OFFICERS & BOARD OF GOVERNORS
President--John Stafford, 1 602 413 5509
Tech VP--Rao Tummala, 1 404 894 9097
Admin VP--H. Anthony Chan, 1 732 957 6754
Treasurer--L. Merrill Palmer, 1 619 675 2889
VP Publication--Paul B. Wesling,1 408 285 9555
VP Conferences--James Morris, 1 607 777 4774
VP Education--Albert Puttlitz, FAX 802 879 0466
Sr. Past President--Dennis Olsen, 1 602 413 5673
Jr. Past President--Ralph Wyndrum, 908 949 7409
Secretary--Ron Gedney, 1 703 834 2084
Executive Director-- Marsha Tickman, 1 732 562 5529

Elected Members at Large

1999

• James E Billigmeier
• Harry K.Charles, Jr.
• Darvin R. Edwards
• Philip E. Garrou
• Wulf Knausenberger
• Ephraim Suhir

2001

• Corey A. Koehler
• Michael Lebby
• Kanji Otsuka
• Leonard W. Schaper
• Connie Swager
• Elke Zakel

2000

• William Chen
• Craig Gaw
• Tony W. C. Mak
• Larry Mann
• John Segelken
• C. P. Wong

Standing Committee Chairpeople
Academic Affairs--Olgierd Palusinski
Educational Activities-- L. Mann
Distinguished Speakers-- A. F. Puttlitz
Fellows Search--Rao Tummala
Fellows--George G. Harman
Constitution & Bylaws--David W. Palmer
Finance--Ralph Wyndrum, Jr.
Long Range Planning--Dennis Olsen
Standards Chair - "Jack" Balde. 908 788 5190
Circuits and Devices magazine Editor--Joe Brewer, 904 445 8971
Membership--Ralph Russell, email: cpmt-membership@ieee.org
Chapter Development--R. W. Russell, II, cpmt-membership@ieee.org
Nominations--John Segelken, 1 803 939 2333

International Relations-- Leo Feinstein, 508 870 0051;

Europe=Ephraim Suhir, 908 582 5301;

Far East= W. T. Chen, 65 874 8110
Publicity--
Joint Committee on Semiconductor Manufacturing--G. C. Cheek
Technical Committee Chairpeople
TC-1 Electrical Contacts, Connectors and Cables-- Gerald Witter, 708 244 6025
TC-2 Discrete and Integral Passive Components--T. Reynolds, Murata-Erie, 404 433 7825
TC-3 IC and Package Assembly -- C. Koehler, 602 413 5663
TC-4 Manufacturing Design & Process--Wyck Seelig, 908 771 2440
TC-5 Materials--Rajen Chanchani, 505 844 3482
TC-6 High Density Board Packaging--Connie D’Egidio, 954 958 6916
TC-7 Environmental Stress & Reliability Test--Joseph Mantz, 425 702 2709
TC-8 Semiconductor Processing & Manufacturing--John Reekstin, 714 762 5077: Court Skinner, 408 721 7420
TC-9 Thermal Management & Thermomechanical Design-- Tony Mak, 508 853 5000
TC-10 Fiber Optics & Photonics-- Michael Lebby, 717 985 2535
TC-11 Electrical Test -- David Keezer, 404 894 4741
TC-12 Electrical Design, Modeling and Simulation-- Madhavan Swaminathan, 404 894 3340
TC-13 Power Electronics Packaging--Doug Hopkins, 607 729 9949
TC-14 Systems Packaging--Evan Davidson, 1 914 435 4810
TC-15 New Technology Directions--Ephrain Suhir, 908 582 5301
TC-16 RF and Wireless-- Craig Gaw, 602 413 5920
TC-17 MEMS and Sensor Packaging-- Karen Markus, 919 248 1437
TC-18 Wafer Level Packaging--Phil Garrou, 919 248 9261
TC-19 Education--Rao Tummala, 404 894 9097
Representatives
ABET Ad Hoc Visitors--W. Arthur Porter
ECTC Coordinating Committee--C. P. Wong, 404 894 8391
IEEE Press Liaison--Joe Brewer, 904 445 8971
Intersociety Liaison--W. T. Chen, 65 874 8110
MRS--
IMAPS--Phil Garrou, 919 248 9261
ASME--Ephraim Suhir, 908 582 5301, suhir@hogpa.att.com
AVS--James Morris, 1 607 777 4774