phone +49 30 467 815 - 55, Fax +49 30 467 815 - 51, email: erlebach@pactech.de