Announcing and Call for Papers

2000 IEMT/IMC Symposium

and 14th Microelectronics Show

Omiya Sonic City (near Tokyo), JAPAN

April 19-21, 2000

The Largest International Microelectronics Technology Symposium and Exhibition in Japan

Sponsored by IMAPS Japan and IEEE/CPMT Japan Chapter

Abrstracts of 500 words by October 9, 1999

Symposium Subjects

• Area Array Packages
• Flip Chip
• BGA, CSP
• Chip Underfill
• Built-up Substrates
• Materials
• Substrate Via Technology
• Bump Formation
• Interconnection
• Substrate Pattern Design
• Manufacturing
• Plating
• Pb Free Solder
• Technology Trends

For More Information Contact

Secretariat

IMAPS Japan

Nishiogikita 3-12-2, Suginami-ku

Tokyo 167-0042, Japan

Tel: +81 3 5310 2010

Fax: +81 3 5310 211

email: IMAPS@ruby.famille.ne.jp

homepage: http://wwwe.ruby.famille.ne.jp/~jiep/00sympo/00sympo.html