CPMT Board of Governors Meets after ECTC
With the victory of ECTC still fresh, 35 of your volunteers spend Saturday, June 5, planning your Society’s future.
Each IEEE Society has a "Field of Interest Statement." The CPMT field was changed to express the years of growing activities the packaging of micro-optics, micro-mechanics, and bioelectronics. Other societies vote on this Statement to make sure we complement each other and not compete.
The New Financial Model for IEEE is being constructed. Part of the motivation is that Corporate IEEE has a $6 million deficit each year that is eating away at the endowment. In contrast, the Societies (having no endowment) have learned to live within their means and have developed surpluses. The mood of the group was that only activities that pay for themselves should be sustained at the corporate level; the rest is an empire built without foundation. In the worst case scenario, CPMT members would pay $50 each against this debt (it would be paid from the
CPMT reserves, not from members wallets…but it is a tax however gentle)
There was a discussion on Streamlining. Essentially there is an attempt to have IEEE-USA made more distant from the global mother society, IEEE. Most countries have their own EE association, and do not have confusion about what IEEE and their country's association stands for. Apparently when IEEE-USA makes policy statements, many citizens confuse this with all of IEEE.
Branding was the third high level issue discussed. Apparently people confuse the many different Society logos. Since IEEE has a lot of value in their "right hand rule" logo, it was strongly recommended at the BOG meeting that this logo be kept and that CPMT use this logo (with our own) on all our publication material. Also IEEE will probably become our name rather than "Institute…."
Paul Wesling reported for TC-19 Education. This year 10 ECTC papers/proposals were presented for improved educational material for our members. Probably 5 of these will be selected to receive CPMT and NSF grant money. This material will appear on the Internet so all CPMT members can easily continue their education. A web site where courses and consultation discussions can take place between members is envisioned. (See article elsewhere in this Newsletter). Paul Stafford pointed out that as more engineers work for "Virtual Companies" it would be important for CPMT to offer members a path to continued education.
Phil Garrou, Chair of TC-18, described their first meeting. There are 15 members representing organizations involved in Wafer Level Packaging around the world. This TC helps put on 4 Conferences and currently has 12 reviewed manuscripts for a special transaction in autumn.
Rajen Chanchani, Chair TC-5 Materials and Processes, held a meeting at ECTC with 15 of his members. This TC support ECTC, the Materials Atlanta Symposium, and the Adhesion Conference. Rajen is working with many companies to make the 15,000 pages of materials properties gathered over many years in the CINDAS database available to CPMT members.
Craig Gaw, Chair TC-16 RF and Wireless, held a meeting June 4 for 12 members including 3 from Europe. Their goals are to get a website going, support sessions at ECTC2000, and have a special section in the newsletter.
Jack Balde, Chair TC-14, reported on the success of the last 3 System packaging workshops. This year attendance was up by 50%. Reserves of $5K/workshop were gained.
Mike McShane of the ECTC committee described how ECTC is meeting the request for new technology at their conferences. First he will combine and broaden the scope of the ECTC subcommittees. He will rotate the chairs every 2 years to get new perspectives. The linkages between CPMT TCs and ECTC subcommittees will be better defined. In particular the chairs will belong automatically to the other group. These upgrades will start appearing in the July 15 Call for Papers. It is always a challenge on how to add the exciting new work while still doing justice to the improving old topics.
Rao Tumalla, VP Technology, announced that the TC guide is about 70% finished and will be distributed by the end of the year.
Bill Sherry, Chair TC-10 Fiber Optics & Photonics, described his field as one that expands by 25% each year. He is trying to develop good synergy with the other TCs so not much duplication occurs. He has 28 members in the TC. They are supporting the Vail Colorado workshop in September (see article). They sponsored 36 papers at this ECTC with focus on micro-optics packaging. The theme for next year will be "low cost".
Tony Mak, Chair TC-9 Thermal Management and Thermal Mechanical Design, met on June 3rd. This TC sponsors Semi-Therm, Itherm, ICT, and Thermic Symposium.
Kanji Otsuka announced that the Japan IEMT ’99 was a success with 360 attendees, 62 from abroad. This represented a slight increase in participation over previous years. He distributed fliers for the upcoming January Computer Packaging workshop and the April IEMT/IMC meeting.
Paul Wesling, VP Publications, proposed that a CD-ROM set be prepared that would have 50 years of the "CPMT Transactions" This would be a service to our members, allowing quick searches of the literature in our fields. The total cost would probably be $100K with much of it recovered as the copies were sold to members and libraries. At least 5 other societies have done this with great praise from members.
Ralph Russell, Chair Memberships and Chapter Development, announced that there are now 31 local CPMT Chapters in the world. The new Hungarian/Romanian chapter is the latest. Ralph held a Chapter Chair meeting on June 1 with good attendance. He announce the Santa Clara Valley Chapter as winner of the "Chapter of the Year" award. He stated next years membership thrust would be globalization, chapter support, student and young engineers, and support by industry.
In celebration of the 50th year of our Society, funds were made available to get 50-year wall charts, banners, society display panel, commemorative jackets for past presidents, and history booklets for members.
Tony Chan, VP administration, pointed out that although we are a relatively small IEEE society, we support as many meetings and publications as those 10 times bigger. The difference is that we have a higher percentage of active volunteers and long term volunteers. He stressed that the difference in registration fee between IEEE members and non-members must be 25% or greater. We should use this difference to encourage people to join ahead of time thus incurring no additional expense.
This year was active for the Fellow Committee. Eight members were written up and presented to the IEEE committee. Historically about 50-60% make the cut.
Jim Morris, VP Conferences, reported that all 1996 and 1997 CPMT meetings had been closed out. This is important because IEEE is now charging for meetings that have books open well after the meeting occurred. Jim held a Conference Chair workshop on June 3. This meeting may become an annual event given its usefulness.
Larry Mann described this year’s Motorola fellowship competition. There were 11 applicants, 2 overseas. From this 8 finalists were chosen to give their papers at ECTC in competition. Daoqiang Lu with "Mechanisms Underlying the Unstable Contact Resistance of Conductive Adhesives" was this year’s winner. The work was done at Georgia Tech. Travel for the students was financed by CPMT totaling $9500 this year.
Al Puttlitz, VP Education, described the successful short courses this year. 384 attended the 10 classes. This is a 5% increase over last year. The largest class was 64 and the smallest 16. CEU credits were given to the students. Once again there were many (84) walk-ins. Its great but required a lot of emergency copying of the course notes. Next year 4 new courses are anticipated with some replacing old course.