Call for Abstracts
Workshop on Accelerated Stress Testing - AST’99
October 26th, 27th, and 28th, 1999
Sheraton Colonial Hotel
Boston, Massachusetts
Sponsored by the IEEE Components, Packaging and Manufacturing Technology Society (TC-7), And Technically Cosponsored by IEEE Reliability Society
In addition to two days of technical presentations, this workshop will include a one-day tutorial from leaders in the field and a two-day exhibition featuring AST related suppliers.

Authors are invited to submit abstracts on a variety of topics related to Accelerated Stress Testing including the following targeted topics:
Advanced Approaches to AST Environmental Testing
Reliability Improvement Techniques
AST Data Collection/Analysis
Failure Analysis Techniques and Examples
Reliability Simulation and Prediction
Application of Physics of Failure Techniques
Stress Screening Techniques

Contributed Abstracts must be received, in English, by May 29th, 1999. Notification of acceptance will be provided by July 1st, 1999. All appropriate company and government clearances must be obtained prior to submission. Authors should submit their abstracts by the above date to the technical program chair via Email. Submissions should not exceed one page and should be submitted in a file format compatible with MS Word (WordPerfect, text, etc). Abstract title, author name(s), affiliation(s), phone number, mailing, and email address(es) should begin each Abstract. . A final copy of their manuscript or viewfoils is to be submitted by August 15th, 1999. Manuscripts should be submitted in MS word format while viewfoils should be submitted as MS PowerPoint files. Overhead, slide, and VCR facilities will be available for presenters.

Tutorial Topics Include:
Device fabrication and failure modes
Functional testing during AST
SMT PWB fabrication and failure modes
Design verification testing and AST
AST techniques and technologies
AST cost analysis
AST success stories
Alternative AST technologies and techniques
AST shortcomings
AST data collection and analysis
Vibration and thermal theory relevant to AST
Application of Physics of Failure techniques

For addition information, please contact one of the individuals shown on the right or see our web page at:
http://www.ewh.ieee.org/soc/cpmt/tc7/ast1999/

For comments on our web page please contact or web master Kirk Gray at: mailto:kirkgray@privatei.com

General Chair
T. Paul Parker
Lucent Technologies
(972) 284 2295
mailto:tpparker@lucent.com

Technical Program Chair
Mark Gibbel
JPL
818 542 6979
mailto:mark.gibbel@jpl.nasa.gov

Technical Program Vice Chair
Tony Chan
ATT Labs
732 420-1488
mailto:hachan@att.com

Technical Program Vice Chair
Simon Prakash
3COM
801-924-5365
mailto:sprakash@mhz.com

Technical Program Vice Chair
John Hess
QualMark
303-254-8800
mailto:jhess@qualmark.com

Finance/Past Proceedings Chair
Joe Mantz
ATT
425-702-2709
mailto:joe.mantz@attws.com

Exhibitor Chair
Dennis Pachucki
Compaq
408 285 5316
mailto:dennis.pachucki@compaq.com

Publicity & Registration Chair
Kirk Gray
AcceleRel Engineering, Inc.
303 666-7692
mailto:kirkgray@privatei.com

Local Co-hosts
Gene Bridgers
Pacific Scientific
978 988 9887
mailto:gene_bridgers@atg.pacsci.com

Harry Saraidaridis
Lucent Technologies
978-960-6248
mailto:saraidaridis@lucent.com