Report from Japan
1999 IEMT/IMC Symposium for April 21 to 23 at Omiya Sonic City Hall was successfully held. This was sponsored by the Japan Institute of Electronics Packaging (JIEP) and organized by both IMAPS Japan and IEEE CPMT Tokyo Chapter.
In overview there were 50 papers from Japan and 24 from overseas. The attendance of 360 included 62 from abroad. Young engineers dedicated much attention to this symposium, in part encouraged by the CPMT effort with the IEEE Young Engineer Award. In general, this symposium has been a good opportunity to announce Japanese electronics packaging technologies which represent the most advanced use of the thin-light-small concept. We will continue to promote this theme in the future symposiums.
Future aspect of Japanese activities is as follows:
January 2000, Computer packaging workshop at Hikone.
April 2000, IEMT/IMC Symposium at Omiya Sonic City Hall
December 2000, 5th VLSI Packaging Workshop of Japan at Kyoto Kokusai Hotel
The VLSI Workshop is held every other year in Japan. It’s convenient to attend this workshop because SEMICON Japan will be held the same week and EPTC Singapore will be the following week.
There is a trend that many other Japanese conferences are picking up packaging technology in their sessions. This includes the international meetings such as the SSDM ’99 sponsored by Japan Society of Applied Physics with the session of System-level Packaging Technologies. — by Kanji Otsuka