Announcing the 2nd Annual

IEEE-CPMT/ ASME/ SPE / SPIE/ MRS/ AFM/ SF2M Workshop (POLY'99)
" POLYMERIC MATERIALS FOR MICROELECTRONICS & PHOTONICS APPLICATIONS:
MECHANICS, PHYSICS, RELIABILITY, PROCESSING"
Paris, France / December 12-15, 1999

Sponsored by the IEEE Components, Packaging & Manufacturing Technology Society (IEEE-CPMT); American Society of Mechanical Engineers (ASME International), in Cooperation with the Society of Plastics Engineers (SPE); Materials Research Society (MRS); Society for Optical Engineering (SPIE); Association Francaise de Mecanique (AFM); Société Française de Métallurgie et de Matériaux (SF2M)

CALL FOR PAPERS
www.asme.org/conf/POLY99/index.htm

WORKSHOP:
Polymeric materials are widely used in engineering, including the areas of microelectronics and photonics. Examples are: plastic packages of integrated circuit (IC) devices, adhesives, various enclosures and plastic parts, polymeric coatings of optical silica fibers, and even polymeric lightguides. There are numerous and rapidly growing opportunities for the application of polymers for diverse functions in the "high-technology" field. Polymeric materials are inexpensive and lend themselves easily to processing and mass production techniques. The reliability of these materials, however, is usually not as high as the reliability of inorganic materials and is often insufficient for particular applications, thereby limiting the area of the technical use of polymers. We intend to bring together mechanical, electrical, optical, reliability, industrial and manufacturing engineers; materials scientists, applied physicists and chemists, to discuss and advance experimental and theoretical methods, techniques and approaches aimed at the prediction and improvement of the short/long-term performance of polymeric materials for different applications, and particularly those used in plastic packages of IC devices.

OBJECTIVE:
The objective of the workshop is to address the state-of-the-art knowledge in the field of mechanics, physics and reliability of polymers employed in microelectronics and photonics engineering.

SCOPE:
The scope of the workshop includes, but is not limited to, the following major topics:

Mechanical behavior and short and long-term performance of
polymeric materials;
Polymeric materials characterization;
Thermal, mechanical, electrical, optical and other properties of
polymers;
Fracture mechanics of polymeric materials;
Moisture sensitivity of polymeric materials and plastic packages
of IC devices;
Organic microelectronics;
Polymer lightguides;
Polymers for wireless applications;
Aging and its effects on the long-term reliability of polymeric
materials;
Thermal and electric field effects on damage and fracture of
polymeric materials;
Accelerated testing of polymeric materials and plastic electronic
packages: approaches and techniques;
Mechanics, physics and chemistry of adhesion, adhesives and
adhesively bonded joints;
Stress concentration effects in polymeric materials and plastic
electronic packages;
Performance of polymeric materials at high/low temperatures
and in harsh environments;
Role of fillers in the mechanical behavior and performance of
polymeric materials;
Thermal management of systems employing polymeric materials
(including electronic components and photonic devices);
Interfacial phenomena affecting the polymeric materials
reliability;
Response of polymeric materials to dynamic and thermal
loading;
Manufacturing processes in plastics engineering;
Reliability problems associated with manufacturing, testing,
surface-mounting and operation of plastic electronic
packages.
New and emerging technologies for future electronic and
photonic systems.

WORKSHOP ORGANIZERS: E.Suhir, Bell Laboratories, USA; B.Michel, Fraunhofer Institute, Germany; Y.Koike, Keio University, Japan; J. Lu, Universite de Technologie de Troyes, France;

TECHNICAL COMMITTEE, INTERNATIONAL LIAISONS, KEY-NOTE AND INVITED SPEAKERS (Preliminary and Partial List): D. Agonafer, IBM, USA; A. Chudnovsky, University of Illinois at Chicago, USA; L. Dhar, Lucent Technologies, USA; R. Dudek, Fraunhofer Institute, Germany; C. Feger, IBM, USA; G. Harman, NIST, USA; K. Kishimoto, Tokyo Institute of Technology, Japan;D. Ingman, Technion, Israel; T. Ishigure, Keio University, Yokohama, Japan; L. Keer, Northwestern University, USA; Y. Koike, Keio University, Japan; A. Lin, PackTech, Taiwan; J. Liu, Institute for Production Engineering Research, Sweden; J. Lu, Universite de Technologie de Troyes, France; B-J. Lwo, Chung-Cheng Institute of Technology, Taiwan; S. Matsuoka, Brooklyn Polytechnic University, USA; J. Morris, Binghamton University, USA; B. Michel, Fraunhofer Institute, Germany; O. Nalamasu, Lucent Technologies; M. Pecht, University of Maryland, USA; X. Quan, Lucent Technologies, USA; J. Stafford, Motorola,USA; E. Suhir, Lucent Technologies, USA; A.Tay, National University of Singapore, Singapore; M.Taya, Washington University, USA; B. Thakkar, Lucent, USA; P.Wiltzius, Lucent Technologies, USA; C.P. Wong, Georgia Institute of Technology, USA; R. Wool, University of Delaware, USA; R. Wyndrum , AT&T Laboratories, USA, S. Yi, Nanyang Technological University, Singapore; G. Zaikov, Russian Academy of Sciences, Russia.

TUTORIALS:
The program of the workshop will include tutorials (short courses) on various aspects of the reliability of polymeric materials for microelectronics and photonics applications. The (partial) list of tutorials includes:
Failures in Plastic Packages of IC Devices: Understanding, Prediction and Prevention / Instructor: Ephraim Suhir, Lucent Technologies, USA
Polymers for Electronic Packaging: Materials, Processes and Reliability / Instructors: C.P. Wong, Georgia Tech, E.Suhir, Lucent Technologies, USA
Adhesives in Electronic Packaging/ Instructors: J.Morris, SUNY-Binghamton, USA, J. Liu, IVF, Sweden
Application of Computational Heat Transfer to Thermal Management of Plastic Packages of IC Devices/Instructor: Dereje Agonafer, IBM, USA
Reliability and Lifetime Assessments for Polymeric Materials/ Instructor: A. Chudnovsky, University of Illinois at Chicago, USA

AUDIENCE:
Engineers and scientists dealing with, and/or interested in the mechanical reliability of polymeric materials, especially those used in the "high-technology" field.

SUBMISSION OF ABSTRACTS:
Prospective authors should submit a 300-word abstract (with complete business/e-mail addresses, and phone/fax numbers) by July 1, 1999 to the following workshop paper coordinator:

TECHNICAL PAPER COORDINATOR
ASME International
Three Park Avenue
New York, NY 10016
Fax: 212.591.7856
e-mail: poly99@asme.org

www.asme.org/conf/POLY99/index.htm

Deadlines:
Electronic and Hard Copy Submission of Paper Abstract: July 1, 1999
Author Notifications of Abstract Acceptance: July 15, 1999
Full Paper Submission: August 1, 1999
Acceptance Notifications: August 15, 1999
Revised Paper Submission: September 1, 1999

Visit the ASME/POLY'99 web site for hotel information;
program announcements, updates and abstract submission guidelines.
www.asme.org/conf/POLY99/index.htm
or contact: Brian Bigalke, Meetings & Conferences, ASME International, Tel: 212.591.7057 / Fax: 212.591.7856 / Email: bigalkeb@asme.org