TC-6 High Density Packaging
Chair Connie S. Swager ( email@example.com ) held a committee meeting during the June ECTC San Diego conference. The strategy for this new TC was defined:
Review emerging High Density Packaging parameters, i.e. size, I/o, performance, etc., and assess validity of packaging (BGA, CSP) standardization.
All interested readers should contact either John Segelken
( firstname.lastname@example.org ) or Raj Master ( email@example.com
) with any pertinent data you have to help pursue the strategy.
-- by Connie Swager