Announcing the 2nd Annual
IEEE-CPMT/ ASME/ SPE / SPIE/ MRS/ AFM/ SF2M Workshop (POLY'99)
POLYMERIC MATERIALS FOR MICROELECTRONICS
& PHOTONICS APPLICATIONS: MECHANICS, PHYSICS, RELIABILITY,
PROCESSING
Paris, France / December 12-15, 1999
OBJECTIVE:
The objective of the workshop is to address the state-of-the-art
knowledge in the field of mechanics, physics and reliability of
polymers employed in microelectronics and photonics engineering.
SCOPE:
The scope of the workshop includes, but is not limited to, the
following major topics:
Mechanical behavior and short and long-term performance of polymeric
materials; Polymeric materials characterization;
Thermal, mechanical, electrical, optical and other properties
of polymers; Fracture mechanics of polymeric materials;
Moisture sensitivity of polymeric materials and plastic packages
of IC devices; Organic microelectronics; Polymer lightguides;
Polymers for wireless applications; Aging and its effects on the
long-term reliability of polymeric materials; Thermal and electric
field effects on damage and fracture of polymeric materials; Accelerated
testing of polymeric materials and plastic electronic packages:
approaches and techniques; Mechanics, physics and chemistry of
adhesion, adhesives and adhesively bonded joints; Stress concentration
effects in polymeric materials and plastic electronic packages;
Performance of polymeric materials at high/low temperatures and
in harsh environments; Role of fillers in the mechanical behavior
and performance of polymeric materials; Thermal management of
systems employing polymeric materials (including electronic components
and photonic devices); Interfacial phenomena affecting the polymeric
materials reliability; Response of polymeric materials to dynamic
and thermal loading;
Manufacturing processes in plastics engineering; Reliability problems
associated with manufacturing, testing, surface-mounting and operation
of plastic electronic packages.
New and emerging technologies for future electronic and photonic
systems.
WORKSHOP ORGANIZORS: E.Suhir, Bell Laboratories, USA; B.Michel,
Fraunhofer Institute, Germany; Y.Koike, Keio University, Japan;
J. Lu, Universite de Technologie de Troyes, France;
TUTORIALS:
The program of the workshop will include tutorials (short courses)
on various aspects of the reliability of polymeric materials for
microelectronics and photonics applications.
Application of Computational Heat Transfer to Thermal Management
of Plastic Packages of IC Devices/
Reliability and Lifetime Assessments for Polymeric Materials
Failure of IC Plastic Packages
Polymers for Electronic Packaging
Adhesives in Electronic Packaging
For registration or more information, go to the web.
www.asme.org/conf/POLY99/index.htm