TC-6 High Density Packaging
Chair Connie S. Swager ( swager@us.ibm.com ) held a committee meeting during the June ECTC San Diego conference. The strategy for this new TC was defined:

Review emerging High Density Packaging parameters, i.e. size, I/o, performance, etc., and assess validity of packaging (BGA, CSP) standardization.

All interested readers should contact either John Segelken ( jsegelken@lucent.com ) or Raj Master ( raj.master@amd.com ) with any pertinent data you have to help pursue the strategy. -- by Connie Swager